Components, packaging and manufacturing technology: selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010
Gespeichert in:
Körperschaft: | |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Stafa-Zurich, Switzerland
Trans Tech Publications
©2011
|
Schriftenreihe: | Key engineering materials
v. 460/461 |
Schlagworte: | |
Online-Zugang: | FAW01 FAW02 |
Beschreibung: | pages |
ISBN: | 9783038134800 3038134805 9780878492138 0878492135 |
Internformat
MARC
LEADER | 00000nmm a2200000zcb4500 | ||
---|---|---|---|
001 | BV043774268 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 160920s2011 |||| o||u| ||||||eng d | ||
020 | |a 9783038134800 |9 978-3-03813-480-0 | ||
020 | |a 3038134805 |9 3-03813-480-5 | ||
020 | |a 9780878492138 |9 978-0-87849-213-8 | ||
020 | |a 0878492135 |9 0-87849-213-5 | ||
035 | |a (ZDB-4-EBA)ocn811963183 | ||
035 | |a (OCoLC)811963183 | ||
035 | |a (DE-599)BVBBV043774268 | ||
040 | |a DE-604 |b ger |e aacr | ||
041 | 0 | |a eng | |
049 | |a DE-1046 |a DE-1047 | ||
082 | 0 | |a 620.005 |2 23 | |
110 | 2 | |a International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China> |e Verfasser |4 aut | |
245 | 1 | 0 | |a Components, packaging and manufacturing technology |b selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 |c edited by Yanwen Wu |
246 | 1 | 3 | |a ICCPMT 2010 |
264 | 1 | |a Stafa-Zurich, Switzerland |b Trans Tech Publications |c ©2011 | |
300 | |a pages | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Key engineering materials |v v. 460/461 | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Engineering (General) |2 bisacsh | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Reference |2 bisacsh | |
650 | 7 | |a Electronic apparatus and appliances |2 fast | |
650 | 7 | |a Electronic packaging |2 fast | |
650 | 7 | |a Manufacturing processes |2 fast | |
650 | 7 | |a Microelectronic packaging |2 fast | |
650 | 4 | |a Electronic apparatus and appliances |v Congresses | |
650 | 4 | |a Electronic packaging |v Congresses | |
650 | 4 | |a Microelectronic packaging |v Congresses | |
650 | 4 | |a Manufacturing processes |v Congresses | |
655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
700 | 1 | |a Wu, YanwenXX4edt |e Sonstige |4 oth | |
912 | |a ZDB-4-EBA | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-029185328 | ||
966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046 |l FAW01 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046 |l FAW02 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext |
Datensatz im Suchindex
_version_ | 1804176599048781824 |
---|---|
any_adam_object | |
author_corporate | International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China> |
author_corporate_role | aut |
author_facet | International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China> |
author_sort | International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China> |
building | Verbundindex |
bvnumber | BV043774268 |
collection | ZDB-4-EBA |
ctrlnum | (ZDB-4-EBA)ocn811963183 (OCoLC)811963183 (DE-599)BVBBV043774268 |
dewey-full | 620.005 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 620 - Engineering and allied operations |
dewey-raw | 620.005 |
dewey-search | 620.005 |
dewey-sort | 3620.005 |
dewey-tens | 620 - Engineering and allied operations |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02279nmm a2200517zcb4500</leader><controlfield tag="001">BV043774268</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">160920s2011 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038134800</subfield><subfield code="9">978-3-03813-480-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038134805</subfield><subfield code="9">3-03813-480-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780878492138</subfield><subfield code="9">978-0-87849-213-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0878492135</subfield><subfield code="9">0-87849-213-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-EBA)ocn811963183</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)811963183</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043774268</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-1047</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">620.005</subfield><subfield code="2">23</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China></subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Components, packaging and manufacturing technology</subfield><subfield code="b">selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010</subfield><subfield code="c">edited by Yanwen Wu</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">ICCPMT 2010</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Stafa-Zurich, Switzerland</subfield><subfield code="b">Trans Tech Publications</subfield><subfield code="c">©2011</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">pages</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Key