MEMS and microsystems: design, manufacture, and nanoscale engineering
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley
2008
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| Ausgabe: | 2. ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XXV, 550 S. Ill., graph. Darst. |
| ISBN: | 0470083018 9780470083017 |
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| 245 | 1 | 0 | |a MEMS and microsystems |b design, manufacture, and nanoscale engineering |c Tai-Ran Hsu |
| 250 | |a 2. ed. | ||
| 264 | 1 | |a Hoboken, NJ |b Wiley |c 2008 | |
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| 650 | 7 | |a Nanotechnologie |2 ram | |
| 650 | 7 | |a Systèmes microélectromécaniques - Conception et construction |2 ram | |
| 650 | 7 | |a Électronique - Matériaux |2 ram | |
| 650 | 4 | |a Microelectromechanical systems | |
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 4 | |a Microelectronics | |
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| adam_text | MEMSAND MICROSYSTEMS DESIGN, MANUFACTURE, AND NANOSCALE ENGINEERING
SECOND EDITION TAI-RAN HSU MICROSYSTEMS DESIGN AND PACKAGING LABORATORY
DEPARTMENT OF MECHANICAL AND AEROSPACE ENGINEERING SAN JOSE STATE
UNIVERSITY WILEY JOHN WILEY & SONS, INC. CONTENTS PREFACE XVII PREFACE
TO THE FIRST EDITION XIX SUGGESTIONS TO INSTRUCTORS XXIII OVERVIEW OF
MEMS AND MICROSYSTEMS 1 1.1 MEMS AND MICROSYSTEMS / 1 1.2 TYPICAL MEMS
AND MICROSYSTEMS PRODUCTS / 7 1.2.1 MICROGEARS / 7 1.2.2 MICROMOTORS / 7
1.2.3 MICROTURBINES / 7 1.2.4 MICRO-OPTICAL COMPONENTS / 7 1.3 EVOLUTION
OF MICROFABRICATION / 10 1.4 MICROSYSTEMS AND MICROELECTRONICS / 11 1.5
MULTIDISCIPLINARY NATURE OF MICROSYSTEMS DESIGN AND MANUFACTURE / 13 1.6
MICROSYSTEMS AND MINIATURIZATION / 15 1.7 APPLICATION OF MICROSYSTEMS IN
AUTOMOTIVE INDUSTRY / 21 1.7.1 SAFETY / 22 1.7.2 ENGINE AND POWER TRAINS
/ 24 1.7.3 COMFORT AND CONVENIENCE / 24 1.7.4 VEHICLE DIAGNOSTICS AND
HEALTH MONITORING / 24 1.7.5 FUTURE AUTOMOTIVE APPLICATIONS / 26 1.8
APPLICATION OF MICROSYSTEMS IN OTHER INDUSTRIES / 27 VII VIII CONTENTS
1.8.1 APPLICATION IN HEALTH CARE INDUSTRY / 27 1.8.2 APPLICATION IN
AEROSPACE INDUSTRY / 28 1.8.3 APPLICATION IN INDUSTRIAL PRODUCTS / 29
1.8.4 APPLICATION IN CONSUMER PRODUCTS / 29 1.8.5 APPLICATION IN
TELECOMMUNICATIONS / 30 1.9 MARKETS FOR MICROSYSTEMS / 30 PROBLEMS / 32
WORKING PRINCIPLES OF MICROSYSTEMS 35 2.1 INTRODUCTION / 35 2.2
MICROSENSORS / 35 2.2.1 ACOUSTIC WAVE SENSORS / 36 2.2.2 BIOMEDICAL AND
BIOSENSORS / 37 2.2.3 CHEMICAL SENSORS / 40 2.2.4 OPTICAL SENSORS / 42
2.2.5 PRESSURE SENSORS / 44 2.2.6 THERMAL SENSORS / 50 2.3
MICROACTUATION / 53 2.3.1 ACTUATION USING THERMAL FORCES / 53 2.3.2
ACTUATION USING SHAPE MEMORY ALLOYS / 54 2.3.3 ACTUATION USING
PIEZOELECTRIC EFFECT / 54 2.3.4 ACTUATION USING ELECTROSTATIC FORCES /
55 2.4 MEMS WITH MICROACTUATORS / 59 2.4.1 MICROGRIPPERS / 59 2.4.2
MINIATURE MICROPHONES / 61 2.4.3 MICROMOTORS / 64 2.5 MICROACTUATORS
WITH MECHANICAL INERTIA / 66 2.5.1 MICROACCELEROMETERS / 66 2.5.2
MICROGYROSCOPES / 70 2.6 MICROFLUIDICS / 72 2.6.1 MICROVALVES / 74 2.6.2
MICROPUMPS / 75 2.6.3 MICRO-HEAT PIPES / 75 PROBLEMS / 77 ENGINEERING
SCIENCE FOR MICROSYSTEMS DESIGN AND FABRICATION 83 3.1 INTRODUCTION / 83
3.2 ATOMIC STRUCTURE OF MATTER / 83 CONTENTS 3.3 IONS AND IONIZATION /
86 3.4 MOLECULAR THEORY OF MATTER AND INTERMOLECULAR FORCES / 87 3.5
DOPING OF SEMICONDUCTORS / 89 3.6 DIFFUSION PROCESS / 92 3.7 PLASMA
PHYSICS / 99 3.8 ELECTROCHEMISTRY / 100 3.8.1 ELECTROLYSIS / 101 3.8.2
ELECTROHYDRODYNAMICS / 102 PROBLEMS / 105 ENGINEERING MECHANICS FOR
MICROSYSTEMS DESIGN 109 4.1 INTRODUCTION / 109 4.2 STATIC BENDING OF
