Holdings: Flexible electronics

Flexible electronics: materials and applications

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Bibliographic Details
Format:	Book
Language:	English
Published:	New York, NY Springer 2009
Series:	Electronic materials: science & technology
Subjects:	Electronics > Materials Flexible printed circuits Elektronik Werkstoff Folienisolierter Flachleiter Aufsatzsammlung
Online Access:	Inhaltsverzeichnis
Physical Description:	XVIII, 462 S. Ill., graph. Darst.
ISBN:	9780387743622

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245	1	0	\|a Flexible electronics \|b materials and applications \|c William S. Wong ... eds.
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700	1		\|a Wong, William S. \|e Sonstige \|4 oth
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adam_text	Contents 1 Overview of Flexible Electronics Technology ...................... 1 I-Chun Cheng and Sigurd Wagner 1.1 History of Flexible Electronics ............................... 1 1.2 Materials for Flexible Electronics ............................ 3 1.2.1 Degrees of Flexibility ............................... 3 1.2.2 Substrates ......................................... 5 1.2.3 Backplane Electronics .............................. 8 1.2.4 Frontplane Technologies ............................ 12 1.2.5 Encapsulation ..................................... 16 1.3 Fabrication Technology for Flexible Electronics ................ 18 1.3.1 Fabrication on Sheets by Batch Processing ............. 18 1.3.2 Fabrication on Web by Roll-to-Roll Processing ......... 19 1.3.3 Additive Printing ................................... 20 1.4 Outlook .................................................. 20 References ..................................................... 20 2 Mechanical Theory of the Film-on-Substrate-Foil Structure: Curvature and Overlay Alignment in Amorphous Silicon Thin-Film Devices Fabricated on Free-Standing Foil Substrates ..... 29 Helena Gleskova, I-Chun Cheng, Sigurd Wagner, and Zhigang Suo 2.1 Introduction .............................................. 29 2.2 Theory ................................................... 32 2.2.1 The Built-in Strain ε,,, .............................. 35 2.3 Applications .............................................. 36 2.3.1 Strain in the Substrate, esÇTd), and the Film, ef(Td), at the Deposition Temperature Td .................... 36 2.3.2 Strain in the Substrate, гѕ(Тг), and the Film, tf(Tr), at Room Temperature Tr ............................ 38 2.3.3 Radius of Curvature R of the Workpiece ............... 42 2.3.4 Strain of the Substrate and the Curvature of the Workpiece for a Three-Layer Structure ................ 46 2.3.5 Experimental Results for a-Si:H TFTs Fabricated on Kapton .......................................... 47 ii Contents 2.4 Conclusions .............................................. 50 References ..................................................... 50 3 Low-temperature Amorphous and Nanocrystalline Silicon Materials and Thin-film Transistors .............................. 53 Andrei Sazonov, Denis Striakhilev, and Arokia Nathan 3.1 Introduction .............................................. 53 3.2 Low-temperature Amorphous and Nanocrystalline Silicon Materials .......................................... 55 3.2.1 Fundamental Issues for Low-temperature Processing ..... 55 3.2.2 Low-temperature Amorphous Silicon .................. 56 3.2.3 Low-temperature Nanocrystalline Silicon .............. 56 3.3 Low-temperature Dielectrics ................................ 57 3.3.1 Characteristics of Low-temperature Dielectric Thin-film Deposition ............................... 57 3.3.2 Low-temperature Silicon Nitride Characteristics ........ 57 3.3.3 Low-temperature Silicon Oxide Characteristics ......... 58 3.4 Low-temperature Thin-film Transistor Devices ................. 59 3.4.1 Device Structures and Materials Processing ............ 