Design, control and application of modular multilevel converters for HVDC transmission systems:
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Chichester, West Sussex, United Kingdom
John Wiley & Sons, Inc.
[2016]
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| Subjects: | |
| Online Access: | FRO01 UBG01 UBY01 UEI01 Volltext |
| Physical Description: | 1 Online-Ressource |
| ISBN: | 1118851528 1118851544 1118851552 9781118851524 9781118851548 9781118851555 |
Staff View
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| 100 | 1 | |a Sharifabadi, Kamran |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Design, control and application of modular multilevel converters for HVDC transmission systems |c Kamran Sharifabadi Research & Technology, Statoil ASA, Norway, Lennart Harnefors, ABB Corporate Research, Sweden Hans-Peter Nee School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Staffan Norrga, School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Remus Teodorescu, Department of Energy Technology, Aalborg University, Denmark |
| 264 | 1 | |a Chichester, West Sussex, United Kingdom |b John Wiley & Sons, Inc. |c [2016] | |
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| 505 | 8 | |a Includes bibliographical references and index | |
| 505 | 8 | |a Cover; Title Page; Copyright; Contents; Preface; Acknowledgements; About the Companion Website; Nomenclature; Introduction; Chapter 1 Introduction to Modular Multilevel Converters; 1.1 Introduction; 1.2 The Two-Level Voltage Source Converter; 1.2.1 Topology and Basic Function; 1.2.2 Steady-State Operation; 1.3 Benefits of Multilevel Converters; 1.4 Early Multilevel Converters; 1.4.1 Diode Clamped Converters; 1.4.2 Flying Capacitor Converters; 1.5 Cascaded Multilevel Converters; 1.5.1 Submodules and Submodule Strings; 1.5.2 Modular Multilevel Converter with Half-Bridge Submodules | |
| 505 | 8 | |a 1.5.3 Other Cascaded Converter Topologies1.6 Summary; References; Chapter 2 Main-Circuit Design; 2.1 Introduction; 2.2 Properties and Design Choices of Power Semiconductor Devices for High-Power Applications; 2.2.1 Historical Overview of the Development Toward Modern Power Semiconductors; 2.2.2 Basic Conduction Properties of Power Semiconductor Devices; 2.2.3 P-N Junctions for Blocking; 2.2.4 Conduction Properties and the Need for Carrier Injection; 2.2.5 Switching Properties; 2.2.6 Packaging; 2.2.7 Reliability of Power Semiconductor Devices; 2.2.8 Silicon Carbide Power Devices | |
| 505 | 8 | |a 2.3 Medium-Voltage Capacitors for Submodules2.3.1 Design and Fabrication; 2.3.2 Self-Healing and Reliability; 2.4 Arm Inductors; 2.5 Submodule Configurations; 2.5.1 Existing Half-Bridge Submodule Realizations; 2.5.2 Clamped Single-Submodule; 2.5.3 Clamped Double-Submodule; 2.5.4 Unipolar-Voltage Full-Bridge Submodule; 2.5.5 Five-Level Cross-Connected Submodule; 2.5.6 Three-Level Cross-Connected Submodule; 2.5.7 Double Submodule; 2.5.8 Semi-Full-Bridge Submodule; 2.5.9 Soft-Switching Submodules; 2.6 Choice of Main-Circuit Parameters; 2.6.1 Main Input Data | |
| 505 | 8 | |a 2.6.2 Choice of Power Semiconductor Devices2.6.3 Choice of the Number of Submodules; 2.6.4 Choice of Submodule Capacitance; 2.6.5 Choice of Arm Inductance; 2.7 Handling of Redundant and Faulty Submodules; 2.7.1 Method 1; 2.7.2 Method 2; 2.7.3 Comparison of Method 1 and Method 2; 2.7.4 Handling of Redundancy Using IGBT Stacks; 2.8 Auxiliary Power Supplies for Submodules; 2.8.1 Using the Submodule Capacitor as Power Source; 2.8.2 Power Supplies with High-Voltage Inputs; 2.8.3 The Tapped-Inductor Buck Converter; 2.9 Start-Up Procedures; 2.10 Summary; References; Chapter 3 Dynamics and Control | |
