Holdings: Packaging of high power semiconductor lasers

Packaging of high power semiconductor lasers:

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Bibliographic Details
Main Authors:	Xingsheng, Liu (Author), Zhao, Wei (Author), Xiong, Lingling (Author), Liu, Hui (Author)
Format:	Electronic eBook
Language:	English
Published:	New York ; Heidelberg ; Dordrecht ; London Springer [2015]
Series:	Micro- and opto-electronic materials, structures, and systems
Subjects:	Halbleiterlaser
Online Access:	BHS01 BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 TUM01 UBT01 Volltext Inhaltsverzeichnis Abstract
Physical Description:	1 Online-Ressource (XV, 402 Seiten) Illustrationen, Diagramme
ISBN:	9781461492634
DOI:	10.1007/978-1-4614-9263-4

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adam_text	PACKAGING OF HIGH POWER SEMICONDUCTOR LASERS / LIU, XINGSHENG : 2015 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION OF HIGH POWER SEMICONDUCTOR LASERS OVERVIEW OF HIGH POWER SEMICONDUCTOR LASER PACKAGES THERMAL DESIGN AND MANAGEMENT IN HIGH POWER SEMICONDUCTOR LASER PACKAGING THERMAL STRESS IN HIGH POWER SEMICONDUCTOR LASERS OPTICAL DESIGN AND BEAM SHAPING IN HIGH POWER SEMICONDUCTOR LASERS MATERIALS AND COMPONENTS IN HIGH POWER SEMICONDUCTOR LASER PACKAGING PACKAGING PROCESS OF HIGH POWER SEMICONDUCTOR LASERS TESTING AND CHARACTERIZATION OF HIGH POWER SEMICONDUCTOR LASERS FAILURE ANALYSIS AND RELIABILITY ASSESSMENT IN HIGH POWER SEMICONDUCTOR LASER PACKAGING APPLICATIONS OF HIGH POWER SEMICONDUCTOR LASERS DEVELOPMENT TREND AND CHALLENGES IN HIGH POWER SEMICONDUCTOR LASER PACKAGING DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. PACKAGING OF HIGH POWER SEMICONDUCTOR LASERS / LIU, XINGSHENG : 2015 ABSTRACT / INHALTSTEXT THIS BOOK INTRODUCES HIGH POWER SEMICONDUCTOR LASER PACKAGING DESIGN. THE CHARACTERISTICS AND CHALLENGES OF THE DESIGN AND VARIOUS PACKAGING, PROCESSING, AND TESTING TECHNIQUES ARE DETAILED BY THE AUTHORS. NEW TECHNOLOGIES, IN PARTICULAR THERMAL TECHNOLOGIES, CURRENT APPLICATIONS, AND TRENDS IN HIGH POWER SEMICONDUCTOR LASER PACKAGING ARE DESCRIBED AT LENGTH AND ASSESSED DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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author	Xingsheng, Liu Zhao, Wei Xiong, Lingling Liu, Hui
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isbn	9781461492634
language	English
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series2	Micro- and opto-electronic materials, structures, and systems
spellingShingle	Xingsheng, Liu Zhao, Wei Xiong, Lingling Liu, Hui Packaging of high power semiconductor lasers Halbleiterlaser (DE-588)4139556-6 gnd
subject_GND	(DE-588)4139556-6
title	Packaging of high power semiconductor lasers
title_auth	Packaging of high power semiconductor lasers
title_exact_search	Packaging of high power semiconductor lasers
title_full	Packaging of high power semiconductor lasers Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
title_fullStr	Packaging of high power semiconductor lasers Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
title_full_unstemmed	Packaging of high power semiconductor lasers Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
title_short	Packaging of high power semiconductor lasers
title_sort	packaging of high power semiconductor lasers
topic	Halbleiterlaser (DE-588)4139556-6 gnd
topic_facet	Halbleiterlaser
url	https://doi.org/10.1007/978-1-4614-9263-4 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027595912&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=027595912&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT xingshengliu packagingofhighpowersemiconductorlasers AT zhaowei packagingofhighpowersemiconductorlasers AT xionglingling packagingofhighpowersemiconductorlasers AT liuhui packagingofhighpowersemiconductorlasers

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