Introduction to microsystem technology: a guide for students
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English German |
| Published: |
Chichester, England
Wiley
2008
|
| Series: | Wiley microsystem and nanotechnology series
|
| Subjects: | |
| Online Access: | Publisher description Table of contents only Inhaltsverzeichnis |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | XXIII, 351 S. Ill., graph. Darst. |
| ISBN: | 9780470058619 0470058617 |
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MARC
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| 240 | 1 | 0 | |a Einführung in die Mikrosystemtechnik |
| 245 | 1 | 0 | |a Introduction to microsystem technology |b a guide for students |c Gerald Gerlach ; Wolfram Dötzel. Translated by Dörte Müller |
| 264 | 1 | |a Chichester, England |b Wiley |c 2008 | |
| 300 | |a XXIII, 351 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Wiley microsystem and nanotechnology series | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 7 | |a Microélectronique |2 ram | |
| 650 | 4 | |a Microelectromechanical systems |x Design and construction | |
| 650 | 4 | |a System design | |
| 650 | 4 | |a Microelectronics | |
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Record in the Search Index
| _version_ | 1804138017500168192 |
|---|---|
| adam_text | Contents
Preface
xi
List of Symbols
xv
List of Abbreviations
xxi
1
Introduction
1
1.1
What is a Microsystem?
3
1.2
Microelectronics and Microsystem Technology
6
1.3
Areas of Application and Trends of Development
8
1.4
Example: Yaw Rate Sensor
9
1.4.1
Structure and Function
10
1.4.2
Function Components and Elements
10
Exercises
15
References
15
2
Scaling and Similarity
17
2.1
Scaling
17
2.2
Similarity and Dimensionless Numbers
22
Exercises
25
References
26
3
Materials
27
3.1
Overview
27
3.2
Single Crystalline Silicon
29
3.2.1
Description of the Orientation of Planes and
Directions in a Crystal
31
3.2.2
Surface Characteristics at Different Orientations
37
3.2.3 Anisotropie
Elastic Characteristics
38
3.2.4
Mechanical Strength
41
3.2.5
Silicon Wafer
44
3.3
Glasses
47
3.3.1
General Characteristics of Glass
47
3.3.2
Visco-elastic Behavior
49
3.3.3
Glasses in Microsystem Technology
52
3.4
Polymers
53
vi
CONTENTS
3.4.1
Thermoplastic Materials in Microsystem Technology
54
3.4.2
Photoresists
55
3.5
Thin Films
58
3.5.1
Silicon Dioxide, Silicon Nitride
61
3.5.2
Conducting Layers
62
3.5.3
Polysilicon Layers
63
3.6
Comparison of Material Characteristics
63
Exercises
64
References
64
67
67
72
72
77
78
78
79
81
82
83
83
83
84
85
86
88
89
92
93
93
94
94
97
97
97
98
100
103
105
112
114
114
117
119
120
121
4
Microfabrication
4.1
Overview
4.2
Cleanliness During Production
4.2.1
Clean Room Technology
4.2.2
Wafer Cleaning
4.3
Lithography
4.3.1
Principle
4.3.2
Lithographic Process
4.3.3
Minimum Structurable Line Width
4.3.4
Double-sided Lithography
4.3.5
Lithography in Structures with Deep Profiles
4.4
Thin-film Formation
4.4.1
Overview
4.4.2
Layer Conformity
4.4.3
Thermal Oxidation
4.4.4
Evaporation
4.4.5
Sputtering
4.4.6
Chemical Vapor Deposition
4.4.7
Comparison
4.5
Layer
Patterning
4.5.1
Basics
4.5.2
Wet Etching
4.5.3
Dry Etching
4.5.4
Lift-off Process
4.6
Anisotropie
Wet Chemical Deep Etching
4.6.1
Principle
4.6.2
Anisotropie
Etching Solutions
4.6.3
Etch Rates
4.6.4
Etch Stop Techniques
4.6.5
Etch Figures
4.6.6
Design of Etch Masks
4.7
Doping
4.7.1
Diffusion
4.7.2
Ion Implantation
4.7.3
Comparison of Doping Techniques
4.8
Bonding Techniques
4.8.1
Eutectic Bonding
CONTENTS
vii
4.8.2
Anodic Bonding
121
4.8.3
Silicon Direct Bonding
122
4.8.4
Comparison of Bonding Techniques
123
4.9
Insulation Techniques
124
4.9.1
SIMOX
Technique
124
4.9.2
BESOI Technique
125
4.9.3
Smart-cut Technique
127
4.10
Surface Micromachining
128
4.10.1
Principle
128
4.10.2
Production of Hollow Spaces
