Design and assembly process implementation for BGAs:
Summary: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and fine pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. This document focuses on critical inspection, repair, and reliabili...
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bannockburn, Ill.
IPC
c2008
|
| Schlagworte: | |
| Zusammenfassung: | Summary: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and fine pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. This document focuses on critical inspection, repair, and reliability issues associated with BGAs |
| Beschreibung: | "Supersedes: IPC-7095A - October 2004 [and] IPC-7095 - August 2000.". - "March 2008"--Cover. - "Users of this standard are encouraged to participate in the development of future revisions.". - "Front and back cover photos courtesy RadiSys Corporation."--P. iv. - "IPC-7095B." Includes bibliographical references (p. 139-140) |
| Beschreibung: | xii, 140 p. ill. (some col.), forms 28 cm |
Internformat
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| 500 | |a Includes bibliographical references (p. 139-140) | ||
| 520 | |a Summary: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and fine pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. This document focuses on critical inspection, repair, and reliability issues associated with BGAs | ||
| 650 | 4 | |a Ball grid array technology / Standards | |
| 650 | 4 | |a Fine pitch technology / Standards | |
| 650 | 4 | |a Electronic packaging / Standards | |
| 650 | 4 | |a Microelectronic packaging / Standards | |
| 650 | 4 | |a Solder and soldering / Standards | |
| 650 | 4 | |a Multichip modules (Microelectronics) / Standards | |
| 710 | 2 | |a IPC - Association Connecting Electronics Industries |e Sonstige |0 (DE-588)6042407-2 |4 oth | |
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| id | DE-604.BV040546150 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:26:12Z |
| institution | BVB |
| institution_GND | (DE-588)6042407-2 |
| language | English |
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| physical | xii, 140 p. ill. (some col.), forms 28 cm |
| publishDate | 2008 |
| publishDateSearch | 2008 |
| publishDateSort | 2008 |
| publisher | IPC |
| record_format | marc |
| spelling | Design and assembly process implementation for BGAs developed by the Device Manufacturers Interface Committee of IPC. Bannockburn, Ill. IPC c2008 xii, 140 p. ill. (some col.), forms 28 cm txt rdacontent n rdamedia nc rdacarrier "Supersedes: IPC-7095A - October 2004 [and] IPC-7095 - August 2000.". - "March 2008"--Cover. - "Users of this standard are encouraged to participate in the development of future revisions.". - "Front and back cover photos courtesy RadiSys Corporation."--P. iv. - "IPC-7095B." Includes bibliographical references (p. 139-140) Summary: This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and fine pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is also addressed. This document focuses on critical inspection, repair, and reliability issues associated with BGAs Ball grid array technology / Standards Fine pitch technology / Standards Electronic packaging / Standards Microelectronic packaging / Standards Solder and soldering / Standards Multichip modules (Microelectronics) / Standards IPC - Association Connecting Electronics Industries Sonstige (DE-588)6042407-2 oth |
| spellingShingle | Design and assembly process implementation for BGAs Ball grid array technology / Standards Fine pitch technology / Standards Electronic packaging / Standards Microelectronic packaging / Standards Solder and soldering / Standards Multichip modules (Microelectronics) / Standards |
| title | Design and assembly process implementation for BGAs |
| title_auth | Design and assembly process implementation for BGAs |
| title_exact_search | Design and assembly process implementation for BGAs |
| title_full | Design and assembly process implementation for BGAs developed by the Device Manufacturers Interface Committee of IPC. |
| title_fullStr | Design and assembly process implementation for BGAs developed by the Device Manufacturers Interface Committee of IPC. |
| title_full_unstemmed | Design and assembly process implementation for BGAs developed by the Device Manufacturers Interface Committee of IPC. |
| title_short | Design and assembly process implementation for BGAs |
| title_sort | design and assembly process implementation for bgas |
| topic | Ball grid array technology / Standards Fine pitch technology / Standards Electronic packaging / Standards Microelectronic packaging / Standards Solder and soldering / Standards Multichip modules (Microelectronics) / Standards |
| topic_facet | Ball grid array technology / Standards Fine pitch technology / Standards Electronic packaging / Standards Microelectronic packaging / Standards Solder and soldering / Standards Multichip modules (Microelectronics) / Standards |
| work_keys_str_mv | AT ipcassociationconnectingelectronicsindustries designandassemblyprocessimplementationforbgas |