Lead-free electronic solders a special issue of the Journal of materials science: Materials in electronics (Springer, 2007)
Thermodynamics and phase diagrams of lead-free solder materials /H. Ipser, et. al. –Phase diagrams of Pb-free solders and their related materials systems /Sinn-Wen Chen, et. al. –Effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints /D. Swenson – Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications /Iver E. Anderson –Rare earth additions to lead-free electronic solders /C. M. L. Wu, et. al. –Compression stress-strain and creep properties of the 52ln-48Sn and 97lm-3Ag low-temperature Pb-free solders /Paul T. Vianco, et. al. –Sn-Zn low temperature solder /Katsuki Suganuma, et. al. –Composite lead-free electronic solders /Fu Guo –Processing and material issues related to lead-free soldering /Laura J. Turbini –Interfacial reaction issues for lead-free electronic solders /C. E. Ho, et. al. –Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys /N. Chawla, et. al. –Defo