60 3.4.2 Low-temperature a-Si:H Thin-Film Transistor Device Performance ............................... 61 3.4.3 Contacts to a-Si:H Thin-film Transistors ............... 62 3.4.4 Low-temperature Doped nc-Si Contacts ............... 64 3.4.5 Low-temperature nc-Si TFTs ........................ 66 3.5 Device Stability ........................................... 67 3.6 Conclusions and Future Prospective .......................... 70 References ..................................................... 70 4 Amorphous Silicon: Flexible Backplane and Display Application .... 75 Kalluri R. Sarma 4.1 Introduction .............................................. 75 4.2 Enabling Technologies for Flexible Backplanes and Displays ..... 76 4.2.1 Flexible Substrate Technologies ...................... 76 4.2.2 TFT Technologies for Flexible Backplanes ............. 82 4.2.3 Display Media for Flexible Displays (LCD, Reflective-EP, OLED) .............................. 89 4.2.4 Barrier Layers ..................................... 90 4.3 Flexible Active Matrix Backplane Requirements for OLED Displays ........................................ 91 4.3.1 Active Matrix Addressing ........................... 92 4.4 Flexible AMOLED Displays Using а -Si TFT Backplanes ........ 95 4.4.1 Backplane Fabrication Using PEN Plastic Substrates ..... 95 4.4.2 Flexible OLED Display Fabrication ................... 98 4.4.3 Flexible AMOLED Display Fabrication with Thin-film Encapsulation ........................ 100 Contents xi 4.5 Flexible Electrophoretic Displays Fabricated using a-Si TFT Backplanes.................................102 4.6 Outlook for Low-Temperature a-Si TFT for Flexible Electronics Manufacturing ..................................102 References .....................................................105 5 Flexible Transition Metal Oxide Electronics and Imprint Lithography ...................................................107 Warren B. Jackson 5.1 Introduction ..............................................107 5.2 Previous Work ............................................108 5.3 Properties of Transistor Materials ............................113 5.3.1 Semiconductors ....................................113 5.3.2 Dielectrics ........................................115 5.3.3 Contact Materials ..................................116 5.4 Device Structures ..........................................117 5.5 Fabrication on Flexible Substrates ............................119 5.5.1 Imprint Lithography ................................120 5.5.2 Self-Aligned Imprint Lithography ....................122 5.5.3 SAIL Transistor Results .............................126 5.5.4 Summary of Imprint Lithography .....................127 5.6 Flexible TMO Device Results ...............................128 5.7 Future Problems and Areas of Research .......................133 5.7.1 Carrier Density Control .............................134 5.7.2 Low-Temperature Dielectrics ........................135 5.7.3 Etching of TMO Materials ...........................135 5.7.4 P-type TMO ......................................136 5.7.5 Stability ..........................................136 5.7.6 Flexure and Adhesion of TMO .......................137 5.7.7 Flexible Fabrication Method Yields ...................137 5.8 Summary ................................................138 References .....................................................139 6 Materials and Novel Patterning Methods for Flexible Electronics ....................................................143 William S. Wong, Michael L. Chabinyc, Tse-Nga Ng, and Alberto Salleo 6.1 Introduction ..............................................143 6.2 Materials Considerations for Flexible Electronics ...............145 6.2.1 Overview .........................................145 6.2.2 Inorganic Semiconductors and Dielectrics ..............145 6.2.3 Organic Semiconductors and Dielectrics ...............146 6.2.4 Conductors .......................................149 6.3 Print-Processing Options for Device