130
4.10.3
Adhesion of Movable Structures
133
4.10.4
Comparison of Bulk and Surface Micromachining
135
4.11
Near-surface Micromachining
136
4.11.1
Principle
136
4.11.2
Techniques
137
4.12 HÄRMST
139
4.12.1
Definition
139
4.12.2 LIGA
Technique
139
4.13
Miniaturized Classical Techniques
141
4.13.1
Micro Injection Molding
142
4.13.2
Micro Hot Embossing
145
4.13.3
Micro Cutting
146
4.14
Selection of
Microtechnical
Manufacturing Techniques
148
Exercises
151
References
153
Packaging
155
5.1
Tasks and Requirements
155
5.1.1
Tasks
155
5.1.2
Packaging for Reliability
159
5.2
Functions of Packaging
159
5.2.1
Mechanical Links
159
5.2.2
Electrical Connections
164
5.2.3
Heat Dissipation
165
5.2.4
Encapsulation and Packaging
166
Exercises
170
References
170
Function and Form Elements in Microsystem Technology
171
6.1
Mechanical Elements
171
6.1.1
Sensitivity in Surface Normal Direction
174
6.1.2
Transverse Sensitivity
176
6.1.3
Eigenfrequency
177
6.1.4
Damping
177
6.1.5
Quality Factor
179
6.1.6
Amplitude Response
179
6.1.7
Stress at the Fixation Point
180
vüi CONTENTS
6.2
Fluidic
Elements 184
6.2.1
Parameters and Model Systems
184
6.2.2
Element Types
187
6.2.3
Fluidic Interfaces
189
6.2.4
Design of Microfluidic
Elements and Components
190
6.3
Thermal Elements
194
6.3.1
Thermal-electric Analogies
194
6.3.2
Basic Equations for Heat Transport
195
6.3.3
Equivalent Circuits
199
Exercises
203
References
205
7
Sensors and Actuators
207
7.1
Reversible and Parametric Transducers
208
7.1.1
Reversible Transducers
208
7.1.2
Parametric Transducers
214
7.1.3
Stationary Reversible Transducers
216
7.2
Transducers for Sensors and Actuators
218
7.2.1
Electrostatic Transducers
219
7.2.2
Piezoelectric Transducers
224
7.2.3
Electrodynamic Transducers
228
7.2.4
Thermomechanical Transducers
231
7.2.5
Piezoresistive Transducers
238
Exercises
247
References
254
8
Design of Microsystems
255
8.1
Design Methods and Tools
255
8.2
Systems with Lumped Parameters
261
8.2.1
Behavioral Description of Electromechanical Systems
261
8.2.2
Analysis of the Static Behavior of Electromechanical Systems
261
8.2.3
Analysis of Electromechanical Systems for Harmonic Loads
264
8.2.4
Transient Analysis of Electromechanical Systems
267
8.3
Systems with Distributed Parameters
269
8.3.1
Behavioral Description Based on Analytical Models
269
8.3.2
Numerical Methods Based on the Finite Element Method
272
8.3.3
Macro-modelling of Complex Systems by Order Reduction
273
References
282
9
Effect of Technological Processes on Microsystem Properties
283
9.1
Parameter-based Microsystem Design
283
9.2
Robust Microsystem Design
286
Exercises
293
Reference
293
10
The Future of Microsystems
295
10.1
Status and Trends in Microsystem Technology
295
10.2
Microoptical Applications
300
CONTENTS ix
10.2.1 Displays and Light Modulators 300
10.2.2
Infrared
Sensor
Arrays
301
10.2.3
Spectrometers
307
10.3 Probe Tips 307
10.4 RF Microsystems 310
10.5
Actuators
312
10.6 Microfluidic Systems 316
10.6.1 Micropumps and
Microvalves
317
10.6.2 InkJet
Print Heads
318
10.7 Chemical,
Biological and Medical Systems
319
10.7.1
Microreactors
319
10.7.2
Lab on a Chip
320
10.8
Energy Harvesting and Wireless Communications
320
10.9
Micro Fuel Cells
326
References
329
Appendix A Physical Constants
331
Appendix
В
Coordinate Transformation
333
B.I Elastic Coefficients
334
B.2 Piezoresistive Coefficients
336
References
338
Appendix
С
Properties of Silicon Dioxide and Silicon Nitride Layers
339
References
340
Appendix
D
Nomenclature of Thin-film Processes
341
Reference
342
Appendix
E
Adhesion of Surface Micromechanical Structures
343
E.I Capillary Forces
343
E.2 Critical Length of Cantilever Springs
344
Reference
345
Index
347
|
| adam_txt |
Contents
Preface
xi
List of Symbols
xv
List of Abbreviations
xxi
1
Introduction
1
1.1
What is a Microsystem?
