Molded interconnect devices: 7th International congress, September 27-28, 2006, Fuerth, Germany
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Bibliographic Details
Format: Conference Proceeding Book
Language:English
Published: Bamberg Meisenbach 2006
Subjects:
Physical Description:292 S. Ill., graph. Darst.
ISBN:9783875252453
3875252454

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Interlibrary loan Place Request Caution: Not in THWS collection!