Fabrication ................150 6.3.1 Overview .........................................150 Contents 6.3.2 Control of Feature Sizes of Jet-Printed Liquids ..........151 6.3.3 Jet-Printing for Etch-Mask Patterning .................153 6.3.4 Methods for Minimizing Feature Size .................154 6.3.5 Printing Active Materials ............................156 6.4 Performance and Characterization of Electronic Devices .........157 6.4.1 Overview .........................................157 6.4.2 Bias Stress in Organic Thin-Film Transistors ...........158 6.4.3 Nonideal Scaling of Short-Channel Organic TFTs .......163 6.4.4 Low-Temperature a-Si:H TFT Device Stability ..........165 6.4.5 Low-temperature a-Si:H p-i-n Devices ................167 6.5 Printed Flexible Electronics .................................170 6.5.1 Overview .........................................170 6.5.2 Digital Lithography for Flexible Image Sensor Arrays ........................................... 170 6.5.3 Printed Organic Backplanes ..........................172 6.6 Conclusions and Future Prospects ............................176 References .....................................................176 7 Sheet-Type Sensors and Actuators ...............................183 Takao Someya 7.1 Introduction ..............................................183 7.2 Sheet-type Image Scanners ..................................184 7.2.1 Imaging Methods ..................................185 7.2.2 Device Structure and Manufacturing Process ...........186 7.2.3 Electronic Performance of Organic Photodiodes .........190 7.2.4 Organic Transistors .................................191 7.2.5 Photosensor Cells ..................................193 7.2.6 Issues Related to Device Processes: Pixel Stability and Resolution .................................... 195 7.2.7 A Hierarchal Approach for Slow Organic Circuits .......196 7.2.8 The Double-Wordline and Double-Bitline Structure ......196 7.2.9 A New Dynamic Second-Wordline Decoder ............199 7.2.10 Higher Speed Operation with Lower Power Consumption ..................................... 199 7.2.11 New Applications and Future Prospects ................200 7.3 Sheet-Type Braille Displays .................................201 7.3.1 Manufacturing Process ..............................201 7.3.2 Electronic Performance of Braille Cells ................204 7.3.3 Organic Transistor-based SRAM .....................210 7.3.4 Reading Tests .....................................211 7.3.5 Future Prospects ...................................212 7.4 Summary ................................................212 References .....................................................213 Contents xiii 8 Organic and Polymeric TFTs for Flexible Displays and Circuits .....215 Michael G. Kane 8.1 Introduction ..............................................215 8.2 Important Organic TFT Parameters for Electronic Systems .......216 8.2.1 Field-Effect Mobility ...............................216 8.2.2 Threshold Voltage ..................................219 8.2.3 Subthreshold Swing ................................220 8.2.4 Leakage Currents ..................................222 8.2.5 Contact Resistance .................................222 8.2.6 Capacitances and Frequency Response ................223 8.2.7 TFT Nonuniformity ................................225 8.2.8 Bias-Stress Instability and Hysteresis ..................225 8.3 Active Matrix Displays .....................................227 8.3.1 Introduction .......................................227 8.3.2 Liquid Crystal and Electrophoretic Displays ............228 8.4 Active Matrix OLED Displays ...............................236 8.4.1 Introduction .......................................236 8.5 Using Organic TFTs for Electronic Circuits ....................242 8.5.1 Thin-Film Transistor Circuits ........................242 8.5.2 Frequency Limitations of OTFTs .....................246 8.5.3 Integrated Display Drivers ...........................247 8.5.4 Radio Frequency Identification Tags ..................248 8.6 Conclusion ...............................................256 References .....................................................256 9 Semiconducting Polythiophenes for Field-Effect Transistor Devices in Flexible Electronics: Synthesis and Structure Property Relationships ..................................................261 Martin Heeney and Iain McCulloch 9.1 Introduction ..............................................261 9.2 Polymerization of Thiophene Monomers ......................264 9.2.1 General Considerations .............................264 9.2.2 Synthetic Routes for the Preparation of Thiophene Polymers .........................................264 9.3 Poly(3-Alkylthiophenes) ....................................273 9.3.1 Electrical Properties ................................275 9.3.2 Thin-film Device Processing and Morphology ..........276 9.3.3 Doping and Oxidative Stability .......................277 9.4 Polythiophene Structural Analogues ..........................279 9.5 Thienothiophene Polymers ..................................286 9.5.1 Poly(Thieno(2,3-b)Thiophenes) ......................286 9.5.2 PolyCThieno^^-tyThiophenes) ......................288 9.6 Summary ................................................292 References .....................................................293 xiv Contents 10 Solution Cast Films of Carbon Nanotubes for Transparent Conductors and Thin Film Transistors ...........................297 David Hecht and George Grüner 10.1 Introduction: Nanoscale Carbon for Electronics, the Value Proposition ......................................297 10.2 Carbon NT Film Properties .................................298 10.2.1 Carbon Nanotubes: The Building Blocks ...............298 10.2.2 Carbon Nanotube Network as an Electronic Material .....298 10.2.3 Electrical and Optical Properties of NT Films ...........300 10.2.4 Doping and Chemical Functionalization ...............304 10.3 Fabrication Technologies ...................................305 10.3.1 Solubilization .....................................306 10.3.2 Deposition ........................................306 10.4 Carbon NT Films as Conducting and Optically Transparent Material .......................................309 10.4.1 Network Properties: Sheet Conductance and Optical Transparency .....................................309 10.4.2 Applications: ITO Replacement ......................312 10.4.3 Challenges and the Path Forward .....................312 10.5 TFTs with Carbon Nanotube Conducting Channels .............313 10.5.1 Device Characteristics ..............................314 10.5.2 Device Parameters .................................316 10.5.3 Challenges and the Path Forward .....................323 10.6 Conclusions ..............................................324 References .....................................................325 11 Physics and Materials Issues of Organic Photovoltaics ..............329 Shawn R. Scully and Michael D. McGehee 11.1 Introduction ..............................................329 11.2 Basic Operation ...........................................329 11.2.1 Photocurrent ......................................331 11.2.2 Dark Current ......................................331 11.3 Organic and Hybrid Solar Cell Architectures ...................332 11.4 Materials .................................................334 11.5 Light Absorption ..........................................334 11.6 Exciton Harvesting ........................................338 11.6.1 Effects of Disorder .................................340 11.6.2 Extrinsic Defects ...................................344 11.6.3 Measuring Exciton Harvesting .......................344 11.6.4 Approaches to Overcome Small Diffusion Lengths ......347 11.7 Exciton Dissociation .......................................349 11.8 Dissociating Geminate Pairs .................................351 