THIN PLATES / 110 4.2.1 BENDING OF CIRCULAR PLATES WITH EDGE FIXED / 112
4.2.2 BENDING OF RECTANGULAR PLATES WITH ALL EDGES FIXED / 114 4.2.3
BENDING OF SQUARE PLATES WITH EDGES FIXED / 116 4.3 MECHANICAL VIBRATION
/ 119 4.3.1 GENERAL FORMULATION / 119 4.3.2 RESONANT VIBRATION / 123
4.3.3 MICROACCELEROMETERS / 125 4.3.4 DESIGN THEORY OF ACCELEROMETERS /
126 4.3.5 DAMPING COEFFICIENTS / 134 4.3.6 RESONANT MICROSENSORS / 144
4.4 THERMOMECHANICS / 150 4.4.1 THERMAL EFFECTS ON MECHANICAL STRENGTH
OF MATERIALS / 150 4.4.2 CREEP DEFORMATION / 150 4.4.3 THERMAL STRESSES
/ 152 4.5 FRACTURE MECHANICS / 165 4.5.1 STRESS INTENSITY FACTORS / 166
4.5.2 FRACTURE TOUGHNESS / 167 4.5.3 INTERFACIAL FRACTURE MECHANICS /
169 4.6 THIN-FILM MECHANICS / 172 4.7 OVERVIEW OF FINITE ELEMENT STRESS
ANALYSIS / 173 4.7.1 THE PRINCIPLE / 173 4.7.2 ENGINEERING APPLICATIONS
/ 175 4.7.3 INPUT INFORMATION TO FEA / 175 CONTENTS 4.7.4 OUTPUT FROM
FEA / 175 4.7.5 GRAPHICAL OUTPUT / 176 4.7.6 GENERAL REMARKS / 176
PROBLEMS / 178 5 THERMOFLUID ENGINEERING AND MICROSYSTEMS DESIGN 183 5.1
INTRODUCTION / 183 5.2 OVERVIEW OF BASICS OF FLUID MECHANICS AT MACRO-
AND MESOSCALES / 184 5.2.1 VISCOSITY OF FLUIDS / 184 5.2.2 STREAMLINES
AND STREAM TUBES / 186 5.2.3 CONTROL VOLUMES AND CONTROL SURFACES / 187
5.2.4 FLOW PATTERNS AND REYNOLDS NUMBER / 187 5.3 BASIC EQUATIONS IN
CONTINUUM FLUID DYNAMICS / 187 5.3.1 CONTINUITY EQUATION / 187 5.3.2
MOMENTUM EQUATION / 190 5.3.3 EQUATION OF MOTION / 192 5.4 LAMINAR FLUID
FLOW IN CIRCULAR CONDUITS / 195 5.5 COMPUTATIONAL FLUID DYNAMICS / 198
5.6 INCOMPRESSIBLE FLUID FLOW IN MICROCONDUITS / 199 5.6.1 SURFACE
TENSION / 199 5.6.2 CAPILLARY EFFECT / 201 5.6.3 MICROPUMPING / 203 5.7
OVERVIEW OF HEAT CONDUCTION IN SOLIDS / 204 5.7.1 GENERAL PRINCIPLE OF
HEAT CONDUCTION / 204 5.7.2 FOURIER LAW OF HEAT CONDUCTION / 205 5.7.3
HEAT CONDUCTION EQUATION / 207 5.7.4 NEWTON S COOLING LAW / 208 5.7.5
SOLID-FLUID INTERACTION / 209 5.7.6 BOUNDARY CONDITIONS / 210 5.8 HEAT
CONDUCTION IN MULTILAYERED THIN FILMS / 215 5.9 HEAT CONDUCTION IN
SOLIDS AT SUBMICROMETER SCALE / 220 PROBLEMS / 221 6 SCALING LAWS IN
MINIATURIZATION 227 6.1 INTRODUCTION TO SCALING / 227 6.2 SCALING IN
GEOMETRY / 228 CONTENTS XI 6.3 SCALING IN RIGID-BODY DYNAMICS / 230
6.3.1 SCALING IN DYNAMIC FORCES / 230 6.3.2 TRIMMER FORCE SCALING VECTOR
/ 231 6.4 SCALING IN ELECTROSTATIC FORCES / 233 6.5 SCALING OF
ELECTROMAGNETIC FORCES / 235 6.6 SCALING IN ELECTRICITY / 237 6.7
SCALING IN FLUID MECHANICS / 238 6.8 SCALING IN HEAT TRANSFER / 242
6.8.1 SCALING IN HEAT CONDUCTION / 242 6.8.2 SCALING IN HEAT CONVECTION
/ 243 PROBLEMS / 244 7 MATERIALS FOR MEMS AND MICROSYSTEMS 245 7.1
INTRODUCTION / 245 7.2 SUBSTRATES AND WAFERS / 245 7.3 ACTIVE SUBSTRATE
MATERIALS / 247 7.4 SILICON AS SUBSTRATE MATERIAL / 247 7.4.1 IDEAL
SUBSTRATE FOR MEMS / 247 7.4.2 SINGLE-CRYSTAL SILICON AND WAFERS / 248
7.4.3 CRYSTAL STRUCTURE / 250 7.4.4 MILLER INDICES / 253 7.4.5
MECHANICAL PROPERTIES OF SILICON / 256 7.5 SILICON COMPOUNDS / 258 7.5.1
SILICON DIOXIDE / 258 7.5.2 SILICON CARBIDE / 259 7.5.3 SILICON NITRIDE
/ 259 7.5.4 POLYCRYSTALLINE SILICON / 260 7.6 SILICON PIEZORESISTORS /
261 7.7 GALLIUM ARSENIDE / 266 7.8 QUARTZ / 267 7.9 PIEZOELECTRIC
CRYSTALS / 268 7.10 POLYMERS / 274 7.10.1 POLYMERS AS INDUSTRIAL
MATERIALS / 274 7.10.2 POLYMERS FOR MEMS AND MICROSYSTEMS / 275 7.10.3
CONDUCTIVE POLYMERS / 275 7.10.4 LANGMUIR-BLODGETT FILM / 277 7.10.5
SU-8 PHOTORESISTS / 278 7.11 PACKAGING MATERIALS / 280 PROBLEMS / 281
CONTENTS 8 MICROSYSTEMS FABRICATION PROCESSES 285 8.1 INTRODUCTION / 285
