Microelectronics failure analysis: desk reference
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
Materials Park, Ohio
ASM International
c2011
|
| Edition: | 6th ed |
| Subjects: | |
| Item Description: | Includes bibliographical references and indexes |
| Physical Description: | xi, 660 p. |
| ISBN: | 161503725X 9781615037254 9781615037261 |
Staff View
MARC
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| 245 | 1 | 0 | |a Microelectronics failure analysis |b desk reference |c edited by Richard J. Ross |
| 250 | |a 6th ed | ||
| 264 | 1 | |a Materials Park, Ohio |b ASM International |c c2011 | |
| 300 | |a xi, 660 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and indexes | ||
| 505 | 0 | |a section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information | |
| 650 | 4 | |a Electronics |x Materials |x Testing |v Handbooks, manuals, etc | |
| 650 | 4 | |a Microelectronics |x Materials |x Testing |v Handbooks, manuals, etc | |
| 650 | 4 | |a Microelectronics |x Materials |x Defects |v Handbooks, manuals, etc | |
| 650 | 4 | |a Electronic apparatus and appliances |x Testing |v Handbooks, manuals, etc | |
| 650 | 4 | |a Semiconductors |x Defects |v Handbooks, manuals, etc | |
| 700 | 1 | |a Ross, Richard J. |e Sonstige |4 oth | |
| 912 | |a ZDB-30-PAD | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029589214 | ||
Record in the Search Index
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| contents | section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information |
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| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 6th ed |
| format | Electronic eBook |
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| id | DE-604.BV044182369 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:46:00Z |
| institution | BVB |
| isbn | 161503725X 9781615037254 9781615037261 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029589214 |
| oclc_num | 923571038 |
| open_access_boolean | |
| physical | xi, 660 p. |
| psigel | ZDB-30-PAD |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | ASM International |
| record_format | marc |
| spelling | Microelectronics failure analysis desk reference edited by Richard J. Ross 6th ed Materials Park, Ohio ASM International c2011 xi, 660 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and indexes section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information Electronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Defects Handbooks, manuals, etc Electronic apparatus and appliances Testing Handbooks, manuals, etc Semiconductors Defects Handbooks, manuals, etc Ross, Richard J. Sonstige oth |
| spellingShingle | Microelectronics failure analysis desk reference section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information Electronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Defects Handbooks, manuals, etc Electronic apparatus and appliances Testing Handbooks, manuals, etc Semiconductors Defects Handbooks, manuals, etc |
| title | Microelectronics failure analysis desk reference |
| title_auth | Microelectronics failure analysis desk reference |
| title_exact_search | Microelectronics failure analysis desk reference |
| title_full | Microelectronics failure analysis desk reference edited by Richard J. Ross |
| title_fullStr | Microelectronics failure analysis desk reference edited by Richard J. Ross |
| title_full_unstemmed | Microelectronics failure analysis desk reference edited by Richard J. Ross |
| title_short | Microelectronics failure analysis |
| title_sort | microelectronics failure analysis desk reference |
| title_sub | desk reference |
| topic | Electronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Defects Handbooks, manuals, etc Electronic apparatus and appliances Testing Handbooks, manuals, etc Semiconductors Defects Handbooks, manuals, etc |
| topic_facet | Electronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Testing Handbooks, manuals, etc Microelectronics Materials Defects Handbooks, manuals, etc Electronic apparatus and appliances Testing Handbooks, manuals, etc Semiconductors Defects Handbooks, manuals, etc |
| work_keys_str_mv | AT rossrichardj microelectronicsfailureanalysisdeskreference |