MEMS packaging:
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
London
INSPEC
c2004
|
| Series: | EMIS processing series
no. 3 |
| Subjects: | |
| Online Access: | FAW01 FAW02 Volltext |
| Item Description: | Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index |
| Physical Description: | 1 Online-Ressource (xxix, 275 p.) |
| ISBN: | 0863413358 1615839623 1849190623 9780863413353 9781615839629 9781849190626 |
Staff View
MARC
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Record in the Search Index
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| building | Verbundindex |
| bvnumber | BV043101434 |
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| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV043101434 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:17:27Z |
| institution | BVB |
| isbn | 0863413358 1615839623 1849190623 9780863413353 9781615839629 9781849190626 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028525626 |
| oclc_num | 692197050 |
| open_access_boolean | |
| owner | DE-1046 DE-1047 |
| owner_facet | DE-1046 DE-1047 |
| physical | 1 Online-Ressource (xxix, 275 p.) |
| psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
| publishDate | 2004 |
| publishDateSearch | 2004 |
| publishDateSort | 2004 |
| publisher | INSPEC |
| record_format | marc |
| series2 | EMIS processing series |
| spelling | MEMS packaging edited by Tai-Ran Hsu London INSPEC c2004 1 Online-Ressource (xxix, 275 p.) txt rdacontent c rdamedia cr rdacarrier EMIS processing series no. 3 Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index Micromachines Mise sous boîtier (Microélectronique) Bauelement swd Mikroelektronik swd Mikromechanik swd Microelectromechanical systems fast Microelectronic packaging fast Microelectromechanical systems Microelectronic packaging Bauelement (DE-588)4004741-6 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf MEMS (DE-588)4824724-8 s Bauelement (DE-588)4004741-6 s 1\p DE-604 Hsu, Tai-Ran Sonstige oth INSPEC (Information service) Sonstige oth http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=292233 Aggregator Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | MEMS packaging Micromachines Mise sous boîtier (Microélectronique) Bauelement swd Mikroelektronik swd Mikromechanik swd Microelectromechanical systems fast Microelectronic packaging fast Microelectromechanical systems Microelectronic packaging Bauelement (DE-588)4004741-6 gnd MEMS (DE-588)4824724-8 gnd |
| subject_GND | (DE-588)4004741-6 (DE-588)4824724-8 |
| title | MEMS packaging |
| title_auth | MEMS packaging |
| title_exact_search | MEMS packaging |
| title_full | MEMS packaging edited by Tai-Ran Hsu |
| title_fullStr | MEMS packaging edited by Tai-Ran Hsu |
| title_full_unstemmed | MEMS packaging edited by Tai-Ran Hsu |
| title_short | MEMS packaging |
| title_sort | mems packaging |
| topic | Micromachines Mise sous boîtier (Microélectronique) Bauelement swd Mikroelektronik swd Mikromechanik swd Microelectromechanical systems fast Microelectronic packaging fast Microelectromechanical systems Microelectronic packaging Bauelement (DE-588)4004741-6 gnd MEMS (DE-588)4824724-8 gnd |
| topic_facet | Micromachines Mise sous boîtier (Microélectronique) Bauelement Mikroelektronik Mikromechanik Microelectromechanical systems Microelectronic packaging MEMS |
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| work_keys_str_mv | AT hsutairan memspackaging AT inspecinformationservice memspackaging |