3
1.2
Microelectronics and Microsystem Technology
6
1.3
Areas of Application and Trends of Development
8
1.4
Example: Yaw Rate Sensor
9
1.4.1
Structure and Function
10
1.4.2
Function Components and Elements
10
Exercises
15
References
15
2
Scaling and Similarity
17
2.1
Scaling
17
2.2
Similarity and Dimensionless Numbers
22
Exercises
25
References
26
3
Materials
27
3.1
Overview
27
3.2
Single Crystalline Silicon
29
3.2.1
Description of the Orientation of Planes and
Directions in a Crystal
31
3.2.2
Surface Characteristics at Different Orientations
37
3.2.3 Anisotropie
Elastic Characteristics
38
3.2.4
Mechanical Strength
41
3.2.5
Silicon Wafer
44
3.3
Glasses
47
3.3.1
General Characteristics of Glass
47
3.3.2
Visco-elastic Behavior
49
3.3.3
Glasses in Microsystem Technology
52
3.4
Polymers
53
vi
CONTENTS
3.4.1
Thermoplastic Materials in Microsystem Technology
54
3.4.2
Photoresists
55
3.5
Thin Films
58
3.5.1
Silicon Dioxide, Silicon Nitride
61
3.5.2
Conducting Layers
62
3.5.3
Polysilicon Layers
63
3.6
Comparison of Material Characteristics
63
Exercises
64
References
64
67
67
72
72
77
78
78
79
81
82
83
83
83
84
85
86
88
89
92
93
93
94
94
97
97
97
98
100
103
105
112
114
114
117
119
120
121
4
Microfabrication
4.1
Overview
4.2
Cleanliness During Production
4.2.1
Clean Room Technology
4.2.2
Wafer Cleaning
4.3
Lithography
4.3.1
Principle
4.3.2
Lithographic Process
4.3.3
Minimum Structurable Line Width
4.3.4
Double-sided Lithography
4.3.5
Lithography in Structures with Deep Profiles
4.4
Thin-film Formation
4.4.1
Overview
4.4.2
Layer Conformity
4.4.3
Thermal Oxidation
4.4.4
Evaporation
4.4.5
Sputtering
4.4.6
Chemical Vapor Deposition
4.4.7
Comparison
4.5
Layer
Patterning
4.5.1
Basics
4.5.2
Wet Etching
4.5.3
Dry Etching
4.5.4
Lift-off Process
4.6
Anisotropie
Wet Chemical Deep Etching
4.6.1
Principle
4.6.2
Anisotropie
Etching Solutions
4.6.3
Etch Rates
4.6.4
Etch Stop Techniques
4.6.5
Etch Figures
4.6.6
Design of Etch Masks
4.7
Doping
4.7.1
Diffusion
4.7.2
Ion Implantation
4.7.3
Comparison of Doping Techniques
4.8
Bonding Techniques
4.8.1
Eutectic Bonding
CONTENTS
vii
4.8.2
Anodic Bonding
121
4.8.3
Silicon Direct Bonding
122
4.8.4
Comparison of Bonding Techniques
123
4.9
Insulation Techniques
124
4.9.1
SIMOX
Technique
124
4.9.2
BESOI Technique
125
4.9.3
Smart-cut Technique
127
4.10
Surface Micromachining
128
4.10.1
Principle
128
4.10.2
Production of Hollow Spaces
130
4.10.3
Adhesion of Movable Structures
133
4.10.4
Comparison of Bulk and Surface Micromachining
135
4.11
Near-surface Micromachining
136
4.11.1
Principle
136
4.11.2
Techniques
137
4.12 HÄRMST
139
4.12.1
Definition
139
4.12.2 LIGA
Technique
139
4.13
Miniaturized Classical Techniques
141
4.13.1
Micro Injection Molding
142
4.13.2
Micro Hot Embossing
145
4.13.3
Micro Cutting
146
4.14
Selection of
Microtechnical
Manufacturing Techniques
148
Exercises
151
References
153
Packaging
155
5.1
Tasks and Requirements
155
5.1.1
Tasks
155
5.1.2
Packaging for Reliability
159
5.2
Functions of Packaging
159
5.2.1
Mechanical Links
159
5.2.2
Electrical Connections
164
5.2.3
Heat Dissipation
165
5.2.4
Encapsulation and Packaging
166
Exercises
170
References
170
Function and Form Elements in Microsystem Technology
171
6.1
Mechanical Elements
171
6.1.1
Sensitivity in Surface Normal Direction
174
6.1.2
Transverse Sensitivity
176
6.1.3
Eigenfrequency
177
6.1.4
Damping
177
6.1.5
Quality Factor
179
6.1.6
