Copper metallization on silicon power devices for heavy copper wire-bonding:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
Aachen
Shaker Verlag
2016
|
| Schriftenreihe: | Berichte aus der Elektrotechnik
|
| Schlagworte: | |
| Online-Zugang: | Abstract Inhaltsverzeichnis |
| Beschreibung: | XIV, 201 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 323 g |
| ISBN: | 9783844049312 3844049312 |
Internformat
MARC
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|---|---|---|---|
| 001 | BV044207551 | ||
| 003 | DE-604 | ||
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| 100 | 1 | |a Gross, David |e Verfasser |0 (DE-588)112665891X |4 aut | |
| 245 | 1 | 0 | |a Copper metallization on silicon power devices for heavy copper wire-bonding |c David Gross |
| 264 | 1 | |a Aachen |b Shaker Verlag |c 2016 | |
| 300 | |a XIV, 201 Seiten |b Illustrationen, Diagramme |c 21 cm x 14.8 cm, 323 g | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Berichte aus der Elektrotechnik | |
| 502 | |b Dissertation |c Technische Universität Berlin |d 2016 | ||
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| 650 | 0 | 7 | |a Mikrostruktur |0 (DE-588)4131028-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Dickdrahtbonden |0 (DE-588)1128083833 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Metallisieren |0 (DE-588)4169599-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Einflussgröße |0 (DE-588)4209283-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Strombelastung |0 (DE-588)4207718-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Degradation |g Technik |0 (DE-588)4206992-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Diffusionsbarriere |0 (DE-588)4289693-9 |2 gnd |9 rswk-swf |
| 653 | |a Copper | ||
| 653 | |a Metallization | ||
| 653 | |a Wire | ||
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Leistungshalbleiter |0 (DE-588)4167286-0 |D s |
| 689 | 0 | 1 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 0 | 2 | |a Kupfer |0 (DE-588)4033734-0 |D s |
| 689 | 0 | 3 | |a Metallisieren |0 (DE-588)4169599-9 |D s |
| 689 | 0 | 4 | |a Dickdrahtbonden |0 (DE-588)1128083833 |D s |
| 689 | 0 | 5 | |a Mikrostruktur |0 (DE-588)4131028-7 |D s |
| 689 | 0 | 6 | |a Einflussgröße |0 (DE-588)4209283-8 |D s |
| 689 | 0 | 7 | |a Strombelastung |0 (DE-588)4207718-7 |D s |
| 689 | 0 | 8 | |a Diffusionsbarriere |0 (DE-588)4289693-9 |D s |
| 689 | 0 | 9 | |a Degradation |g Technik |0 (DE-588)4206992-0 |D s |
| 689 | 0 | |5 DE-604 | |
| 710 | 2 | |a Shaker Verlag |0 (DE-588)1064118135 |4 pbl | |
| 856 | 4 | |u http://verlag.tu-berlin.de/abstracts/diss/gross_david_abstract.pdf |3 Abstract | |
| 856 | 4 | |u http://verlag.tu-berlin.de/abstracts/diss/gross_david_inhalt.pdf |3 Inhaltsverzeichnis | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029613928 | ||
Datensatz im Suchindex
| _version_ | 1804177347697442816 |
|---|---|
| any_adam_object | |
| author | Gross, David |
| author_GND | (DE-588)112665891X |
| author_facet | Gross, David |
| author_role | aut |
| author_sort | Gross, David |
| author_variant | d g dg |
| building | Verbundindex |
| bvnumber | BV044207551 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)975241450 (DE-599)DNB1120138361 |
| dewey-full | 621.3 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3 |
| dewey-search | 621.3 |
| dewey-sort | 3621.3 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Thesis Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV044207551 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:46:38Z |
| institution | BVB |
| institution_GND | (DE-588)1064118135 |
| isbn | 9783844049312 3844049312 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029613928 |
| oclc_num | 975241450 |
| open_access_boolean | |
| owner | DE-83 DE-526 |
| owner_facet | DE-83 DE-526 |
| physical | XIV, 201 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 323 g |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | Shaker Verlag |