8.2 PHOTOLITHOGRAPHY / 285 8.2.1 OVERVIEW / 286 8.2.2 PHOTORESISTS AND
APPLICATION / 286 8.2.3 LIGHT SOURCES / 288 8.2.4 PHOTORESIST
DEVELOPMENT / 289 8.2.5 PHOTORESIST REMOVAL AND POSTBAKING / 289 8.3 ION
IMPLANTATION / 289 8.4 DIFFUSION / 292 8.5 OXIDATION / 295 8.5.1 THERMAL
OXIDATION / 295 8.5.2 SILICON DIOXIDE / 296 8.5.3 THERMAL OXIDATION
RATES / 296 8.5.4 OXIDE THICKNESS BY COLOR / 300 8.6 CHEMICAL VAPOR
DEPOSITION / 301 8.6.1 WORKING PRINCIPLE OF CVD / 301 8.6.2 CHEMICAL
REACTIONS IN CVD / 302 8.6.3 RATE OF DEPOSITION / 303 8.6.4 ENHANCED CVD
/ 310 8.7 PHYSICAL VAPOR DEPOSITION: SPUTTERING / 312 8.8 DEPOSITION BY
EPITAXY / 313 8.9 ETCHING / 315 8.9.1 CHEMICAL ETCHING / 316 8.9.2
PLASMA ETCHING / 317 8.10 SUMMARY OF MICROFABRICATION / 317 PROBLEMS /
318 9 OVERVIEW OF MICROMANUFACTURING 323 9.1 INTRODUCTION / 323 9.2 BULK
MICROMANUFACTURING / 324 9.2.1 OVERVIEW OF ETCHING / 324 9.2.2 ISOTROPIE
AND ANISOTROPIE ETCHING / 325 9.2.3 WET ETCHANTS / 326 9.2.4 ETCH STOP /
328 9.2.5 DRY ETCHING / 329 9.2.6 COMPARISON OF WET VERSUS DRY ETCHING /
333 9.3 SURFACE MICROMACHINING / 333 9.3.1 DESCRIPTION / 333 CONTENTS
XUEI 9.3.2 PROCESS / 335 9.3.3 MECHANICAL PROBLEMS ASSOCIATED WITH
SURFACE MICROMACHINING / 336 9.4 LIGA PROCESS / 338 9.4.1 DESCRIPTION /
339 9.4.2 MATERIALS FOR SUBSTRATES AND PHOTORESISTS / 340 9.4.3
ELECTROPLATING / 341 9.4.4 SLIGA PROCESS / 342 9.5 SUMMARY OF
MICROMANUFACTURING / 343 9.5.1 BULK MICROMANUFACTURING / 343 9.5.2
SURFACE MICROMACHINING / 343 9.5.3 LIGA PROCESS / 343 PROBLEMS / 344 10
MICROSYSTEMS DESIGN 349 10.1 INTRODUCTION / 349 10.2 DESIGN
CONSIDERATIONS / 350 10.2.1 DESIGN CONSTRAINTS / 351 10.2.2 SELECTION OF
MATERIALS / 352 10.2.3 SELECTION OF MANUFACTURING PROCESSES / 354 10.2.4
SELECTION OF SIGNAL TRANSDUCTION / 355 10.2.5 ELECTROMECHANICAL SYSTEM /
358 10.2.6 PACKAGING / 358 10.3 PROCESS DESIGN / 358 10.3.1
PHOTOLIFHOGRAPHY / 359 10.3.2 THIN-FILM FABRICATIONS / 360 10.3.3
GEOMETRY SHAPING / 362 10.4 MECHANICAL DESIGN / 362 10.4.1 GEOMETRY OF
MEMS COMPONENTS / 362 10.4.2 THERMOMECHANICAL LOADING / 362 10.4.3
THERMOMECHANICAL STRESS ANALYSIS / 363 10.4.4 DYNAMIC ANALYSIS / 364
10.4.5 INTERFACIAL FRACTURE ANALYSIS / 369 10.5 MECHANICAL DESIGN USING
FINITE ELEMENT METHOD / 369 10.5.1 FINITE ELEMENT FORMULATION / 370
10.5.2 SIMULATION OF MICROFABRICATION PROCESSES / 375 10.6 DESIGN OF
SILICON DIE OF A MICROPRESSURE SENSOR / 378 10.7 DESIGN OF MICROFLUIDIC
NETWORK SYSTEMS / 382 10.7.1 FLUID RESISTANCE IN MICROCHANNELS / 383
CONTENTS 10.7.2 CAPILLARY ELECTROPHORESIS NETWORK SYSTEMS / 386 10.7.3
MATHEMATICAL MODELING OF CAPILLARY ELECTROPHORESIS NETWORK SYSTEMS / 388
10.7.4 DESIGN CASE: CAPILLARY ELECTROPHORESIS NETWORK SYSTEM / 389
10.7.5 CAPILLARY ELECTROPHORESIS IN CURVED CHANNELS / 392 10.7.6 ISSUES
IN DESIGN OF CE PROCESSES / 394 10.8 COMPUTER-AIDED DESIGN / 395 10.8.1
WHY CAD? / 395 10.8.2 WHAT IS IN A CAD PACKAGE FOR MICROSYSTEMS? / 395
10.8.3 HOW TO CHOOSE A CAD PACKAGE / 398 10.8.4 DESIGN CASE USING CAD /
398 PROBLEMS / 402 11 ASSEMBLY, PACKAGING, AND TESTING OF MICROSYSTEMS
407 11.1 INTRODUCTION / 407 11.2 OVERVIEW OF MICROASSEMBLY / 409 11.3
HIGH COSTS OF MICROASSEMBLY / 410 11.4 MICROASSEMBLY PROCESSES / 411
11.5 MAJOR TECHNICAL PROBLEMS IN MICROASSEMBLY / 413 11.5.1 TOLERANCES
IN MICROASSEMBLY / 414 11.5.2 TOOLS AND FIXTURES / 417 11.5.3 CONTACT
PROBLEMS IN MICROASSEMBLY TOOLS / 417 11.6 MICROASSEMBLY WORK CELLS /
419 11.7 CHALLENGING ISSUES IN MICROASSEMBLY / 421 11.8 OVERVIEW OF
MICROSYSTEMS PACKAGING / 422 11.9 GENERAL CONSIDERATIONS IN PACKAGING
DESIGN / 424 11.10 THREE LEVELS OF MICROSYSTEMS PACKAGING / 424 11.10.1