11.9 Heterojunction Energy Offsets ...............................355 11.10 Charge Transport and Recombination .........................357 11.10.1 Diffusion-Limited Recombination ....................359 Contents xv 11.10.2 Interface-Limited (Back Transfer Limited) Recombination ....................................360 11.10.3 Measurements Relevant for Extracting Charge..........363 11.11 Nanostructures ............................................364 11.12 Efficiency Limits and Outlook ...............................367 References .....................................................368 12 Bulk Heterojunction Solar Cells for Large-Area PV Fabrication on Flexible Substrates ..........................................373 C. Waldauf, G. Dennler, P. Schilinsky, and C. J. Brabec 12.1 Introduction and Motivation .................................373 12.1.1 Photovoltaics ......................................373 12.1.2 Technology Overview ..............................374 12.1.3 Motivation for Large-Area, Solution-Processable Photovoltaics .....................................375 12.2 The Concept of Bulk Heterojunction Solar Cells ................377 12.2.1 Basics of Organic Solar Cell Materials .................377 12.2.2 Fundamentals of Photovoltaics .......................378 12.2.3 Understanding and Optimization of BHJ Composites .... 385 12.3 Challenges for Large-Area Processing ........................401 12.3.1 Production Scheme .................................401 12.3.2 Encapsulation of Flexible Solar Cells ..................404 12.4 Conclusions ..............................................408 References .....................................................409 13 Substrates and Thin-Film Barrier Technology for Flexible Electronics ....................................................413 Ahmet Giin Erlat, Min Yan, and Anil R. Duggal 13.1 Introduction ..............................................413 13.2 Barrier Requirements ......................................414 13.2.1 Generic Requirements ..............................416 13.2.2 Substrate-Specific Requirements ......................417 13.3 Thin-Film Barrier Technology ...............................419 13.3.1 Historical Background ..............................419 13.3.2 Permeation Measurement Techniques .................420 13.3.3 Permeation Through Thin-Film Barriers ...............426 13.4 Barrier-Device Integration ..................................437 13.4.1 Substrate and Barrier Compatibility with OLEDs ........437 13.4.2 Thin-Film Encapsulation ............................440 13.5 Concluding Remarks .......................................442 References .....................................................442 Index .............................................................451
adam_txt	Contents 1 Overview of Flexible Electronics Technology . 1 I-Chun Cheng and Sigurd Wagner 1.1 History of Flexible Electronics . 1 1.2 Materials for Flexible Electronics . 3 1.2.1 Degrees of Flexibility . 3 1.2.2 Substrates . 5 1.2.3 Backplane Electronics . 8 1.2.4 Frontplane Technologies . 12 1.2.5 Encapsulation . 16 1.3 Fabrication Technology for Flexible Electronics . 18 1.3.1 Fabrication on Sheets by Batch Processing . 18 1.3.2 Fabrication on Web by Roll-to-Roll Processing . 19 1.3.3 Additive Printing . 20 1.4 Outlook . 20 References . 20 2 Mechanical Theory of the Film-on-Substrate-Foil Structure: Curvature and Overlay Alignment in Amorphous Silicon Thin-Film Devices Fabricated on Free-Standing Foil Substrates . 29 Helena Gleskova, I-Chun Cheng, Sigurd Wagner, and Zhigang Suo 2.1 Introduction . 29 2.2 Theory . 32 2.2.1 The Built-in Strain ε,,, . 35 2.3 Applications . 36 2.3.1 Strain in the Substrate, esÇTd), and the Film, ef(Td), at the Deposition Temperature Td . 36 2.3.2 Strain in the Substrate, гѕ(Тг), and the Film, tf(Tr), at Room Temperature Tr . 38 2.3.3 Radius of Curvature R of the Workpiece . 42 2.3.4 Strain of the Substrate and the Curvature of the Workpiece for a Three-Layer Structure . 