| 505 | 8 | |a 3.1 Introduction3.2 Fundamentals; 3.2.1 Arms; 3.2.2 Submodules; 3.2.3 AC Bus; 3.2.4 DC Bus; 3.2.5 Currents; 3.3 Converter Operating Principle and Averaged Dynamic Model; 3.3.1 Dynamic Relations for the Currents; 3.3.2 Selection of the Mean Sum Capacitor Voltages; 3.3.3 Averaging Principle; 3.3.4 Ideal Selection of the Insertion Indices; 3.3.5 Sum-Capacitor-Voltage Ripples; 3.3.6 Maximum Output Voltage; 3.3.7 DC-Bus Dynamics; 3.3.8 Time Delays; 3.4 Per-Phase Output-Current Control; 3.4.1 Tracking of a Sinusoidal Reference Using a PI Controller | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
| 650 | 4 | |a TECHNOLOGY & ENGINEERING / Mechanical | |
| 650 | 4 | |a Electric current converters / Design and construction | |
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Record in the Search Index
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| any_adam_object | |
| author | Sharifabadi, Kamran |
| author_facet | Sharifabadi, Kamran |
| author_role | aut |
| author_sort | Sharifabadi, Kamran |
| author_variant | k s ks |
| building | Verbundindex |
| bvnumber | BV043908051 |
| classification_rvk | ZN 8340 ZN 8555 |
| collection | ZDB-35-WIC |
| contents | Includes bibliographical references and index Cover; Title Page; Copyright; Contents; Preface; Acknowledgements; About the Companion Website; Nomenclature; Introduction; Chapter 1 Introduction to Modular Multilevel Converters; 1.1 Introduction; 1.2 The Two-Level Voltage Source Converter; 1.2.1 Topology and Basic Function; 1.2.2 Steady-State Operation; 1.3 Benefits of Multilevel Converters; 1.4 Early Multilevel Converters; 1.4.1 Diode Clamped Converters; 1.4.2 Flying Capacitor Converters; 1.5 Cascaded Multilevel Converters; 1.5.1 Submodules and Submodule Strings; 1.5.2 Modular Multilevel Converter with Half-Bridge Submodules 1.5.3 Other Cascaded Converter Topologies1.6 Summary; References; Chapter 2 Main-Circuit Design; 2.1 Introduction; 2.2 Properties and Design Choices of Power Semiconductor Devices for High-Power Applications; 2.2.1 Historical Overview of the Development Toward Modern Power Semiconductors; 2.2.2 Basic Conduction Properties of Power Semiconductor Devices; 2.2.3 P-N Junctions for Blocking; 2.2.4 Conduction Properties and the Need for Carrier Injection; 2.2.5 Switching Properties; 2.2.6 Packaging; 2.2.7 Reliability of Power Semiconductor Devices; 2.2.8 Silicon Carbide Power Devices 2.3 Medium-Voltage Capacitors for Submodules2.3.1 Design and Fabrication; 2.3.2 Self-Healing and Reliability; 2.4 Arm Inductors; 2.5 Submodule Configurations; 2.5.1 Existing Half-Bridge Submodule Realizations; 2.5.2 Clamped Single-Submodule; 2.5.3 Clamped Double-Submodule; 2.5.4 Unipolar-Voltage Full-Bridge Submodule; 2.5.5 Five-Level Cross-Connected Submodule; 2.5.6 Three-Level Cross-Connected Submodule; 2.5.7 Double Submodule; 2.5.8 Semi-Full-Bridge Submodule; 2.5.9 Soft-Switching Submodules; 2.6 Choice of Main-Circuit Parameters; 2.6.1 Main Input Data 2.6.2 Choice of Power Semiconductor Devices2.6.3 Choice of the Number of Submodules; 2.6.4 Choice of Submodule Capacitance; 2.6.5 Choice of Arm Inductance; 2.7 Handling of Redundant and Faulty Submodules; 2.7.1 Method 1; 2.7.2 Method 2; 2.7.3 Comparison of Method 1 and Method 2; 2.7.4 Handling of Redundancy Using IGBT Stacks; 2.8 Auxiliary Power Supplies for Submodules; 2.8.1 Using the Submodule Capacitor as Power Source; 2.8.2 Power Supplies with High-Voltage Inputs; 2.8.3 The Tapped-Inductor Buck Converter; 2.9 Start-Up Procedures; 2.10 Summary; References; Chapter 3 Dynamics and Control 3.1 Introduction3.2 Fundamentals; 3.2.1 Arms; 3.2.2 Submodules; 3.2.3 AC Bus; 3.2.4 DC Bus; 3.2.5 Currents; 3.3 Converter Operating Principle and Averaged Dynamic Model; 3.3.1 Dynamic Relations for the Currents; 3.3.2 Selection of the Mean Sum Capacitor Voltages; 3.3.3 Averaging Principle; 3.3.4 Ideal Selection of the Insertion Indices; 3.3.5 Sum-Capacitor-Voltage Ripples; 3.3.6 Maximum Output Voltage; 3.3.7 DC-Bus Dynamics; 3.3.8 Time Delays; 3.4 Per-Phase Output-Current Control; 3.4.1 Tracking of a Sinusoidal Reference Using a PI Controller |