DIE-LEVEL PACKAGING / 424 11.10.2 DEVICE-LEVEL PACKAGING / 425 11.10.3
SYSTEM-LEVEL PACKAGING / 427 11.11 INTERFACES IN MICROSYSTEMS PACKAGING
/ 427 11.12 ESSENTIAL PACKAGING TECHNOLOGIES / 428 11.13 DIE PREPARATION
/ 429 11.14 SURFACE BONDING / 429 11.14.1 ADHESIVES / 430 11.14.2
EUTECTIC BONDING / 431 11.14.3 ANODIC BONDING / 432 11.14.4 SILICON
FUSION BONDING / 434 11.14.5 OVERVIEW OF SURFACE BONDING TECHNIQUES /
434 CONTENTS 11.14.6 SILICON-ON-INSULATOR: SPECIAL SURFACE BONDING
TECHNIQUES / 435 11.15 WIRE BONDING / 437 11.16 SEALING AND
ENCAPSULATION / 439 11.16.1 INTEGRATED ENCAPSULATION PROCESSES / 440
11.16.2 SEALING BY WAFER BONDING / 441 11.16.3 VACUUM SEALING AND
ENCAPSULATION / 442 11.17 THREE-DIMENSIONAL PACKAGING / 443 11.18
SELECTION OF PACKAGING MATERIALS / 444 11.19 SIGNAL MAPPING AND
TRANSDUCTION / 447 11.19.1 TYPICAL ELECTRICAL SIGNALS IN MICROSYSTEMS /
447 11.19.2 MEASUREMENT OF RESISTANCE / 447 11.19.3 SIGNAL MAPPING AND
TRANSDUCTION IN PRESSURE SENSORS / 448 11.19.4 CAPACITANCE MEASUREMENTS
/ 450 11.20 DESIGN CASE ON PRESSURE SENSOR PACKAGING / 451 11.21
RELIABILITY IN MEMS PACKAGING / 455 11.22 TESTING FOR RELIABILITY / 456
PROBLEMS / 458 INTRODUCTION TO NANOSCALE ENGINEERING 465 12.1
INTRODUCTION / 465 12.2 MICRO- AND NANOSCALE TECHNOLOGIES / 467 12.3
GENERAL PRINCIPLE OF NANOFABRICATION / 468 12.4 NANOPRODUCTS / 471 12.5
APPLICATION OF NANOPRODUCTS / 474 12.6 QUANTUM PHYSICS / 478 12.7
MOLECULAR DYNAMICS / 479 12.8 FLUID FLOW IN SUBMICROMETER- AND
NANOSCALES / 482 12.8.1 RAREFIEDGAS / 482 12.8.2 KNUDSEN AND MACH
NUMBERS / 482 12.8.3 MODELING OF MICRO- AND NANOSCALE GAS FLOW / 483
12.9 HEAT CONDUCTION AT NANOSCALE / 486 12.9.1 HEAT TRANSMISSION AT
SUBMICROMETER- AND NANOSCALE / 486 12.9.2 THERMAL CONDUCTIVITY OF THIN
FILMS / 489 12.9.3 HEAT CONDUCTION EQUATION FOR THIN FILMS / 490 12.10
MEASUREMENT OF THERMAL CONDUCTIVITY / 491 12.11 CHALLENGES IN NANOSCALE
ENGINEERING / 497 12.11.1 NANOPATTERNING IN NANOFABRICATION / 498
12.11.2 NANOASSEMBLY / 500 CONTENTS 12.11.3 NEW MATERIALS FOR
NANOELECTROMECHAMCAL SYSTEMS (NEMS) / 500 12.11.4 ANALYTICAL MODELING /
501 12.11.5 TESTING / 502 12.12 SOCIAL IMPACTS OF NANOSCALE ENGINEERING
/ 502 PROBLEMS / 503 REFERENCES 509 APPENDIX 1 RECOMMENDED UNITS FOR
THERMOPHYSICAL QUANTITIES 523 APPENDIX 2 CONVERSION OF UNITS 525 INDEX
527
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| adam_txt |
MEMSAND MICROSYSTEMS DESIGN, MANUFACTURE, AND NANOSCALE ENGINEERING
SECOND EDITION TAI-RAN HSU MICROSYSTEMS DESIGN AND PACKAGING LABORATORY
DEPARTMENT OF MECHANICAL AND AEROSPACE ENGINEERING SAN JOSE STATE
UNIVERSITY WILEY JOHN WILEY & SONS, INC. CONTENTS PREFACE XVII PREFACE
TO THE FIRST EDITION XIX SUGGESTIONS TO INSTRUCTORS XXIII OVERVIEW OF
MEMS AND MICROSYSTEMS 1 1.1 MEMS AND MICROSYSTEMS / 1 1.2 TYPICAL MEMS
AND MICROSYSTEMS PRODUCTS / 7 1.2.1 MICROGEARS / 7 1.2.2 MICROMOTORS / 7
1.2.3 MICROTURBINES / 7 1.2.4 MICRO-OPTICAL COMPONENTS / 7 1.3 EVOLUTION
OF MICROFABRICATION / 10 1.4 MICROSYSTEMS AND MICROELECTRONICS / 11 1.5
MULTIDISCIPLINARY NATURE OF MICROSYSTEMS DESIGN AND MANUFACTURE / 13 1.6
MICROSYSTEMS AND MINIATURIZATION / 15 1.7 APPLICATION OF MICROSYSTEMS IN
AUTOMOTIVE INDUSTRY / 21 1.7.1 SAFETY / 22 1.7.2 ENGINE AND POWER TRAINS
/ 24 1.7.3 COMFORT AND CONVENIENCE / 24 1.7.4 VEHICLE DIAGNOSTICS AND
HEALTH MONITORING / 24 1.7.5 FUTURE AUTOMOTIVE APPLICATIONS / 26 1.8
APPLICATION OF MICROSYSTEMS IN OTHER INDUSTRIES / 27 VII VIII CONTENTS
1.8.1 APPLICATION IN HEALTH CARE INDUSTRY / 27 1.8.2 APPLICATION IN
AEROSPACE INDUSTRY / 28 1.8.3 APPLICATION IN INDUSTRIAL PRODUCTS / 29
