Components, packaging and manufacturing technology II: selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia
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Bibliographic Details
Other Authors: Wu, Andy (Editor)
Format: Electronic eBook
Language:English
Published: Zurich, Switzerland TTP 2014
Series:Applied Mechanics and Materials Volume 509
Subjects:
Item Description:Description based on online resource; title from PDF title page (ebrary, viewed March 21, 2014)
Physical Description:1 online resource (245 pages) illustrations
ISBN:9783038350132
9783038263944

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!