Li, E. (2012). Electrical modeling and design for 3D system integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC. Wiley.
Chicago-Zitierstil (17. Ausg.)Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity, and EMC. Hoboken, NJ: Wiley, 2012.
MLA-Zitierstil (9. Ausg.)Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity, and EMC. Wiley, 2012.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.