Extended abstracts of the 2007 International Conference on Solid State Devices and Materials: September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba)
Saved in:
| Corporate Author: | |
|---|---|
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Tokyo
Publ. Office Inter Group Corp.
2007
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| Subjects: | |
| Physical Description: | LVII, 1213 S. Ill., graph. Darst. |
| ISBN: | 490107038X |
Staff View
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| id | DE-604.BV022932284 |
| illustrated | Illustrated |
| index_date | 2024-07-02T18:55:02Z |
| indexdate | 2024-07-09T21:07:57Z |
| institution | BVB |
| institution_GND | (DE-588)6072548-5 |
| isbn | 490107038X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-016137087 |
| oclc_num | 254680100 |
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| owner_facet | DE-706 |
| physical | LVII, 1213 S. Ill., graph. Darst. |
| publishDate | 2007 |
| publishDateSearch | 2007 |
| publishDateSort | 2007 |
| publisher | Publ. Office Inter Group Corp. |
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| spelling | International Conference on Solid State Devices and Materials 2007 Tsukuba Verfasser (DE-588)6072548-5 aut Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) Tokyo Publ. Office Inter Group Corp. 2007 LVII, 1213 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Elektronik (DE-588)4014346-6 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Elektronisches Bauelement (DE-588)4014360-0 s DE-604 Elektronik (DE-588)4014346-6 s Werkstoff (DE-588)4065579-9 s |
| spellingShingle | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) Elektronik (DE-588)4014346-6 gnd Werkstoff (DE-588)4065579-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4014346-6 (DE-588)4065579-9 (DE-588)4014360-0 (DE-588)1071861417 |
| title | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_auth | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_exact_search | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_exact_search_txtP | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_full | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_fullStr | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_full_unstemmed | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| title_short | Extended abstracts of the 2007 International Conference on Solid State Devices and Materials |
| title_sort | extended abstracts of the 2007 international conference on solid state devices and materials september 19 21 2007 tsukuba tsukuba international congress center epochal tsukuba |
| title_sub | September 19 - 21, 2007, Tsukuba, Tsukuba International Congress Center (Epochal Tsukuba) |
| topic | Elektronik (DE-588)4014346-6 gnd Werkstoff (DE-588)4065579-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Elektronik Werkstoff Elektronisches Bauelement Konferenzschrift |
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