Thermal design and thermophysical property for electronics: [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010]
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Tokyo
Japan Soc. of Applied Physics
2011
|
| Series: | Japanese journal of applied physics
50,11,2 |
| Subjects: | |
| Physical Description: | Getr. Zählung Einzelaufnahme eines Zeitschr.-Heftes. - Ill., graph. Darst. |
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MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV039890260 | ||
| 003 | DE-604 | ||
| 005 | 20120227 | ||
| 007 | t | ||
| 008 | 120215s2011 ad|| |||| 10||| eng d | ||
| 035 | |a (OCoLC)780118596 | ||
| 035 | |a (DE-599)GBV683485709 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-384 | ||
| 245 | 1 | 0 | |a Thermal design and thermophysical property for electronics |b [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] |c ed. by Tetsuya Baba ... |
| 246 | 1 | 3 | |a Special issue: Thermal design and thermophysical property for electronics |
| 264 | 1 | |a Tokyo |b Japan Soc. of Applied Physics |c 2011 | |
| 300 | |a Getr. Zählung |b Einzelaufnahme eines Zeitschr.-Heftes. - Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Japanese journal of applied physics |v 50,11,2 | |
| 650 | 0 | 7 | |a Thermophysikalische Eigenschaft |0 (DE-588)4193167-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integriertes Bauelement |0 (DE-588)4161936-5 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |y 2010 |z Tsukuba |2 gnd-content | |
| 689 | 0 | 0 | |a Integriertes Bauelement |0 (DE-588)4161936-5 |D s |
| 689 | 0 | 1 | |a Thermophysikalische Eigenschaft |0 (DE-588)4193167-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Baba, Tetsuya |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-024749307 | ||
Record in the Search Index
| _version_ | 1804148838782468096 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV039890260 |
| ctrlnum | (OCoLC)780118596 (DE-599)GBV683485709 |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01450nam a2200337 cb4500</leader><controlfield tag="001">BV039890260</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20120227 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">120215s2011 ad|| |||| 10||| eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)780118596</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBV683485709</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-384</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Thermal design and thermophysical property for electronics</subfield><subfield code="b">[2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010]</subfield><subfield code="c">ed. by Tetsuya Baba ...</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">Special issue: Thermal design and thermophysical property for electronics</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Tokyo</subfield><subfield code="b">Japan Soc. of Applied Physics</subfield><subfield code="c">2011</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">Getr. Zählung</subfield><subfield code="b">Einzelaufnahme eines Zeitschr.-Heftes. - Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Japanese journal of applied physics</subfield><subfield code="v">50,11,2</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Thermophysikalische Eigenschaft</subfield><subfield code="0">(DE-588)4193167-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integriertes Bauelement</subfield><subfield code="0">(DE-588)4161936-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="y">2010</subfield><subfield code="z">Tsukuba</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integriertes Bauelement</subfield><subfield code="0">(DE-588)4161936-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Thermophysikalische Eigenschaft</subfield><subfield code="0">(DE-588)4193167-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Baba, Tetsuya</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-024749307</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift 2010 Tsukuba gnd-content |
| genre_facet | Konferenzschrift 2010 Tsukuba |
| id | DE-604.BV039890260 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T00:13:30Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-024749307 |
| oclc_num | 780118596 |
| open_access_boolean | |
| owner | DE-384 |
| owner_facet | DE-384 |
| physical | Getr. Zählung Einzelaufnahme eines Zeitschr.-Heftes. - Ill., graph. Darst. |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Japan Soc. of Applied Physics |
| record_format | marc |
| series2 | Japanese journal of applied physics |
| spelling | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] ed. by Tetsuya Baba ... Special issue: Thermal design and thermophysical property for electronics Tokyo Japan Soc. of Applied Physics 2011 Getr. Zählung Einzelaufnahme eines Zeitschr.-Heftes. - Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Japanese journal of applied physics 50,11,2 Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd rswk-swf Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2010 Tsukuba gnd-content Integriertes Bauelement (DE-588)4161936-5 s Thermophysikalische Eigenschaft (DE-588)4193167-1 s DE-604 Baba, Tetsuya Sonstige oth |
| spellingShingle | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| subject_GND | (DE-588)4193167-1 (DE-588)4161936-5 (DE-588)1071861417 |
| title | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] |
| title_alt | Special issue: Thermal design and thermophysical property for electronics |
| title_auth | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] |
| title_exact_search | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] |
| title_full | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] ed. by Tetsuya Baba ... |
| title_fullStr | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] ed. by Tetsuya Baba ... |
| title_full_unstemmed | Thermal design and thermophysical property for electronics [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] ed. by Tetsuya Baba ... |
| title_short | Thermal design and thermophysical property for electronics |
| title_sort | thermal design and thermophysical property for electronics 2nd international symposium on thermal design and thermophysical property for electronics e them 2010 held in tsukuba japan from december 15 to 17 2010 |
| title_sub | [2nd International Symposium on Thermal Design and Thermophysical Property for Electronics (e-Them 2010) held in Tsukuba, Japan, from December 15 to 17, 2010] |
| topic | Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| topic_facet | Thermophysikalische Eigenschaft Integriertes Bauelement Konferenzschrift 2010 Tsukuba |
| work_keys_str_mv | AT babatetsuya thermaldesignandthermophysicalpropertyforelectronics2ndinternationalsymposiumonthermaldesignandthermophysicalpropertyforelectronicsethem2010heldintsukubajapanfromdecember15to172010 AT babatetsuya specialissuethermaldesignandthermophysicalpropertyforelectronics |