| ctrlnum | (ZDB-35-WIC)9781118851555 (OCoLC)968255428 (DE-599)BVBBV043908051 |
| dewey-full | 621.31/7 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.31/7 |
| dewey-search | 621.31/7 |
| dewey-sort | 3621.31 17 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV043908051 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:38:13Z |
| institution | BVB |
| isbn | 1118851528 1118851544 1118851552 9781118851524 9781118851548 9781118851555 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029317261 |
| oclc_num | 968255428 |
| open_access_boolean | |
| owner | DE-861 DE-824 DE-706 |
| owner_facet | DE-861 DE-824 DE-706 |
| physical | 1 Online-Ressource |
| psigel | ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FRO_PDA_WIC ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC UBY_PDA_WIC_Kauf |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | John Wiley & Sons, Inc. |
| record_format | marc |
| spelling | Sharifabadi, Kamran Verfasser aut Design, control and application of modular multilevel converters for HVDC transmission systems Kamran Sharifabadi Research & Technology, Statoil ASA, Norway, Lennart Harnefors, ABB Corporate Research, Sweden Hans-Peter Nee School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Staffan Norrga, School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Remus Teodorescu, Department of Energy Technology, Aalborg University, Denmark Chichester, West Sussex, United Kingdom John Wiley & Sons, Inc. [2016] 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Cover; Title Page; Copyright; Contents; Preface; Acknowledgements; About the Companion Website; Nomenclature; Introduction; Chapter 1 Introduction to Modular Multilevel Converters; 1.1 Introduction; 1.2 The Two-Level Voltage Source Converter; 1.2.1 Topology and Basic Function; 1.2.2 Steady-State Operation; 1.3 Benefits of Multilevel Converters; 1.4 Early Multilevel Converters; 1.4.1 Diode Clamped Converters; 1.4.2 Flying Capacitor Converters; 1.5 Cascaded Multilevel Converters; 1.5.1 Submodules and Submodule Strings; 1.5.2 Modular Multilevel Converter with Half-Bridge Submodules 1.5.3 Other Cascaded Converter Topologies1.6 Summary; References; Chapter 2 Main-Circuit Design; 2.1 Introduction; 2.2 Properties and Design Choices of Power Semiconductor Devices for High-Power Applications; 2.2.1 Historical Overview of the Development Toward Modern Power Semiconductors; 2.2.2 Basic Conduction Properties of Power Semiconductor Devices; 2.2.3 P-N Junctions for Blocking; 2.2.4 Conduction Properties and the Need for Carrier Injection; 2.2.5 Switching Properties; 2.2.6 Packaging; 2.2.7 Reliability of Power Semiconductor Devices; 2.2.8 Silicon Carbide Power Devices 2.3 Medium-Voltage Capacitors for Submodules2.3.1 Design and Fabrication; 2.3.2 Self-Healing and Reliability; 2.4 Arm Inductors; 2.5 Submodule Configurations; 2.5.1 Existing Half-Bridge Submodule Realizations; 2.5.2 Clamped Single-Submodule; 2.5.3 Clamped Double-Submodule; 2.5.4 Unipolar-Voltage Full-Bridge Submodule; 2.5.5 Five-Level Cross-Connected Submodule; 2.5.6 Three-Level Cross-Connected Submodule; 2.5.7 Double Submodule; 2.5.8 Semi-Full-Bridge Submodule; 2.5.9 Soft-Switching Submodules; 2.6 Choice of Main-Circuit Parameters; 2.6.1 Main Input Data 2.6.2 Choice of Power Semiconductor Devices2.6.3 Choice of the Number of Submodules; 2.6.4 Choice of Submodule Capacitance; 2.6.5 Choice of Arm Inductance; 2.7 Handling of Redundant and Faulty Submodules; 2.7.1 Method 1; 2.7.2 Method 2; 2.7.3 Comparison of Method 1 and Method 2; 2.7.4 Handling of Redundancy Using IGBT Stacks; 2.8 Auxiliary Power Supplies for Submodules; 2.8.1 Using the Submodule Capacitor as Power Source; 2.8.2 Power Supplies with High-Voltage