Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability, and testing
Saved in:
Bibliographic Details
Main Author: Liu, S., (Sheng) (Author)
Format: Electronic eBook
Language:English
Published: [Beijing] Chemical Industry Press 2011
Subjects:
Online Access:Volltext
Item Description:Includes bibliographical references and index
Physical Description:1 Online-Ressource (xxii, 564 p.)
ISBN:9781299314429

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection! Get full text