Amplitude Response
179
6.1.7
Stress at the Fixation Point
180
vüi CONTENTS
6.2
Fluidic
Elements 184
6.2.1
Parameters and Model Systems
184
6.2.2
Element Types
187
6.2.3
Fluidic Interfaces
189
6.2.4
Design of Microfluidic
Elements and Components
190
6.3
Thermal Elements
194
6.3.1
Thermal-electric Analogies
194
6.3.2
Basic Equations for Heat Transport
195
6.3.3
Equivalent Circuits
199
Exercises
203
References
205
7
Sensors and Actuators
207
7.1
Reversible and Parametric Transducers
208
7.1.1
Reversible Transducers
208
7.1.2
Parametric Transducers
214
7.1.3
Stationary Reversible Transducers
216
7.2
Transducers for Sensors and Actuators
218
7.2.1
Electrostatic Transducers
219
7.2.2
Piezoelectric Transducers
224
7.2.3
Electrodynamic Transducers
228
7.2.4
Thermomechanical Transducers
231
7.2.5
Piezoresistive Transducers
238
Exercises
247
References
254
8
Design of Microsystems
255
8.1
Design Methods and Tools
255
8.2
Systems with Lumped Parameters
261
8.2.1
Behavioral Description of Electromechanical Systems
261
8.2.2
Analysis of the Static Behavior of Electromechanical Systems
261
8.2.3
Analysis of Electromechanical Systems for Harmonic Loads
264
8.2.4
Transient Analysis of Electromechanical Systems
267
8.3
Systems with Distributed Parameters
269
8.3.1
Behavioral Description Based on Analytical Models
269
8.3.2
Numerical Methods Based on the Finite Element Method
272
8.3.3
Macro-modelling of Complex Systems by Order Reduction
273
References
282
9
Effect of Technological Processes on Microsystem Properties
283
9.1
Parameter-based Microsystem Design
283
9.2
Robust Microsystem Design
286
Exercises
293
Reference
293
10
The Future of Microsystems
295
10.1
Status and Trends in Microsystem Technology
295
10.2
Microoptical Applications
300
CONTENTS ix
10.2.1 Displays and Light Modulators 300
10.2.2
Infrared
Sensor
Arrays
301
10.2.3
Spectrometers
307
10.3 Probe Tips 307
10.4 RF Microsystems 310
10.5
Actuators
312
10.6 Microfluidic Systems 316
10.6.1 Micropumps and
Microvalves
317
10.6.2 InkJet
Print Heads
318
10.7 Chemical,
Biological and Medical Systems
319
10.7.1
Microreactors
319
10.7.2
Lab on a Chip
320
10.8
Energy Harvesting and Wireless Communications
320
10.9
Micro Fuel Cells
326
References
329
Appendix A Physical Constants
331
Appendix
В
Coordinate Transformation
333
B.I Elastic Coefficients
334
B.2 Piezoresistive Coefficients
336
References
338
Appendix
С
Properties of Silicon Dioxide and Silicon Nitride Layers
339
References
340
Appendix
D
Nomenclature of Thin-film Processes
341
Reference
342
Appendix
E
Adhesion of Surface Micromechanical Structures
343
E.I Capillary Forces
343
E.2 Critical Length of Cantilever Springs
344
Reference
345
Index
347 |
| any_adam_object | 1 |
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| author | Gerlach, Gerald |
| author_GND | (DE-588)112280021 (DE-588)108263193 |
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| discipline | Handwerk und Gewerbe / Verschiedene Technologien Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Handwerk und Gewerbe / Verschiedene Technologien Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV035069754 |
| illustrated | Illustrated |
| index_date | 2024-07-02T22:03:45Z |
| indexdate | 2024-07-09T21:21:30Z |
| institution | BVB |
| isbn | 9780470058619 0470058617 |
| language | English German |
| lccn | 2007050172 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-016738150 |