1.8.4 APPLICATION IN CONSUMER PRODUCTS / 29 1.8.5 APPLICATION IN
TELECOMMUNICATIONS / 30 1.9 MARKETS FOR MICROSYSTEMS / 30 PROBLEMS / 32
WORKING PRINCIPLES OF MICROSYSTEMS 35 2.1 INTRODUCTION / 35 2.2
MICROSENSORS / 35 2.2.1 ACOUSTIC WAVE SENSORS / 36 2.2.2 BIOMEDICAL AND
BIOSENSORS / 37 2.2.3 CHEMICAL SENSORS / 40 2.2.4 OPTICAL SENSORS / 42
2.2.5 PRESSURE SENSORS / 44 2.2.6 THERMAL SENSORS / 50 2.3
MICROACTUATION / 53 2.3.1 ACTUATION USING THERMAL FORCES / 53 2.3.2
ACTUATION USING SHAPE MEMORY ALLOYS / 54 2.3.3 ACTUATION USING
PIEZOELECTRIC EFFECT / 54 2.3.4 ACTUATION USING ELECTROSTATIC FORCES /
55 2.4 MEMS WITH MICROACTUATORS / 59 2.4.1 MICROGRIPPERS / 59 2.4.2
MINIATURE MICROPHONES / 61 2.4.3 MICROMOTORS / 64 2.5 MICROACTUATORS
WITH MECHANICAL INERTIA / 66 2.5.1 MICROACCELEROMETERS / 66 2.5.2
MICROGYROSCOPES / 70 2.6 MICROFLUIDICS / 72 2.6.1 MICROVALVES / 74 2.6.2
MICROPUMPS / 75 2.6.3 MICRO-HEAT PIPES / 75 PROBLEMS / 77 ENGINEERING
SCIENCE FOR MICROSYSTEMS DESIGN AND FABRICATION 83 3.1 INTRODUCTION / 83
3.2 ATOMIC STRUCTURE OF MATTER / 83 CONTENTS 3.3 IONS AND IONIZATION /
86 3.4 MOLECULAR THEORY OF MATTER AND INTERMOLECULAR FORCES / 87 3.5
DOPING OF SEMICONDUCTORS / 89 3.6 DIFFUSION PROCESS / 92 3.7 PLASMA
PHYSICS / 99 3.8 ELECTROCHEMISTRY / 100 3.8.1 ELECTROLYSIS / 101 3.8.2
ELECTROHYDRODYNAMICS / 102 PROBLEMS / 105 ENGINEERING MECHANICS FOR
MICROSYSTEMS DESIGN 109 4.1 INTRODUCTION / 109 4.2 STATIC BENDING OF
THIN PLATES / 110 4.2.1 BENDING OF CIRCULAR PLATES WITH EDGE FIXED / 112
4.2.2 BENDING OF RECTANGULAR PLATES WITH ALL EDGES FIXED / 114 4.2.3
BENDING OF SQUARE PLATES WITH EDGES FIXED / 116 4.3 MECHANICAL VIBRATION
/ 119 4.3.1 GENERAL FORMULATION / 119 4.3.2 RESONANT VIBRATION / 123
4.3.3 MICROACCELEROMETERS / 125 4.3.4 DESIGN THEORY OF ACCELEROMETERS /
126 4.3.5 DAMPING COEFFICIENTS / 134 4.3.6 RESONANT MICROSENSORS / 144
4.4 THERMOMECHANICS / 150 4.4.1 THERMAL EFFECTS ON MECHANICAL STRENGTH
OF MATERIALS / 150 4.4.2 CREEP DEFORMATION / 150 4.4.3 THERMAL STRESSES
/ 152 4.5 FRACTURE MECHANICS / 165 4.5.1 STRESS INTENSITY FACTORS / 166
4.5.2 FRACTURE TOUGHNESS / 167 4.5.3 INTERFACIAL FRACTURE MECHANICS /
169 4.6 THIN-FILM MECHANICS / 172 4.7 OVERVIEW OF FINITE ELEMENT STRESS
ANALYSIS / 173 4.7.1 THE PRINCIPLE / 173 4.7.2 ENGINEERING APPLICATIONS
/ 175 4.7.3 INPUT INFORMATION TO FEA / 175 CONTENTS 4.7.4 OUTPUT FROM
FEA / 175 4.7.5 GRAPHICAL OUTPUT / 176 4.7.6 GENERAL REMARKS / 176
PROBLEMS / 178 5 THERMOFLUID ENGINEERING AND MICROSYSTEMS DESIGN 183 5.1
INTRODUCTION / 183 5.2 OVERVIEW OF BASICS OF FLUID MECHANICS AT MACRO-
AND MESOSCALES / 184 5.2.1 VISCOSITY OF FLUIDS / 184 5.2.2 STREAMLINES
AND STREAM TUBES / 186 5.2.3 CONTROL VOLUMES AND CONTROL SURFACES / 187
5.2.4 FLOW PATTERNS AND REYNOLDS NUMBER / 187 5.3 BASIC EQUATIONS IN
CONTINUUM FLUID DYNAMICS / 187 5.3.1 CONTINUITY EQUATION / 187 5.3.2
MOMENTUM EQUATION / 190 5.3.3 EQUATION OF MOTION / 192 5.4 LAMINAR FLUID
FLOW IN CIRCULAR CONDUITS / 195 5.5 COMPUTATIONAL FLUID DYNAMICS / 198
5.6 INCOMPRESSIBLE FLUID FLOW IN MICROCONDUITS / 199 5.6.1 SURFACE
TENSION / 199 5.6.2 CAPILLARY EFFECT / 201 5.6.3 MICROPUMPING / 203 5.7
OVERVIEW OF HEAT CONDUCTION IN SOLIDS / 204 5.7.1 GENERAL PRINCIPLE OF
HEAT CONDUCTION / 204 5.7.2 FOURIER LAW OF HEAT CONDUCTION / 205 5.7.3
HEAT CONDUCTION EQUATION / 207 5.7.4 NEWTON'S COOLING LAW / 208 5.7.5
SOLID-FLUID INTERACTION / 209 5.7.6 BOUNDARY CONDITIONS / 210 5.8 HEAT
CONDUCTION IN MULTILAYERED THIN FILMS / 215 5.9 HEAT CONDUCTION IN
SOLIDS AT SUBMICROMETER SCALE / 220 PROBLEMS / 221 6 SCALING LAWS IN
MINIATURIZATION 227 6.1 INTRODUCTION TO SCALING / 227 6.2 SCALING IN
