Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
2010
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| Schlagworte: | |
| Online-Zugang: | kostenfrei |
| Beschreibung: | X, 146 S. Ill., graph. Darst. |
Internformat
MARC
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Datensatz im Suchindex
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| any_adam_object | |
| author | Dreßler, Marc |
| author_facet | Dreßler, Marc |
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| indexdate | 2024-07-09T22:11:36Z |
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| spelling | Dreßler, Marc Verfasser aut Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices vorgelegt von Marc Dreßler 2010 X, 146 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Berlin, Techn. Univ., Diss., 2010 (DE-588)4113937-9 Hochschulschrift gnd-content Erscheint auch als Online-Ausgabe urn:nbn:de:kobv:83-opus-25986 https://nbn-resolving.org/urn:nbn:de:kobv:83-opus-25986 Resolving-System kostenfrei Volltext |
| spellingShingle | Dreßler, Marc Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| subject_GND | (DE-588)4113937-9 |
| title | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| title_auth | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| title_exact_search | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| title_full | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices vorgelegt von Marc Dreßler |
| title_fullStr | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices vorgelegt von Marc Dreßler |
| title_full_unstemmed | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices vorgelegt von Marc Dreßler |
| title_short | Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| title_sort | reliability study of stud bump bonding flip chip assemblies on molded interconnect devices |
| topic_facet | Hochschulschrift |
| url | https://nbn-resolving.org/urn:nbn:de:kobv:83-opus-25986 |
| work_keys_str_mv | AT dreßlermarc reliabilitystudyofstudbumpbondingflipchipassembliesonmoldedinterconnectdevices |