| oclc_num | 244053398 |
| open_access_boolean | |
| owner | DE-703 DE-92 DE-523 DE-1102 |
| owner_facet | DE-703 DE-92 DE-523 DE-1102 |
| physical | XXIII, 351 S. Ill., graph. Darst. |
| publishDate | 2008 |
| publishDateSearch | 2008 |
| publishDateSort | 2008 |
| publisher | Wiley |
| record_format | marc |
| series2 | Wiley microsystem and nanotechnology series |
| spelling | Gerlach, Gerald Verfasser (DE-588)112280021 aut Einführung in die Mikrosystemtechnik Introduction to microsystem technology a guide for students Gerald Gerlach ; Wolfram Dötzel. Translated by Dörte Müller Chichester, England Wiley 2008 XXIII, 351 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Wiley microsystem and nanotechnology series Includes bibliographical references and index Microélectronique ram Microelectromechanical systems Design and construction System design Microelectronics Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf MEMS (DE-588)4824724-8 gnd rswk-swf MEMS (DE-588)4824724-8 s Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Dötzel, Wolfram 1941-2023 Sonstige (DE-588)108263193 oth http://www.loc.gov/catdir/enhancements/fy0806/2007050172-d.html Publisher description http://www.loc.gov/catdir/enhancements/fy0806/2007050172-t.html Table of contents only Digitalisierung UB Bayreuth application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016738150&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Gerlach, Gerald Introduction to microsystem technology a guide for students Microélectronique ram Microelectromechanical systems Design and construction System design Microelectronics Mikrosystemtechnik (DE-588)4221617-5 gnd MEMS (DE-588)4824724-8 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4824724-8 |
| title | Introduction to microsystem technology a guide for students |
| title_alt | Einführung in die Mikrosystemtechnik |
| title_auth | Introduction to microsystem technology a guide for students |
| title_exact_search | Introduction to microsystem technology a guide for students |
| title_exact_search_txtP | Introduction to microsystem technology a guide for students |
| title_full | Introduction to microsystem technology a guide for students Gerald Gerlach ; Wolfram Dötzel. Translated by Dörte Müller |
| title_fullStr | Introduction to microsystem technology a guide for students Gerald Gerlach ; Wolfram Dötzel. Translated by Dörte Müller |
| title_full_unstemmed | Introduction to microsystem technology a guide for students Gerald Gerlach ; Wolfram Dötzel. Translated by Dörte Müller |
| title_short | Introduction to microsystem technology |
| title_sort | introduction to microsystem technology a guide for students |
| title_sub | a guide for students |
| topic | Microélectronique ram Microelectromechanical systems Design and construction System design Microelectronics Mikrosystemtechnik (DE-588)4221617-5 gnd MEMS (DE-588)4824724-8 gnd |
| topic_facet | Microélectronique Microelectromechanical systems Design and construction System design Microelectronics Mikrosystemtechnik MEMS |
| url | http://www.loc.gov/catdir/enhancements/fy0806/2007050172-d.html http://www.loc.gov/catdir/enhancements/fy0806/2007050172-t.html http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016738150&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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