Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
2010
|
| Schriftenreihe: | Integrated Circuits and Systems
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FHI01 FHN01 FHR01 Volltext |
| Beschreibung: | This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781441907844 |
| DOI: | 10.1007/978-1-4419-0784-4 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV041889569 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 140603s2010 |||| o||u| ||||||eng d | ||
| 020 | |a 9781441907844 |c Online |9 978-1-4419-0784-4 | ||
| 024 | 7 | |a 10.1007/978-1-4419-0784-4 |2 doi | |
| 035 | |a (OCoLC)664677617 | ||
| 035 | |a (DE-599)BVBBV041889569 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-634 |a DE-898 |a DE-573 |a DE-92 |a DE-83 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 100 | 1 | |a Xie, Yuan |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Three Dimensional Integrated Circuit Design |b EDA, Design and Microarchitectures |c edited by Yuan Xie, Jason Cong, Sachin Sapatnekar |
| 264 | 1 | |a Boston, MA |b Springer US |c 2010 | |
| 300 | |a 1 Online-Ressource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Integrated Circuits and Systems | |
| 500 | |a This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design | ||
| 505 | 0 | |a 3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Surfaces (Physics) | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Surfaces and Interfaces, Thin Films | |
| 650 | 4 | |a Engineering, general | |
| 650 | 4 | |a Ingenieurwissenschaften | |
| 700 | 1 | |a Cong, Jason |e Sonstige |4 oth | |
| 700 | 1 | |a Sapatnekar, Sachin |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-1-4419-0783-7 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4419-0784-4 |x Verlag |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-027333522 | ||
| 966 | e | |u https://doi.org/10.1007/978-1-4419-0784-4 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4419-0784-4 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4419-0784-4 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4419-0784-4 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804152238533246976 |
|---|---|
| any_adam_object | |
| author | Xie, Yuan |
| author_facet | Xie, Yuan |
| author_role | aut |
| author_sort | Xie, Yuan |
| author_variant | y x yx |
| building | Verbundindex |
| bvnumber | BV041889569 |
| collection | ZDB-2-ENG |
| contents | 3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration |
| ctrlnum | (OCoLC)664677617 (DE-599)BVBBV041889569 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4419-0784-4 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03393nmm a2200529zc 4500</leader><controlfield tag="001">BV041889569</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">140603s2010 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781441907844</subfield><subfield code="c">Online</subfield><subfield code="9">978-1-4419-0784-4</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4419-0784-4</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)664677617</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV041889569</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-634</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Xie, Yuan</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Three Dimensional Integrated Circuit Design</subfield><subfield code="b">EDA, Design and Microarchitectures</subfield><subfield code="c">edited by Yuan Xie, Jason Cong, Sachin Sapatnekar</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Springer US</subfield><subfield code="c">2010</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Integrated Circuits and Systems</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design</subfield></datafield><datafield tag="505" ind1="0" ind2=" "><subfield code="a">3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surfaces (Physics)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surfaces and Interfaces, Thin Films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering, general</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cong, Jason</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sapatnekar, Sachin</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-1-4419-0783-7</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4419-0784-4</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027333522</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4419-0784-4</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4419-0784-4</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4419-0784-4</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4419-0784-4</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV041889569 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T01:07:32Z |
| institution | BVB |
| isbn | 9781441907844 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027333522 |
| oclc_num | 664677617 |
| open_access_boolean | |
| owner | DE-634 DE-898 DE-BY-UBR DE-573 DE-92 DE-83 |
| owner_facet | DE-634 DE-898 DE-BY-UBR DE-573 DE-92 DE-83 |
| physical | 1 Online-Ressource |
| psigel | ZDB-2-ENG |
| publishDate | 2010 |
| publishDateSearch | 2010 |
| publishDateSort | 2010 |
| publisher | Springer US |
| record_format | marc |
| series2 | Integrated Circuits and Systems |
| spelling | Xie, Yuan Verfasser aut Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures edited by Yuan Xie, Jason Cong, Sachin Sapatnekar Boston, MA Springer US 2010 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Integrated Circuits and Systems This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design 3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration Engineering Electronics Optical materials Surfaces (Physics) Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films Engineering, general Ingenieurwissenschaften Cong, Jason Sonstige oth Sapatnekar, Sachin Sonstige oth Erscheint auch als Druckausgabe 978-1-4419-0783-7 https://doi.org/10.1007/978-1-4419-0784-4 Verlag Volltext |
| spellingShingle | Xie, Yuan Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration Engineering Electronics Optical materials Surfaces (Physics) Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films Engineering, general Ingenieurwissenschaften |
| title | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures |
| title_auth | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures |
| title_exact_search | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures |
| title_full | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures edited by Yuan Xie, Jason Cong, Sachin Sapatnekar |
| title_fullStr | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures edited by Yuan Xie, Jason Cong, Sachin Sapatnekar |
| title_full_unstemmed | Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures edited by Yuan Xie, Jason Cong, Sachin Sapatnekar |
| title_short | Three Dimensional Integrated Circuit Design |
| title_sort | three dimensional integrated circuit design eda design and microarchitectures |
| title_sub | EDA, Design and Microarchitectures |
| topic | Engineering Electronics Optical materials Surfaces (Physics) Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films Engineering, general Ingenieurwissenschaften |
| topic_facet | Engineering Electronics Optical materials Surfaces (Physics) Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Surfaces and Interfaces, Thin Films Engineering, general Ingenieurwissenschaften |
| url | https://doi.org/10.1007/978-1-4419-0784-4 |
| work_keys_str_mv | AT xieyuan threedimensionalintegratedcircuitdesignedadesignandmicroarchitectures AT congjason threedimensionalintegratedcircuitdesignedadesignandmicroarchitectures AT sapatnekarsachin threedimensionalintegratedcircuitdesignedadesignandmicroarchitectures |