CMOS force sensors for wire bonding and flip chip process characterization:
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Microfilm Book |
| Language: | English |
| Published: |
2003
|
| Edition: | [Mikrofiche-Ausg.] |
| Subjects: | |
| Physical Description: | II, 149 Bl. Ill., graph. Darst. |
Staff View
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV024511217 | ||
| 003 | DE-604 | ||
| 005 | 20090910 | ||
| 007 | he|uuuuuuuucu | ||
| 008 | 090924s2003 ad|| bm||| 00||| eng d | ||
| 035 | |a (OCoLC)916650245 | ||
| 035 | |a (DE-599)BVBBV024511217 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-83 | ||
| 100 | 1 | |a Schwizer, Jürg |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a CMOS force sensors for wire bonding and flip chip process characterization |c presented by Jürg Schwizer |
| 250 | |a [Mikrofiche-Ausg.] | ||
| 264 | 1 | |c 2003 | |
| 300 | |a II, 149 Bl. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b h |2 rdamedia | ||
| 338 | |b he |2 rdacarrier | ||
| 502 | |a Zürich, Eidgenöss. Techn. Hochsch., Diss. | ||
| 533 | |a Mikrofiche-Ausgabe |n 3 Mikrofiches | ||
| 650 | 0 | 7 | |a Piezoelektrische Messtechnik |0 (DE-588)4174663-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a CMOS-Schaltung |0 (DE-588)4148111-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Flip-Chip-Technologie |0 (DE-588)4427284-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kraftsensor |0 (DE-588)4165452-3 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a CMOS-Schaltung |0 (DE-588)4148111-2 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Kraftsensor |0 (DE-588)4165452-3 |D s |
| 689 | 2 | |5 DE-604 | |
| 689 | 3 | 0 | |a Piezoelektrische Messtechnik |0 (DE-588)4174663-6 |D s |
| 689 | 3 | |5 DE-604 | |
| 689 | 4 | 0 | |a Flip-Chip-Technologie |0 (DE-588)4427284-4 |D s |
| 689 | 4 | |5 DE-604 | |
| 776 | 0 | 8 | |i Reproduktion von |a Schwizer, Jürg |t CMOS force sensors for wire bonding and flip chip process characterization |d 2003 |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-018485470 | ||
Record in the Search Index
| _version_ | 1804140510709809152 |
|---|---|
| any_adam_object | |
| author | Schwizer, Jürg |
| author_facet | Schwizer, Jürg |
| author_role | aut |
| author_sort | Schwizer, Jürg |
| author_variant | j s js |
| building | Verbundindex |
| bvnumber | BV024511217 |
| ctrlnum | (OCoLC)916650245 (DE-599)BVBBV024511217 |
| edition | [Mikrofiche-Ausg.] |
| format | Thesis Microfilm Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01799nam a2200481 c 4500</leader><controlfield tag="001">BV024511217</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20090910 </controlfield><controlfield tag="007">he|uuuuuuuucu</controlfield><controlfield tag="008">090924s2003 ad|| bm||| 00||| eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)916650245</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV024511217</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Schwizer, Jürg</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">CMOS force sensors for wire bonding and flip chip process characterization</subfield><subfield code="c">presented by Jürg Schwizer</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">[Mikrofiche-Ausg.]</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">II, 149 Bl.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">h</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">he</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="502" ind1=" " ind2=" "><subfield code="a">Zürich, Eidgenöss. Techn. Hochsch., Diss.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="a">Mikrofiche-Ausgabe</subfield><subfield code="n">3 Mikrofiches</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Piezoelektrische Messtechnik</subfield><subfield code="0">(DE-588)4174663-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">CMOS-Schaltung</subfield><subfield code="0">(DE-588)4148111-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Flip-Chip-Technologie</subfield><subfield code="0">(DE-588)4427284-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kraftsensor</subfield><subfield code="0">(DE-588)4165452-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">CMOS-Schaltung</subfield><subfield code="0">(DE-588)4148111-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Kraftsensor</subfield><subfield code="0">(DE-588)4165452-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="3" ind2="0"><subfield code="a">Piezoelektrische Messtechnik</subfield><subfield code="0">(DE-588)4174663-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="3" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="4" ind2="0"><subfield code="a">Flip-Chip-Technologie</subfield><subfield code="0">(DE-588)4427284-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="4" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Reproduktion von</subfield><subfield code="a">Schwizer, Jürg</subfield><subfield code="t">CMOS force sensors for wire bonding and flip chip process characterization</subfield><subfield code="d">2003</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-018485470</subfield></datafield></record></collection> |
| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV024511217 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T22:01:08Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-018485470 |
| oclc_num | 916650245 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | II, 149 Bl. Ill., graph. Darst. |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| record_format | marc |
| spelling | Schwizer, Jürg Verfasser aut CMOS force sensors for wire bonding and flip chip process characterization presented by Jürg Schwizer [Mikrofiche-Ausg.] 2003 II, 149 Bl. Ill., graph. Darst. txt rdacontent h rdamedia he rdacarrier Zürich, Eidgenöss. Techn. Hochsch., Diss. Mikrofiche-Ausgabe 3 Mikrofiches Piezoelektrische Messtechnik (DE-588)4174663-6 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf CMOS-Schaltung (DE-588)4148111-2 gnd rswk-swf Flip-Chip-Technologie (DE-588)4427284-4 gnd rswk-swf Kraftsensor (DE-588)4165452-3 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Verbindungstechnik (DE-588)4129183-9 s DE-604 CMOS-Schaltung (DE-588)4148111-2 s Kraftsensor (DE-588)4165452-3 s Piezoelektrische Messtechnik (DE-588)4174663-6 s Flip-Chip-Technologie (DE-588)4427284-4 s Reproduktion von Schwizer, Jürg CMOS force sensors for wire bonding and flip chip process characterization 2003 |
| spellingShingle | Schwizer, Jürg CMOS force sensors for wire bonding and flip chip process characterization Piezoelektrische Messtechnik (DE-588)4174663-6 gnd Verbindungstechnik (DE-588)4129183-9 gnd CMOS-Schaltung (DE-588)4148111-2 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| subject_GND | (DE-588)4174663-6 (DE-588)4129183-9 (DE-588)4148111-2 (DE-588)4427284-4 (DE-588)4165452-3 (DE-588)4113937-9 |
| title | CMOS force sensors for wire bonding and flip chip process characterization |
| title_auth | CMOS force sensors for wire bonding and flip chip process characterization |
| title_exact_search | CMOS force sensors for wire bonding and flip chip process characterization |
| title_full | CMOS force sensors for wire bonding and flip chip process characterization presented by Jürg Schwizer |
| title_fullStr | CMOS force sensors for wire bonding and flip chip process characterization presented by Jürg Schwizer |
| title_full_unstemmed | CMOS force sensors for wire bonding and flip chip process characterization presented by Jürg Schwizer |
| title_short | CMOS force sensors for wire bonding and flip chip process characterization |
| title_sort | cmos force sensors for wire bonding and flip chip process characterization |
| topic | Piezoelektrische Messtechnik (DE-588)4174663-6 gnd Verbindungstechnik (DE-588)4129183-9 gnd CMOS-Schaltung (DE-588)4148111-2 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| topic_facet | Piezoelektrische Messtechnik Verbindungstechnik CMOS-Schaltung Flip-Chip-Technologie Kraftsensor Hochschulschrift |
| work_keys_str_mv | AT schwizerjurg cmosforcesensorsforwirebondingandflipchipprocesscharacterization |