Inputs; 2.8.3 The Tapped-Inductor Buck Converter; 2.9 Start-Up Procedures; 2.10 Summary; References; Chapter 3 Dynamics and Control 3.1 Introduction3.2 Fundamentals; 3.2.1 Arms; 3.2.2 Submodules; 3.2.3 AC Bus; 3.2.4 DC Bus; 3.2.5 Currents; 3.3 Converter Operating Principle and Averaged Dynamic Model; 3.3.1 Dynamic Relations for the Currents; 3.3.2 Selection of the Mean Sum Capacitor Voltages; 3.3.3 Averaging Principle; 3.3.4 Ideal Selection of the Insertion Indices; 3.3.5 Sum-Capacitor-Voltage Ripples; 3.3.6 Maximum Output Voltage; 3.3.7 DC-Bus Dynamics; 3.3.8 Time Delays; 3.4 Per-Phase Output-Current Control; 3.4.1 Tracking of a Sinusoidal Reference Using a PI Controller TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Mechanical Electric current converters / Design and construction Electric current converters / Automatic control Electric power transmission / Direct current / Equipment and supplies Stromrichter (DE-588)4058102-0 gnd rswk-swf Stromwandler (DE-588)4183761-7 gnd rswk-swf Hochspannungsgleichstromübertragung (DE-588)4620681-4 gnd rswk-swf Hochspannungsgleichstromübertragung (DE-588)4620681-4 s Stromwandler (DE-588)4183761-7 s DE-604 Stromrichter (DE-588)4058102-0 s 1\p DE-604 Harnefors, Lennart Sonstige oth Nee, Hans Peter Sonstige oth Norrga, Staffan Sonstige oth Teodorescu, Remus Sonstige oth Erscheint auch als Druckausgabe 9781118851562 https://onlinelibrary.wiley.com/doi/book/10.1002/9781118851555 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Sharifabadi, Kamran Design, control and application of modular multilevel converters for HVDC transmission systems Includes bibliographical references and index Cover; Title Page; Copyright; Contents; Preface; Acknowledgements; About the Companion Website; Nomenclature; Introduction; Chapter 1 Introduction to Modular Multilevel Converters; 1.1 Introduction; 1.2 The Two-Level Voltage Source Converter; 1.2.1 Topology and Basic Function; 1.2.2 Steady-State Operation; 1.3 Benefits of Multilevel Converters; 1.4 Early Multilevel Converters; 1.4.1 Diode Clamped Converters; 1.4.2 Flying Capacitor Converters; 1.5 Cascaded Multilevel Converters; 1.5.1 Submodules and Submodule Strings; 1.5.2 Modular Multilevel Converter with Half-Bridge Submodules 1.5.3 Other Cascaded Converter Topologies1.6 Summary; References; Chapter 2 Main-Circuit Design; 2.1 Introduction; 2.2 Properties and Design Choices of Power Semiconductor Devices for High-Power Applications; 2.2.1 Historical Overview of the Development Toward Modern Power Semiconductors; 2.2.2 Basic Conduction Properties of Power Semiconductor Devices; 2.2.3 P-N Junctions for Blocking; 2.2.4 Conduction Properties and the Need for Carrier Injection; 2.2.5 Switching Properties; 2.2.6 Packaging; 2.2.7 Reliability of Power Semiconductor Devices; 2.2.8 Silicon Carbide Power Devices 2.3 Medium-Voltage Capacitors for Submodules2.3.1 Design and Fabrication; 2.3.2 Self-Healing and Reliability; 2.4 Arm Inductors; 2.5 Submodule Configurations; 2.5.1 Existing Half-Bridge Submodule Realizations; 2.5.2 Clamped Single-Submodule; 2.5.3 Clamped Double-Submodule; 2.5.4 Unipolar-Voltage Full-Bridge Submodule; 2.5.5 Five-Level Cross-Connected Submodule; 2.5.6 Three-Level Cross-Connected Submodule; 2.5.7 Double Submodule; 2.5.8 Semi-Full-Bridge Submodule; 2.5.9 Soft-Switching Submodules; 2.6 Choice of Main-Circuit Parameters; 2.6.1 Main Input Data 2.6.2 Choice of Power Semiconductor Devices2.6.3 Choice of the Number of Submodules; 2.6.4 Choice of Submodule Capacitance; 2.6.5 Choice of Arm Inductance; 2.7 Handling of Redundant and Faulty Submodules; 2.7.1 Method 1; 2.7.2 Method 2; 2.7.3 Comparison of Method 1 and Method 2; 2.7.4 Handling of Redundancy Using IGBT Stacks; 2.8 Auxiliary Power Supplies for Submodules; 2.8.1 Using the Submodule Capacitor as Power Source; 2.8.2 Power Supplies with