GEOMETRY / 228 CONTENTS XI 6.3 SCALING IN RIGID-BODY DYNAMICS / 230
6.3.1 SCALING IN DYNAMIC FORCES / 230 6.3.2 TRIMMER FORCE SCALING VECTOR
/ 231 6.4 SCALING IN ELECTROSTATIC FORCES / 233 6.5 SCALING OF
ELECTROMAGNETIC FORCES / 235 6.6 SCALING IN ELECTRICITY / 237 6.7
SCALING IN FLUID MECHANICS / 238 6.8 SCALING IN HEAT TRANSFER / 242
6.8.1 SCALING IN HEAT CONDUCTION / 242 6.8.2 SCALING IN HEAT CONVECTION
/ 243 PROBLEMS / 244 7 MATERIALS FOR MEMS AND MICROSYSTEMS 245 7.1
INTRODUCTION / 245 7.2 SUBSTRATES AND WAFERS / 245 7.3 ACTIVE SUBSTRATE
MATERIALS / 247 7.4 SILICON AS SUBSTRATE MATERIAL / 247 7.4.1 IDEAL
SUBSTRATE FOR MEMS / 247 7.4.2 SINGLE-CRYSTAL SILICON AND WAFERS / 248
7.4.3 CRYSTAL STRUCTURE / 250 7.4.4 MILLER INDICES / 253 7.4.5
MECHANICAL PROPERTIES OF SILICON / 256 7.5 SILICON COMPOUNDS / 258 7.5.1
SILICON DIOXIDE / 258 7.5.2 SILICON CARBIDE / 259 7.5.3 SILICON NITRIDE
/ 259 7.5.4 POLYCRYSTALLINE SILICON / 260 7.6 SILICON PIEZORESISTORS /
261 7.7 GALLIUM ARSENIDE / 266 7.8 QUARTZ / 267 7.9 PIEZOELECTRIC
CRYSTALS / 268 7.10 POLYMERS / 274 7.10.1 POLYMERS AS INDUSTRIAL
MATERIALS / 274 7.10.2 POLYMERS FOR MEMS AND MICROSYSTEMS / 275 7.10.3
CONDUCTIVE POLYMERS / 275 7.10.4 LANGMUIR-BLODGETT FILM / 277 7.10.5
SU-8 PHOTORESISTS / 278 7.11 PACKAGING MATERIALS / 280 PROBLEMS / 281
CONTENTS 8 MICROSYSTEMS FABRICATION PROCESSES 285 8.1 INTRODUCTION / 285
8.2 PHOTOLITHOGRAPHY / 285 8.2.1 OVERVIEW / 286 8.2.2 PHOTORESISTS AND
APPLICATION / 286 8.2.3 LIGHT SOURCES / 288 8.2.4 PHOTORESIST
DEVELOPMENT / 289 8.2.5 PHOTORESIST REMOVAL AND POSTBAKING / 289 8.3 ION
IMPLANTATION / 289 8.4 DIFFUSION / 292 8.5 OXIDATION / 295 8.5.1 THERMAL
OXIDATION / 295 8.5.2 SILICON DIOXIDE / 296 8.5.3 THERMAL OXIDATION
RATES / 296 8.5.4 OXIDE THICKNESS BY COLOR / 300 8.6 CHEMICAL VAPOR
DEPOSITION / 301 8.6.1 WORKING PRINCIPLE OF CVD / 301 8.6.2 CHEMICAL
REACTIONS IN CVD / 302 8.6.3 RATE OF DEPOSITION / 303 8.6.4 ENHANCED CVD
/ 310 8.7 PHYSICAL VAPOR DEPOSITION: SPUTTERING / 312 8.8 DEPOSITION BY
EPITAXY / 313 8.9 ETCHING / 315 8.9.1 CHEMICAL ETCHING / 316 8.9.2
PLASMA ETCHING / 317 8.10 SUMMARY OF MICROFABRICATION / 317 PROBLEMS /
318 9 OVERVIEW OF MICROMANUFACTURING 323 9.1 INTRODUCTION / 323 9.2 BULK
MICROMANUFACTURING / 324 9.2.1 OVERVIEW OF ETCHING / 324 9.2.2 ISOTROPIE
AND ANISOTROPIE ETCHING / 325 9.2.3 WET ETCHANTS / 326 9.2.4 ETCH STOP /
328 9.2.5 DRY ETCHING / 329 9.2.6 COMPARISON OF WET VERSUS DRY ETCHING /
333 9.3 SURFACE MICROMACHINING / 333 9.3.1 DESCRIPTION / 333 CONTENTS
XUEI 9.3.2 PROCESS / 335 9.3.3 MECHANICAL PROBLEMS ASSOCIATED WITH
SURFACE MICROMACHINING / 336 9.4 LIGA PROCESS / 338 9.4.1 DESCRIPTION /
339 9.4.2 MATERIALS FOR SUBSTRATES AND PHOTORESISTS / 340 9.4.3
ELECTROPLATING / 341 9.4.4 SLIGA PROCESS / 342 9.5 SUMMARY OF
MICROMANUFACTURING / 343 9.5.1 BULK MICROMANUFACTURING / 343 9.5.2
SURFACE MICROMACHINING / 343 9.5.3 LIGA PROCESS / 343 PROBLEMS / 344 10
MICROSYSTEMS DESIGN 349 10.1 INTRODUCTION / 349 10.2 DESIGN
CONSIDERATIONS / 350 10.2.1 DESIGN CONSTRAINTS / 351 10.2.2 SELECTION OF
MATERIALS / 352 10.2.3 SELECTION OF MANUFACTURING PROCESSES / 354 10.2.4
SELECTION OF SIGNAL TRANSDUCTION / 355 10.2.5 ELECTROMECHANICAL SYSTEM /
358 10.2.6 PACKAGING / 358 10.3 PROCESS DESIGN / 358 10.3.1
PHOTOLIFHOGRAPHY / 359 10.3.2 THIN-FILM FABRICATIONS / 360 10.3.3
GEOMETRY SHAPING / 362 10.4 MECHANICAL DESIGN / 362 10.4.1 GEOMETRY OF
MEMS COMPONENTS / 362 10.4.2 THERMOMECHANICAL LOADING / 362 10.4.3
THERMOMECHANICAL STRESS ANALYSIS / 363 10.4.4 DYNAMIC ANALYSIS / 364
10.4.5 INTERFACIAL FRACTURE ANALYSIS / 369 10.5 MECHANICAL DESIGN USING
