Thermal design and thermophysical property for electronics:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Tokyo
Japan Soc. for Applied Physics
2009
|
| Schriftenreihe: | Japanese journal of Applied Phsics
48,5,3 : special issue |
| Schlagworte: | |
| Beschreibung: | Einzelaufnahme eines Zeitschr.-Heftes |
| Beschreibung: | Getr. Zählung Ill., graph. Darst. |
Internformat
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| illustrated | Illustrated |
| indexdate | 2024-07-09T22:39:53Z |
| institution | BVB |
| language | English |
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| physical | Getr. Zählung Ill., graph. Darst. |
| publishDate | 2009 |
| publishDateSearch | 2009 |
| publishDateSort | 2009 |
| publisher | Japan Soc. for Applied Physics |
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| series2 | Japanese journal of Applied Phsics |
| spelling | Thermal design and thermophysical property for electronics ed. by Tetsuya Baba ... Tokyo Japan Soc. for Applied Physics 2009 Getr. Zählung Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Japanese journal of Applied Phsics 48,5,3 : special issue Einzelaufnahme eines Zeitschr.-Heftes Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd rswk-swf Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2008 Tsukuba gnd-content Integriertes Bauelement (DE-588)4161936-5 s Thermophysikalische Eigenschaft (DE-588)4193167-1 s DE-604 Baba, Tetsuya Sonstige oth |
| spellingShingle | Thermal design and thermophysical property for electronics Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| subject_GND | (DE-588)4193167-1 (DE-588)4161936-5 (DE-588)1071861417 |
| title | Thermal design and thermophysical property for electronics |
| title_auth | Thermal design and thermophysical property for electronics |
| title_exact_search | Thermal design and thermophysical property for electronics |
| title_full | Thermal design and thermophysical property for electronics ed. by Tetsuya Baba ... |
| title_fullStr | Thermal design and thermophysical property for electronics ed. by Tetsuya Baba ... |
| title_full_unstemmed | Thermal design and thermophysical property for electronics ed. by Tetsuya Baba ... |
| title_short | Thermal design and thermophysical property for electronics |
| title_sort | thermal design and thermophysical property for electronics |
| topic | Thermophysikalische Eigenschaft (DE-588)4193167-1 gnd Integriertes Bauelement (DE-588)4161936-5 gnd |
| topic_facet | Thermophysikalische Eigenschaft Integriertes Bauelement Konferenzschrift 2008 Tsukuba |
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