Force Sensors for Microelectronic Packaging Applications:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Berlin, Heidelberg
Springer-Verlag Berlin Heidelberg
2005
|
| Schriftenreihe: | Microtechnology and MEMS
|
| Schlagworte: | |
| Online-Zugang: | BFB01 BHS01 BSB01 BTU01 BTW01 DMM01 FAN01 FAW01 FAW02 FCO01 FFW01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FWS01 FWS02 HTW01 HWR01 LCO01 SAB01 SAM01 SBG01 SBR01 SND01 TUM01 UBA01 UBG01 UBM01 UBR01 UBT01 UBW01 UBY01 UER01 UPA01 Volltext |
| Beschreibung: | 1 Online-Ressource v.: digital |
| ISBN: | 9783540221876 9783540269458 |
| DOI: | 10.1007/b138345 |
Internformat
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Datensatz im Suchindex
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| building | Verbundindex |
| bvnumber | BV036650587 |
| classification_rvk | ZN 4100 ZQ 3120 |
| collection | ZDB-1-SCM |
| ctrlnum | (OCoLC)249654136 (DE-599)GBV524966230 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Mess-/Steuerungs-/Regelungs-/Automatisierungstechnik / Mechatronik |
| doi_str_mv | 10.1007/b138345 |
| format | Electronic eBook |
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| id | DE-604.BV036650587 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:46:58Z |
| institution | BVB |
| isbn | 9783540221876 9783540269458 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-020570101 |
| oclc_num | 249654136 |
| open_access_boolean | |
| owner | DE-526 DE-522 DE-634 DE-2070s DE-210 DE-155 DE-BY-UBR DE-150 DE-70 DE-22 DE-BY-UBG DE-54 DE-128 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-898 DE-BY-UBR DE-92 DE-M347 DE-859 DE-573 DE-1028 DE-1050 DE-858 DE-1102 DE-1046 DE-1047 DE-Aug4 DE-706 DE-20 DE-739 DE-355 DE-BY-UBR DE-91 DE-BY-TUM DE-19 DE-BY-UBM DE-29 DE-703 DE-473 DE-BY-UBG DE-384 DE-12 DE-860 DE-B768 DE-523 |
| owner_facet | DE-526 DE-522 DE-634 DE-2070s DE-210 DE-155 DE-BY-UBR DE-150 DE-70 DE-22 DE-BY-UBG DE-54 DE-128 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-898 DE-BY-UBR DE-92 DE-M347 DE-859 DE-573 DE-1028 DE-1050 DE-858 DE-1102 DE-1046 DE-1047 DE-Aug4 DE-706 DE-20 DE-739 DE-355 DE-BY-UBR DE-91 DE-BY-TUM DE-19 DE-BY-UBM DE-29 DE-703 DE-473 DE-BY-UBG DE-384 DE-12 DE-860 DE-B768 DE-523 |
| physical | 1 Online-Ressource v.: digital |
| psigel | ZDB-1-SCM |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | Springer-Verlag Berlin Heidelberg |
| record_format | marc |
| series2 | Microtechnology and MEMS |
| spellingShingle | Force Sensors for Microelectronic Packaging Applications Ingenieurwissenschaften Electronics Engineering Nanotechnology Optical materials System safety Kraftsensor (DE-588)4165452-3 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Drahtbonden (DE-588)4232596-1 gnd Prozessüberwachung (DE-588)4133922-8 gnd |
| subject_GND | (DE-588)4165452-3 (DE-588)4427284-4 (DE-588)4232596-1 (DE-588)4133922-8 |
| title | Force Sensors for Microelectronic Packaging Applications |
| title_auth | Force Sensors for Microelectronic Packaging Applications |
| title_exact_search | Force Sensors for Microelectronic Packaging Applications |
| title_full | Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer, Michael Mayer, Oliver Brand |
| title_fullStr | Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer, Michael Mayer, Oliver Brand |
| title_full_unstemmed | Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer, Michael Mayer, Oliver Brand |
| title_short | Force Sensors for Microelectronic Packaging Applications |
| title_sort | force sensors for microelectronic packaging applications |
| topic | Ingenieurwissenschaften Electronics Engineering Nanotechnology Optical materials System safety Kraftsensor (DE-588)4165452-3 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Drahtbonden (DE-588)4232596-1 gnd Prozessüberwachung (DE-588)4133922-8 gnd |
| topic_facet | Ingenieurwissenschaften Electronics Engineering Nanotechnology Optical materials System safety Kraftsensor Flip-Chip-Technologie Drahtbonden Prozessüberwachung |
| url | https://doi.org/10.1007/b138345 |
| work_keys_str_mv | AT schwizerjurg forcesensorsformicroelectronicpackagingapplications AT brandoliver forcesensorsformicroelectronicpackagingapplications AT mayermichaelandreas forcesensorsformicroelectronicpackagingapplications |