46 2.3.5 Experimental Results for a-Si:H TFTs Fabricated on Kapton . 47 ii Contents 2.4 Conclusions . 50 References . 50 3 Low-temperature Amorphous and Nanocrystalline Silicon Materials and Thin-film Transistors . 53 Andrei Sazonov, Denis Striakhilev, and Arokia Nathan 3.1 Introduction . 53 3.2 Low-temperature Amorphous and Nanocrystalline Silicon Materials . 55 3.2.1 Fundamental Issues for Low-temperature Processing . 55 3.2.2 Low-temperature Amorphous Silicon . 56 3.2.3 Low-temperature Nanocrystalline Silicon . 56 3.3 Low-temperature Dielectrics . 57 3.3.1 Characteristics of Low-temperature Dielectric Thin-film Deposition . 57 3.3.2 Low-temperature Silicon Nitride Characteristics . 57 3.3.3 Low-temperature Silicon Oxide Characteristics . 58 3.4 Low-temperature Thin-film Transistor Devices . 59 3.4.1 Device Structures and Materials Processing . 60 3.4.2 Low-temperature a-Si:H Thin-Film Transistor Device Performance . 61 3.4.3 Contacts to a-Si:H Thin-film Transistors . 62 3.4.4 Low-temperature Doped nc-Si Contacts . 64 3.4.5 Low-temperature nc-Si TFTs . 66 3.5 Device Stability . 67 3.6 Conclusions and Future Prospective . 70 References . 70 4 Amorphous Silicon: Flexible Backplane and Display Application . 75 Kalluri R. Sarma 4.1 Introduction . 75 4.2 Enabling Technologies for Flexible Backplanes and Displays . 76 4.2.1 Flexible Substrate Technologies . 76 4.2.2 TFT Technologies for Flexible Backplanes . 82 4.2.3 Display Media for Flexible Displays (LCD, Reflective-EP, OLED) . 89 4.2.4 Barrier Layers . 90 4.3 Flexible Active Matrix Backplane Requirements for OLED Displays . 91 4.3.1 Active Matrix Addressing . 92 4.4 Flexible AMOLED Displays Using а -Si TFT Backplanes . 95 4.4.1 Backplane Fabrication Using PEN Plastic Substrates . 95 4.4.2 Flexible OLED Display Fabrication . 98 4.4.3 Flexible AMOLED Display Fabrication with Thin-film Encapsulation . 100 Contents xi 4.5 Flexible Electrophoretic Displays Fabricated using a-Si TFT Backplanes.102 4.6 Outlook for Low-Temperature a-Si TFT for Flexible Electronics Manufacturing .102 References .105 5 Flexible Transition Metal Oxide Electronics and Imprint Lithography .107 Warren B. Jackson 5.1 Introduction .107 5.2 Previous Work .108 5.3 Properties of Transistor Materials .113 5.3.1 Semiconductors .113 5.3.2 Dielectrics .115 5.3.3 Contact Materials .116 5.4 Device Structures .117 5.5 Fabrication on Flexible Substrates .119 5.5.1 Imprint Lithography .120 5.5.2 Self-Aligned Imprint Lithography .122 5.5.3 SAIL Transistor Results .126 5.5.4 Summary of Imprint Lithography .127 5.6 Flexible TMO Device Results .128 5.7 Future Problems and Areas of Research .133 5.7.1 Carrier Density Control .134 5.7.2 Low-Temperature Dielectrics .135 5.7.3 Etching of TMO Materials .135 5.7.4 P-type TMO .136 5.7.5 Stability .136 5.7.6 Flexure and Adhesion of TMO .137 5.7.7 Flexible Fabrication Method Yields .137 5.8 Summary .138 References .139 6 Materials and Novel Patterning Methods for Flexible Electronics .143 William S. Wong, Michael L. Chabinyc, Tse-Nga Ng, and Alberto Salleo 6.1 Introduction .143 6.2 Materials Considerations for Flexible Electronics .145 6.2.1 Overview .145 6.2.2 Inorganic Semiconductors and Dielectrics .145 6.2.3 Organic Semiconductors and Dielectrics .146 6.2.4 Conductors .149 6.3 Print-Processing Options for Device Fabrication .150 6.3.1 Overview .150 Contents 6.3.2 Control of Feature Sizes of Jet-Printed Liquids .151 6.3.3 Jet-Printing for Etch-Mask Patterning .153 6.3.4 Methods for Minimizing Feature Size .154 6.3.5 Printing Active Materials .156 6.4 Performance and Characterization of Electronic Devices .157 6.4.1 Overview .157 6.4.2 Bias Stress in Organic Thin-Film Transistors .158 6.4.3 Nonideal Scaling of Short-Channel Organic TFTs .163 6.4.4 Low-Temperature a-Si:H TFT Device Stability .165 6.4.5 Low-temperature a-Si:H p-i-n Devices .167 6.5 Printed Flexible Electronics .170 6.5.1 Overview .170 6.5.2 Digital Lithography for Flexible Image Sensor Arrays . 