Verfügbarkeit: Semiconductor packaging

Semiconductor packaging: materials interaction and reliability

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Bibliographische Detailangaben
Hauptverfasser:	Chen, Andrea (VerfasserIn), Lo, Randy Hsiao-Yu (VerfasserIn)
Format:	Buch
Sprache:	English
Veröffentlicht:	Boca Raton ; London ; New York CRC Press, Taylor & Francis Group [2012]
Schlagworte:	Microelectronic packaging TECHNOLOGY & ENGINEERING / Electronics / General TECHNOLOGY & ENGINEERING / Electronics / Circuits / General TECHNOLOGY & ENGINEERING / Material Science Integrierte Schaltung Gehäuse
Online-Zugang:	kostenfrei kostenfrei
Beschreibung:	xviii, 198 Seiten Illustrationen, Diagramme
ISBN:	9781439862056

Internformat

MARC


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Datensatz im Suchindex

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author	Chen, Andrea Lo, Randy Hsiao-Yu
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physical	xviii, 198 Seiten Illustrationen, Diagramme
psigel	ZDB-7-TOA ZDB-94-OAB
publishDate	2012
publishDateSearch	2012
publishDateSort	2012
publisher	CRC Press, Taylor & Francis Group
record_format	marc
spellingShingle	Chen, Andrea Lo, Randy Hsiao-Yu Semiconductor packaging materials interaction and reliability Microelectronic packaging TECHNOLOGY & ENGINEERING / Electronics / General bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrierte Schaltung (DE-588)4027242-4 gnd Gehäuse (DE-588)4156307-4 gnd
subject_GND	(DE-588)4027242-4 (DE-588)4156307-4
title	Semiconductor packaging materials interaction and reliability
title_auth	Semiconductor packaging materials interaction and reliability
title_exact_search	Semiconductor packaging materials interaction and reliability
title_full	Semiconductor packaging materials interaction and reliability Andrea Chen, Randy Hsiao-Yu Lo
title_fullStr	Semiconductor packaging materials interaction and reliability Andrea Chen, Randy Hsiao-Yu Lo
title_full_unstemmed	Semiconductor packaging materials interaction and reliability Andrea Chen, Randy Hsiao-Yu Lo
title_short	Semiconductor packaging
title_sort	semiconductor packaging materials interaction and reliability
title_sub	materials interaction and reliability
topic	Microelectronic packaging TECHNOLOGY & ENGINEERING / Electronics / General bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrierte Schaltung (DE-588)4027242-4 gnd Gehäuse (DE-588)4156307-4 gnd
topic_facet	Microelectronic packaging TECHNOLOGY & ENGINEERING / Electronics / General TECHNOLOGY & ENGINEERING / Electronics / Circuits / General TECHNOLOGY & ENGINEERING / Material Science Integrierte Schaltung Gehäuse
url	https://www.doabooks.org/doab?func=fulltext&uiLanguage=en&rid=48331 https://www.doabooks.org/doab?func=fulltext&uiLanguage=en&rid=48397
work_keys_str_mv	AT chenandrea semiconductorpackagingmaterialsinteractionandreliability AT lorandyhsiaoyu semiconductorpackagingmaterialsinteractionandreliability

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