| record_format | marc |
| series2 | Berichte aus der Elektrotechnik |
| spelling | Gross, David Verfasser (DE-588)112665891X aut Copper metallization on silicon power devices for heavy copper wire-bonding David Gross Aachen Shaker Verlag 2016 XIV, 201 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 323 g txt rdacontent n rdamedia nc rdacarrier Berichte aus der Elektrotechnik Dissertation Technische Universität Berlin 2016 Leistungshalbleiter (DE-588)4167286-0 gnd rswk-swf Kupfer (DE-588)4033734-0 gnd rswk-swf Mikrostruktur (DE-588)4131028-7 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Dickdrahtbonden (DE-588)1128083833 gnd rswk-swf Metallisieren (DE-588)4169599-9 gnd rswk-swf Einflussgröße (DE-588)4209283-8 gnd rswk-swf Strombelastung (DE-588)4207718-7 gnd rswk-swf Degradation Technik (DE-588)4206992-0 gnd rswk-swf Diffusionsbarriere (DE-588)4289693-9 gnd rswk-swf Copper Metallization Wire (DE-588)4113937-9 Hochschulschrift gnd-content Leistungshalbleiter (DE-588)4167286-0 s Silicium (DE-588)4077445-4 s Kupfer (DE-588)4033734-0 s Metallisieren (DE-588)4169599-9 s Dickdrahtbonden (DE-588)1128083833 s Mikrostruktur (DE-588)4131028-7 s Einflussgröße (DE-588)4209283-8 s Strombelastung (DE-588)4207718-7 s Diffusionsbarriere (DE-588)4289693-9 s Degradation Technik (DE-588)4206992-0 s DE-604 Shaker Verlag (DE-588)1064118135 pbl http://verlag.tu-berlin.de/abstracts/diss/gross_david_abstract.pdf Abstract http://verlag.tu-berlin.de/abstracts/diss/gross_david_inhalt.pdf Inhaltsverzeichnis |
| spellingShingle | Gross, David Copper metallization on silicon power devices for heavy copper wire-bonding Leistungshalbleiter (DE-588)4167286-0 gnd Kupfer (DE-588)4033734-0 gnd Mikrostruktur (DE-588)4131028-7 gnd Silicium (DE-588)4077445-4 gnd Dickdrahtbonden (DE-588)1128083833 gnd Metallisieren (DE-588)4169599-9 gnd Einflussgröße (DE-588)4209283-8 gnd Strombelastung (DE-588)4207718-7 gnd Degradation Technik (DE-588)4206992-0 gnd Diffusionsbarriere (DE-588)4289693-9 gnd |
| subject_GND | (DE-588)4167286-0 (DE-588)4033734-0 (DE-588)4131028-7 (DE-588)4077445-4 (DE-588)1128083833 (DE-588)4169599-9 (DE-588)4209283-8 (DE-588)4207718-7 (DE-588)4206992-0 (DE-588)4289693-9 (DE-588)4113937-9 |
| title | Copper metallization on silicon power devices for heavy copper wire-bonding |
| title_auth | Copper metallization on silicon power devices for heavy copper wire-bonding |
| title_exact_search | Copper metallization on silicon power devices for heavy copper wire-bonding |
| title_full | Copper metallization on silicon power devices for heavy copper wire-bonding David Gross |
| title_fullStr | Copper metallization on silicon power devices for heavy copper wire-bonding David Gross |
| title_full_unstemmed | Copper metallization on silicon power devices for heavy copper wire-bonding David Gross |
| title_short | Copper metallization on silicon power devices for heavy copper wire-bonding |
| title_sort | copper metallization on silicon power devices for heavy copper wire bonding |
| topic | Leistungshalbleiter (DE-588)4167286-0 gnd Kupfer (DE-588)4033734-0 gnd Mikrostruktur (DE-588)4131028-7 gnd Silicium (DE-588)4077445-4 gnd Dickdrahtbonden (DE-588)1128083833 gnd Metallisieren (DE-588)4169599-9 gnd Einflussgröße (DE-588)4209283-8 gnd Strombelastung (DE-588)4207718-7 gnd Degradation Technik (DE-588)4206992-0 gnd Diffusionsbarriere (DE-588)4289693-9 gnd |
| topic_facet | Leistungshalbleiter Kupfer Mikrostruktur Silicium Dickdrahtbonden Metallisieren Einflussgröße Strombelastung Degradation Technik Diffusionsbarriere Hochschulschrift |
| url | http://verlag.tu-berlin.de/abstracts/diss/gross_david_abstract.pdf http://verlag.tu-berlin.de/abstracts/diss/gross_david_inhalt.pdf |
| work_keys_str_mv | AT grossdavid coppermetallizationonsiliconpowerdevicesforheavycopperwirebonding AT shakerverlag coppermetallizationonsiliconpowerdevicesforheavycopperwirebonding |