170 6.5.3 Printed Organic Backplanes .172 6.6 Conclusions and Future Prospects .176 References .176 7 Sheet-Type Sensors and Actuators .183 Takao Someya 7.1 Introduction .183 7.2 Sheet-type Image Scanners .184 7.2.1 Imaging Methods .185 7.2.2 Device Structure and Manufacturing Process .186 7.2.3 Electronic Performance of Organic Photodiodes .190 7.2.4 Organic Transistors .191 7.2.5 Photosensor Cells .193 7.2.6 Issues Related to Device Processes: Pixel Stability and Resolution . 195 7.2.7 A Hierarchal Approach for Slow Organic Circuits .196 7.2.8 The Double-Wordline and Double-Bitline Structure .196 7.2.9 A New Dynamic Second-Wordline Decoder .199 7.2.10 Higher Speed Operation with Lower Power Consumption . 199 7.2.11 New Applications and Future Prospects .200 7.3 Sheet-Type Braille Displays .201 7.3.1 Manufacturing Process .201 7.3.2 Electronic Performance of Braille Cells .204 7.3.3 Organic Transistor-based SRAM .210 7.3.4 Reading Tests .211 7.3.5 Future Prospects .212 7.4 Summary .212 References .213 Contents xiii 8 Organic and Polymeric TFTs for Flexible Displays and Circuits .215 Michael G. Kane 8.1 Introduction .215 8.2 Important Organic TFT Parameters for Electronic Systems .216 8.2.1 Field-Effect Mobility .216 8.2.2 Threshold Voltage .219 8.2.3 Subthreshold Swing .220 8.2.4 Leakage Currents .222 8.2.5 Contact Resistance .222 8.2.6 Capacitances and Frequency Response .223 8.2.7 TFT Nonuniformity .225 8.2.8 Bias-Stress Instability and Hysteresis .225 8.3 Active Matrix Displays .227 8.3.1 Introduction .227 8.3.2 Liquid Crystal and Electrophoretic Displays .228 8.4 Active Matrix OLED Displays .236 8.4.1 Introduction .236 8.5 Using Organic TFTs for Electronic Circuits .242 8.5.1 Thin-Film Transistor Circuits .242 8.5.2 Frequency Limitations of OTFTs .246 8.5.3 Integrated Display Drivers .247 8.5.4 Radio Frequency Identification Tags .248 8.6 Conclusion .256 References .256 9 Semiconducting Polythiophenes for Field-Effect Transistor Devices in Flexible Electronics: Synthesis and Structure Property Relationships .261 Martin Heeney and Iain McCulloch 9.1 Introduction .261 9.2 Polymerization of Thiophene Monomers .264 9.2.1 General Considerations .264 9.2.2 Synthetic Routes for the Preparation of Thiophene Polymers .264 9.3 Poly(3-Alkylthiophenes) .273 9.3.1 Electrical Properties .275 9.3.2 Thin-film Device Processing and Morphology .276 9.3.3 Doping and Oxidative Stability .277 9.4 Polythiophene Structural Analogues .279 9.5 Thienothiophene Polymers .286 9.5.1 Poly(Thieno(2,3-b)Thiophenes) .286 9.5.2 PolyCThieno^^-tyThiophenes) .288 9.6 Summary .292 References .293 xiv Contents 10 Solution Cast Films of Carbon Nanotubes for Transparent Conductors and Thin Film Transistors .297 David Hecht and George Grüner 10.1 Introduction: Nanoscale Carbon for Electronics, the Value Proposition .297 10.2 Carbon NT Film Properties .298 10.2.1 Carbon Nanotubes: The Building Blocks .298 10.2.2 Carbon Nanotube Network as an Electronic Material .298 10.2.3 Electrical and Optical Properties of NT Films .300 10.2.4 Doping and Chemical Functionalization .304 10.3 Fabrication Technologies .305 10.3.1 Solubilization .306 10.3.2 Deposition .306 10.4 Carbon NT Films as Conducting and Optically Transparent Material .309 10.4.1 Network Properties: Sheet Conductance and Optical Transparency .309 10.4.2 Applications: ITO Replacement .312 10.4.3 Challenges and the Path Forward .312 10.5 TFTs with Carbon Nanotube Conducting Channels .313 10.5.1 Device Characteristics .314 10.5.2 Device Parameters .316 10.5.3 Challenges and the Path Forward .323 10.6 Conclusions .324 References .325 11 Physics and Materials Issues of Organic Photovoltaics .329 Shawn R. Scully and Michael D. McGehee 11.1 Introduction .329 11.2 Basic Operation .329 11.2.1 Photocurrent .331 11.2.2 Dark Current .331 11.3 Organic and Hybrid Solar Cell Architectures .332 11.4 Materials .334 11.5 Light Absorption .334 11.6 Exciton Harvesting .338 11.6.1 Effects of Disorder .340 11.6.2 Extrinsic