Franke, J. (2014). Three-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly and applications for injection molded circuit carriers. Hanser.
Chicago-Zitierstil (17. Ausg.)Franke, Jörg. Three-dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers. München: Hanser, 2014.
MLA-Zitierstil (9. Ausg.)Franke, Jörg. Three-dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers. Hanser, 2014.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.