FINITE ELEMENT METHOD / 369 10.5.1 FINITE ELEMENT FORMULATION / 370
10.5.2 SIMULATION OF MICROFABRICATION PROCESSES / 375 10.6 DESIGN OF
SILICON DIE OF A MICROPRESSURE SENSOR / 378 10.7 DESIGN OF MICROFLUIDIC
NETWORK SYSTEMS / 382 10.7.1 FLUID RESISTANCE IN MICROCHANNELS / 383
CONTENTS 10.7.2 CAPILLARY ELECTROPHORESIS NETWORK SYSTEMS / 386 10.7.3
MATHEMATICAL MODELING OF CAPILLARY ELECTROPHORESIS NETWORK SYSTEMS / 388
10.7.4 DESIGN CASE: CAPILLARY ELECTROPHORESIS NETWORK SYSTEM / 389
10.7.5 CAPILLARY ELECTROPHORESIS IN CURVED CHANNELS / 392 10.7.6 ISSUES
IN DESIGN OF CE PROCESSES / 394 10.8 COMPUTER-AIDED DESIGN / 395 10.8.1
WHY CAD? / 395 10.8.2 WHAT IS IN A CAD PACKAGE FOR MICROSYSTEMS? / 395
10.8.3 HOW TO CHOOSE A CAD PACKAGE / 398 10.8.4 DESIGN CASE USING CAD /
398 PROBLEMS / 402 11 ASSEMBLY, PACKAGING, AND TESTING OF MICROSYSTEMS
407 11.1 INTRODUCTION / 407 11.2 OVERVIEW OF MICROASSEMBLY / 409 11.3
HIGH COSTS OF MICROASSEMBLY / 410 11.4 MICROASSEMBLY PROCESSES / 411
11.5 MAJOR TECHNICAL PROBLEMS IN MICROASSEMBLY / 413 11.5.1 TOLERANCES
IN MICROASSEMBLY / 414 11.5.2 TOOLS AND FIXTURES / 417 11.5.3 CONTACT
PROBLEMS IN MICROASSEMBLY TOOLS / 417 11.6 MICROASSEMBLY WORK CELLS /
419 11.7 CHALLENGING ISSUES IN MICROASSEMBLY / 421 11.8 OVERVIEW OF
MICROSYSTEMS PACKAGING / 422 11.9 GENERAL CONSIDERATIONS IN PACKAGING
DESIGN / 424 11.10 THREE LEVELS OF MICROSYSTEMS PACKAGING / 424 11.10.1
DIE-LEVEL PACKAGING / 424 11.10.2 DEVICE-LEVEL PACKAGING / 425 11.10.3
SYSTEM-LEVEL PACKAGING / 427 11.11 INTERFACES IN MICROSYSTEMS PACKAGING
/ 427 11.12 ESSENTIAL PACKAGING TECHNOLOGIES / 428 11.13 DIE PREPARATION
/ 429 11.14 SURFACE BONDING / 429 11.14.1 ADHESIVES / 430 11.14.2
EUTECTIC BONDING / 431 11.14.3 ANODIC BONDING / 432 11.14.4 SILICON
FUSION BONDING / 434 11.14.5 OVERVIEW OF SURFACE BONDING TECHNIQUES /
434 CONTENTS 11.14.6 SILICON-ON-INSULATOR: SPECIAL SURFACE BONDING
TECHNIQUES / 435 11.15 WIRE BONDING / 437 11.16 SEALING AND
ENCAPSULATION / 439 11.16.1 INTEGRATED ENCAPSULATION PROCESSES / 440
11.16.2 SEALING BY WAFER BONDING / 441 11.16.3 VACUUM SEALING AND
ENCAPSULATION / 442 11.17 THREE-DIMENSIONAL PACKAGING / 443 11.18
SELECTION OF PACKAGING MATERIALS / 444 11.19 SIGNAL MAPPING AND
TRANSDUCTION / 447 11.19.1 TYPICAL ELECTRICAL SIGNALS IN MICROSYSTEMS /
447 11.19.2 MEASUREMENT OF RESISTANCE / 447 11.19.3 SIGNAL MAPPING AND
TRANSDUCTION IN PRESSURE SENSORS / 448 11.19.4 CAPACITANCE MEASUREMENTS
/ 450 11.20 DESIGN CASE ON PRESSURE SENSOR PACKAGING / 451 11.21
RELIABILITY IN MEMS PACKAGING / 455 11.22 TESTING FOR RELIABILITY / 456
PROBLEMS / 458 INTRODUCTION TO NANOSCALE ENGINEERING 465 12.1
INTRODUCTION / 465 12.2 MICRO- AND NANOSCALE TECHNOLOGIES / 467 12.3
GENERAL PRINCIPLE OF NANOFABRICATION / 468 12.4 NANOPRODUCTS / 471 12.5
APPLICATION OF NANOPRODUCTS / 474 12.6 QUANTUM PHYSICS / 478 12.7
MOLECULAR DYNAMICS / 479 12.8 FLUID FLOW IN SUBMICROMETER- AND
NANOSCALES / 482 12.8.1 RAREFIEDGAS / 482 12.8.2 KNUDSEN AND MACH
NUMBERS / 482 12.8.3 MODELING OF MICRO- AND NANOSCALE GAS FLOW / 483
12.9 HEAT CONDUCTION AT NANOSCALE / 486 12.9.1 HEAT TRANSMISSION AT
SUBMICROMETER- AND NANOSCALE / 486 12.9.2 THERMAL CONDUCTIVITY OF THIN
FILMS / 489 12.9.3 HEAT CONDUCTION EQUATION FOR THIN FILMS / 490 12.10
MEASUREMENT OF THERMAL CONDUCTIVITY / 491 12.11 CHALLENGES IN NANOSCALE
ENGINEERING / 497 12.11.1 NANOPATTERNING IN NANOFABRICATION / 498
12.11.2 NANOASSEMBLY / 500 CONTENTS 12.11.3 NEW MATERIALS FOR
NANOELECTROMECHAMCAL SYSTEMS (NEMS) / 500 12.11.4 ANALYTICAL MODELING /
501 12.11.5 TESTING / 502 12.12 SOCIAL IMPACTS OF NANOSCALE ENGINEERING
