Verfügbarkeit: Arbitrary modeling of TSVs for 3D integrated circuits

Arbitrary modeling of TSVs for 3D integrated circuits:

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Bibliographische Detailangaben
1. Verfasser:	Salah, Khaled (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Cham [u.a.] Springer 2015
Schriftenreihe:	Analog circuits and signal processing
Schlagworte:	Informatik Ingenieurwissenschaften Computer science Electronics Systems engineering Engineering
Online-Zugang:	BHS01 BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext Inhaltsverzeichnis Abstract
Beschreibung:	1 Online-Ressource
ISBN:	9783319076119
DOI:	10.1007/978-3-319-07611-9

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Datensatz im Suchindex

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adam_text	ARBITRARY MODELING OF TSVS FOR 3D INTEGRATED CIRCUITS / SALAH, KHALED : 2015 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION: WORK AROUND MOORE’S LAW 3D/TSV ENABLING TECHNOLOGIES TSV MODELING AND ANALYSIS TSV VERIFICATION TSV MACRO-MODELING FRAMEWORK TSV DESIGN APPLICATIONS: TSV-BASED ON-CHIP SPIRAL INDUCTOR, TSV-BASED ON-CHIP WIRELESS COMMUNICATIONS AND TSV-BASED BANDPASS FILTER IMPERFECTION IN TSV MODELING NEW TRENDS IN TSV TSV FABRICATION CONCLUSIONS DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. ARBITRARY MODELING OF TSVS FOR 3D INTEGRATED CIRCUITS / SALAH, KHALED : 2015 ABSTRACT / INHALTSTEXT THIS BOOK PRESENTS A WIDE-BAND AND TECHNOLOGY INDEPENDENT, SPICE-COMPATIBLE RLC MODEL FOR THROUGH-SILICON VIAS (TSVS) IN 3D INTEGRATED CIRCUITS. THIS MODEL ACCOUNTS FOR A VARIETY OF EFFECTS, INCLUDING SKIN EFFECT, DEPLETION CAPACITANCE, AND NEARBY CONTACT EFFECTS. READERS WILL BENEFIT FROM IN-DEPTH COVERAGE OF CONCEPTS AND TECHNOLOGY SUCH AS 3D INTEGRATION, MACRO MODELING, DIMENSIONAL ANALYSIS, AND COMPACT MODELING, AS WELL AS CLOSED FORM EQUATIONS FOR THE THROUGH SILICON VIA PARASITICS. CONCEPTS COVERED ARE DEMONSTRATED BY USING TSVS IN APPLICATIONS SUCH AS A SPIRAL INDUCTOR, AND INDUCTIVE-BASED COMMUNICATION SYSTEM, AND BANDPASS FILTERING. INTRODUCES A ROBUST MODEL THAT CAPTURES ACCURATELY ALL THE LOSS MODES OF A TSV, COUPLING PARASITICS BETWEEN TSVS AND THE TSV NONLINEAR CAPACITANCE AND RESISTANCE OF THE DEPLETION REGION; ENABLES READERS TO USE A MODEL WHICH IS TECHNOLOGY DEPENDENT AND CAN BE USED FOR ANY TSV CONFIGURATION; REVEALS A NOVEL ON-CHIP WIRELESS COMMUNICATION TECHNIQUE, BASED ON TSV SPIRAL INDUCTORS; EQUIPS READERS FOR FAST PARASITIC EXTRACTION OF TSVS FOR 3D IC DESIGN DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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spellingShingle	Salah, Khaled Arbitrary modeling of TSVs for 3D integrated circuits Informatik Ingenieurwissenschaften Computer science Electronics Systems engineering Engineering
title	Arbitrary modeling of TSVs for 3D integrated circuits
title_auth	Arbitrary modeling of TSVs for 3D integrated circuits
title_exact_search	Arbitrary modeling of TSVs for 3D integrated circuits
title_full	Arbitrary modeling of TSVs for 3D integrated circuits Khaled Salah ; Yehea Ismail ; Alaa El-Rouby
title_fullStr	Arbitrary modeling of TSVs for 3D integrated circuits Khaled Salah ; Yehea Ismail ; Alaa El-Rouby
title_full_unstemmed	Arbitrary modeling of TSVs for 3D integrated circuits Khaled Salah ; Yehea Ismail ; Alaa El-Rouby
title_short	Arbitrary modeling of TSVs for 3D integrated circuits
title_sort	arbitrary modeling of tsvs for 3d integrated circuits
topic	Informatik Ingenieurwissenschaften Computer science Electronics Systems engineering Engineering
topic_facet	Informatik Ingenieurwissenschaften Computer science Electronics Systems engineering Engineering
url	https://doi.org/10.1007/978-3-319-07611-9 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027603011&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027603011&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
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