engineering materials</subfield><subfield code="v">v. 460/461</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Engineering (General)</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Reference</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Manufacturing processes</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microelectronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronic packaging</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing processes</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, YanwenXX4edt</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029185328</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=553046</subfield><subfield code="l">FAW02</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
genre | (DE-588)1071861417 Konferenzschrift gnd-content |
genre_facet | Konferenzschrift |
id | DE-604.BV043774268 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T07:34:44Z |
institution | BVB |
isbn | 9783038134800 3038134805 9780878492138 0878492135 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029185328 |
oclc_num | 811963183 |
open_access_boolean | |
owner | DE-1046 DE-1047 |
owner_facet | DE-1046 DE-1047 |
physical | pages |
psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
publishDate | 2011 |
publishDateSearch | 2011 |
publishDateSort | 2011 |
publisher | Trans Tech Publications |
record_format | marc |
series2 | Key engineering materials |
spelling | International Conference on Components, Packaging and Manufacturing Technology <2010, Sanya Shi, China> Verfasser aut Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 edited by Yanwen Wu ICCPMT 2010 Stafa-Zurich, Switzerland Trans Tech Publications ©2011 pages txt rdacontent c rdamedia cr rdacarrier Key engineering materials v. 460/461 TECHNOLOGY & ENGINEERING / Engineering (General) bisacsh TECHNOLOGY & ENGINEERING / Reference bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast Electronic apparatus and appliances Congresses Electronic packaging Congresses Microelectronic packaging Congresses Manufacturing processes Congresses (DE-588)1071861417 Konferenzschrift gnd-content Wu, YanwenXX4edt Sonstige oth |
spellingShingle | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 TECHNOLOGY & ENGINEERING / Engineering (General) bisacsh TECHNOLOGY & ENGINEERING / Reference bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast Electronic apparatus and appliances Congresses Electronic packaging Congresses Microelectronic packaging Congresses Manufacturing processes Congresses |
subject_GND | (DE-588)1071861417 |
title | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 |
title_alt | ICCPMT 2010 |
title_auth | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 |
title_exact_search | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 |
title_full | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 edited by Yanwen Wu |
title_fullStr | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 edited by Yanwen Wu |
title_full_unstemmed | Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 edited by Yanwen Wu |
title_short | Components, packaging and manufacturing technology |
title_sort | components packaging and manufacturing technology selected peer reviewed paper from 2010 international conference on components packaging and manufacturing technology sanya china december 9 10 2010 |
title_sub | selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 |
topic | TECHNOLOGY & ENGINEERING / Engineering (General) bisacsh TECHNOLOGY & ENGINEERING / Reference bisacsh Electronic apparatus and appliances fast Electronic packaging fast Manufacturing processes fast Microelectronic packaging fast Electronic apparatus and appliances Congresses Electronic packaging Congresses Microelectronic packaging Congresses Manufacturing processes Congresses |
topic_facet | TECHNOLOGY & ENGINEERING / Engineering (General) TECHNOLOGY & ENGINEERING / Reference Electronic apparatus and appliances Electronic packaging Manufacturing processes Microelectronic packaging Electronic apparatus and appliances Congresses Electronic packaging Congresses Microelectronic packaging Congresses Manufacturing processes Congresses Konferenzschrift |
work_keys_str_mv | AT internationalconferenceoncomponentspackagingandmanufacturingtechnology2010sanyashichina componentspackagingandmanufacturingtechnologyselectedpeerreviewedpaperfrom2010internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyachinadecember9102010 AT wuyanwenxx4edt componentspackagingandmanufacturingtechnologyselectedpeerreviewedpaperfrom2010internationalconferenceoncomponentspackagingandmanufacturingtechnologysanyachinadecember9102010 AT internationalconferenceoncomponentspackagingandmanufacturingtechnology2010sanyashichina iccpmt2010 AT wuyanwenxx4edt iccpmt2010 |