Handbook of wafer bonding:
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Bibliographic Details
Format: Electronic eBook
Language:English
Published: Weinheim, Germany Wiley-VCH 2012
Subjects:
Item Description:Includes bibliographical references and index
Physical Description:xxxi, 395 p.
ISBN:9783527326464
9783527644247

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!