APA (7th ed.) Citation

(2006). Molded interconnect devices: 7th International congress, September 27-28, 2006, Fuerth, Germany. Meisenbach.

Chicago Style (17th ed.) Citation

Molded Interconnect Devices: 7th International Congress, September 27-28, 2006, Fuerth, Germany. Bamberg: Meisenbach, 2006.

MLA (9th ed.) Citation

Molded Interconnect Devices: 7th International Congress, September 27-28, 2006, Fuerth, Germany. Meisenbach, 2006.

Warning: These citations may not always be 100% accurate.