/ 502 PROBLEMS / 503 REFERENCES 509 APPENDIX 1 RECOMMENDED UNITS FOR
THERMOPHYSICAL QUANTITIES 523 APPENDIX 2 CONVERSION OF UNITS 525 INDEX
527 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
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| ctrlnum | (OCoLC)123539645 (DE-599)HBZHT015530445 |
| dewey-full | 621.381 |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 2. ed. |
| format | Book |
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| id | DE-604.BV023385445 |
| illustrated | Illustrated |
| index_date | 2024-07-02T21:17:59Z |
| indexdate | 2024-07-09T21:17:24Z |
| institution | BVB |
| isbn | 0470083018 9780470083017 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-016568477 |
| oclc_num | 123539645 |
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| owner_facet | DE-1043 DE-1050 DE-703 DE-859 DE-573 DE-83 |
| physical | XXV, 550 S. Ill., graph. Darst. |
| publishDate | 2008 |
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| publisher | Wiley |
| record_format | marc |
| spelling | Hsu, Tai-Ran Verfasser aut MEMS and microsystems design, manufacture, and nanoscale engineering Tai-Ran Hsu 2. ed. Hoboken, NJ Wiley 2008 XXV, 550 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Nanotechnologie ram Systèmes microélectromécaniques - Conception et construction ram Électronique - Matériaux ram Microelectromechanical systems Microelectronic packaging Microelectronics Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf Mikromechanik (DE-588)4205811-9 s Mikroelektronik (DE-588)4039207-7 s DE-604 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016568477&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Hsu, Tai-Ran MEMS and microsystems design, manufacture, and nanoscale engineering Nanotechnologie ram Systèmes microélectromécaniques - Conception et construction ram Électronique - Matériaux ram Microelectromechanical systems Microelectronic packaging Microelectronics Mikroelektronik (DE-588)4039207-7 gnd Mikromechanik (DE-588)4205811-9 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4205811-9 |
| title | MEMS and microsystems design, manufacture, and nanoscale engineering |
| title_auth | MEMS and microsystems design, manufacture, and nanoscale engineering |
| title_exact_search | MEMS and microsystems design, manufacture, and nanoscale engineering |
| title_exact_search_txtP | MEMS and microsystems design, manufacture, and nanoscale engineering |
| title_full | MEMS and microsystems design, manufacture, and nanoscale engineering Tai-Ran Hsu |
| title_fullStr | MEMS and microsystems design, manufacture, and nanoscale engineering Tai-Ran Hsu |
| title_full_unstemmed | MEMS and microsystems design, manufacture, and nanoscale engineering Tai-Ran Hsu |
| title_short | MEMS and microsystems |
| title_sort | mems and microsystems design manufacture and nanoscale engineering |
| title_sub | design, manufacture, and nanoscale engineering |
| topic | Nanotechnologie ram Systèmes microélectromécaniques - Conception et construction ram Électronique - Matériaux ram Microelectromechanical systems Microelectronic packaging Microelectronics Mikroelektronik (DE-588)4039207-7 gnd Mikromechanik (DE-588)4205811-9 gnd |
| topic_facet | Nanotechnologie Systèmes microélectromécaniques - Conception et construction Électronique - Matériaux Microelectromechanical systems Microelectronic packaging Microelectronics Mikroelektronik Mikromechanik |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016568477&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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