Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley
2012
Piscataway, NJ IEEE Press |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781118166727 9780470623466 9781118166758 9781118166741 |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV040520854 |
| illustrated | Not Illustrated |
| indexdate | 2024-08-01T11:48:46Z |
| institution | BVB |
| isbn | 9781118166727 9780470623466 9781118166758 9781118166741 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-025367147 |
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| publishDate | 2012 |
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| publisher | Wiley IEEE Press |
| record_format | marc |
| spellingShingle | Li, Er-Ping Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC Three-dimensional integrated circuits TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI bisacsh Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4218841-6 (DE-588)4027242-4 |
| title | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC |
| title_auth | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC |
| title_exact_search | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC |
| title_full | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC Er-Ping Li |
| title_fullStr | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC Er-Ping Li |
| title_full_unstemmed | Electrical modeling and design for 3D system integration 3D integrated circuits and packaging signal integrity, power integrity, and EMC Er-Ping Li |
| title_short | Electrical modeling and design for 3D system integration |
| title_sort | electrical modeling and design for 3d system integration 3d integrated circuits and packaging signal integrity power integrity and emc |
| title_sub | 3D integrated circuits and packaging signal integrity, power integrity, and EMC |
| topic | Three-dimensional integrated circuits TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI bisacsh Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Three-dimensional integrated circuits TECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI Dreidimensionale Integration Integrierte Schaltung |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781118166727 |
| work_keys_str_mv | AT lierping electricalmodelinganddesignfor3dsystemintegration3dintegratedcircuitsandpackagingsignalintegritypowerintegrityandemc |