Defects .344 11.6.3 Measuring Exciton Harvesting .344 11.6.4 Approaches to Overcome Small Diffusion Lengths .347 11.7 Exciton Dissociation .349 11.8 Dissociating Geminate Pairs .351 11.9 Heterojunction Energy Offsets .355 11.10 Charge Transport and Recombination .357 11.10.1 Diffusion-Limited Recombination .359 Contents xv 11.10.2 Interface-Limited (Back Transfer Limited) Recombination .360 11.10.3 Measurements Relevant for Extracting Charge.363 11.11 Nanostructures .364 11.12 Efficiency Limits and Outlook .367 References .368 12 Bulk Heterojunction Solar Cells for Large-Area PV Fabrication on Flexible Substrates .373 C. Waldauf, G. Dennler, P. Schilinsky, and C. J. Brabec 12.1 Introduction and Motivation .373 12.1.1 Photovoltaics .373 12.1.2 Technology Overview .374 12.1.3 Motivation for Large-Area, Solution-Processable Photovoltaics .375 12.2 The Concept of Bulk Heterojunction Solar Cells .377 12.2.1 Basics of Organic Solar Cell Materials .377 12.2.2 Fundamentals of Photovoltaics .378 12.2.3 Understanding and Optimization of BHJ Composites . 385 12.3 Challenges for Large-Area Processing .401 12.3.1 Production Scheme .401 12.3.2 Encapsulation of Flexible Solar Cells .404 12.4 Conclusions .408 References .409 13 Substrates and Thin-Film Barrier Technology for Flexible Electronics .413 Ahmet Giin Erlat, Min Yan, and Anil R. Duggal 13.1 Introduction .413 13.2 Barrier Requirements .414 13.2.1 Generic Requirements .416 13.2.2 Substrate-Specific Requirements .417 13.3 Thin-Film Barrier Technology .419 13.3.1 Historical Background .419 13.3.2 Permeation Measurement Techniques .420 13.3.3 Permeation Through Thin-Film Barriers .426 13.4 Barrier-Device Integration .437 13.4.1 Substrate and Barrier Compatibility with OLEDs .437 13.4.2 Thin-Film Encapsulation .440 13.5 Concluding Remarks .442 References .442 Index .451
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spelling	Flexible electronics materials and applications William S. Wong ... eds. New York, NY Springer 2009 XVIII, 462 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic materials: science & technology Electronics Materials Flexible printed circuits Elektronik (DE-588)4014346-6 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Folienisolierter Flachleiter (DE-588)7525641-1 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Elektronik (DE-588)4014346-6 s Werkstoff (DE-588)4065579-9 s Folienisolierter Flachleiter (DE-588)7525641-1 s DE-604 Wong, William S. Sonstige oth Erscheint auch als Online-Ausgabe 978-0-387-74363-9 Digitalisierung UB Bayreuth application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016290521&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis
spellingShingle	Flexible electronics materials and applications Electronics Materials Flexible printed circuits Elektronik (DE-588)4014346-6 gnd Werkstoff (DE-588)4065579-9 gnd Folienisolierter Flachleiter (DE-588)7525641-1 gnd
subject_GND	(DE-588)4014346-6 (DE-588)4065579-9 (DE-588)7525641-1 (DE-588)4143413-4
title	Flexible electronics materials and applications
title_auth	Flexible electronics materials and applications
title_exact_search	Flexible electronics materials and applications
title_exact_search_txtP	Flexible electronics materials and applications
title_full	Flexible electronics materials and applications William S. Wong ... eds.
title_fullStr	Flexible electronics materials and applications William S. Wong ... eds.
title_full_unstemmed	Flexible electronics materials and applications William S. Wong ... eds.
title_short	Flexible electronics
title_sort	flexible electronics materials and applications
title_sub	materials and applications
topic	Electronics Materials Flexible printed circuits Elektronik (DE-588)4014346-6 gnd Werkstoff (DE-588)4065579-9 gnd Folienisolierter Flachleiter (DE-588)7525641-1 gnd
topic_facet	Electronics Materials Flexible printed circuits Elektronik Werkstoff Folienisolierter Flachleiter Aufsatzsammlung
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