High-Voltage Inputs; 2.8.3 The Tapped-Inductor Buck Converter; 2.9 Start-Up Procedures; 2.10 Summary; References; Chapter 3 Dynamics and Control 3.1 Introduction3.2 Fundamentals; 3.2.1 Arms; 3.2.2 Submodules; 3.2.3 AC Bus; 3.2.4 DC Bus; 3.2.5 Currents; 3.3 Converter Operating Principle and Averaged Dynamic Model; 3.3.1 Dynamic Relations for the Currents; 3.3.2 Selection of the Mean Sum Capacitor Voltages; 3.3.3 Averaging Principle; 3.3.4 Ideal Selection of the Insertion Indices; 3.3.5 Sum-Capacitor-Voltage Ripples; 3.3.6 Maximum Output Voltage; 3.3.7 DC-Bus Dynamics; 3.3.8 Time Delays; 3.4 Per-Phase Output-Current Control; 3.4.1 Tracking of a Sinusoidal Reference Using a PI Controller TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Mechanical Electric current converters / Design and construction Electric current converters / Automatic control Electric power transmission / Direct current / Equipment and supplies Stromrichter (DE-588)4058102-0 gnd Stromwandler (DE-588)4183761-7 gnd Hochspannungsgleichstromübertragung (DE-588)4620681-4 gnd |
| subject_GND | (DE-588)4058102-0 (DE-588)4183761-7 (DE-588)4620681-4 |
| title | Design, control and application of modular multilevel converters for HVDC transmission systems |
| title_auth | Design, control and application of modular multilevel converters for HVDC transmission systems |
| title_exact_search | Design, control and application of modular multilevel converters for HVDC transmission systems |
| title_full | Design, control and application of modular multilevel converters for HVDC transmission systems Kamran Sharifabadi Research & Technology, Statoil ASA, Norway, Lennart Harnefors, ABB Corporate Research, Sweden Hans-Peter Nee School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Staffan Norrga, School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Remus Teodorescu, Department of Energy Technology, Aalborg University, Denmark |
| title_fullStr | Design, control and application of modular multilevel converters for HVDC transmission systems Kamran Sharifabadi Research & Technology, Statoil ASA, Norway, Lennart Harnefors, ABB Corporate Research, Sweden Hans-Peter Nee School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Staffan Norrga, School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Remus Teodorescu, Department of Energy Technology, Aalborg University, Denmark |
| title_full_unstemmed | Design, control and application of modular multilevel converters for HVDC transmission systems Kamran Sharifabadi Research & Technology, Statoil ASA, Norway, Lennart Harnefors, ABB Corporate Research, Sweden Hans-Peter Nee School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Staffan Norrga, School of Electrical Engineering, KTH Royal Institute of Technology, Sweden, Remus Teodorescu, Department of Energy Technology, Aalborg University, Denmark |
| title_short | Design, control and application of modular multilevel converters for HVDC transmission systems |
| title_sort | design control and application of modular multilevel converters for hvdc transmission systems |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Mechanical Electric current converters / Design and construction Electric current converters / Automatic control Electric power transmission / Direct current / Equipment and supplies Stromrichter (DE-588)4058102-0 gnd Stromwandler (DE-588)4183761-7 gnd Hochspannungsgleichstromübertragung (DE-588)4620681-4 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electric current converters / Design and construction Electric current converters / Automatic control Electric power transmission / Direct current / Equipment and supplies Stromrichter Stromwandler Hochspannungsgleichstromübertragung |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781118851555 |
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