Solder joint technology: materials, properties, and reliability
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| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York
Springer
2007
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| Series: | Springer series in materials science
92 |
| Subjects: | |
| Online Access: | Inhaltstext Inhaltsverzeichnis |
| Physical Description: | XVI, 368 S. Ill., graph. Darst. |
| ISBN: | 9780387388908 0387388907 |
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MARC
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| 245 | 1 | 0 | |a Solder joint technology |b materials, properties, and reliability |c King-Ning Tu |
| 264 | 1 | |a New York |b Springer |c 2007 | |
| 300 | |a XVI, 368 S. |b Ill., graph. Darst. | ||
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| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Springer series in materials science |v 92 | |
| 650 | 4 | |a Metals |x Weldability | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Welded joints | |
| 650 | 4 | |a Welded joints |x Reliability | |
| 650 | 0 | 7 | |a Lötverbindung |0 (DE-588)4195776-3 |2 gnd |9 rswk-swf |
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| _version_ | 1805089147535228928 |
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| adam_text |
KING-NING TU SOLDER JOINT TECHNOLOGY MATERIALS, PROPERTIES, AND
RELIABILITY QA SPRINGER CONTENTS 1 INTRODUCTION 1 1.1 INTRODUCTION OF
SOLDER JOINT 1 1.2 LEAD-FREE SOLDERS 4 1.2.1 EUTECTIC PB-FREE SOLDERS 4
1.2.2 HIGH-TEMPERATURE PB-FREE SOLDERS 8 1.3 SOLDER JOINT TECHNOLOGY 9
1.3.1 SURFACE MOUNT TECHNOLOGY 9 1.3.2 PIN-THROUGH-HOLE TECHNOLOGY 10
1.3.3 C-4 FLIP CHIP TECHNOLOGY 12 1.4 RELIABILITY PROBLEMS IN SOLDER
JOINT TECHNOLOGY 16 1.4.1 SN WHISKERS 16 1.4.2 SPALLING OF INTERFACIAL
INTERMETALLIC COMPOUNDS IN DIRECT CHIP ATTACHMENT 17 1.4.3
THERMAL-MECHANICAL STRESSES 22 1.4.4 IMPACT FRACTURE 25 1.4.5
ELECTROMIGRATION AND THERMOMIGRATION., 25 1.4.6 RELIABILITY SCIENCE ON
THE BASIS OF NONEQUILIBRIUFN THERMODYNAMICS ! .; ; 26 1.5 FUTURE
TRENDS IN ELECTRONIC PACKAGING FF 28 1.5.1 THE TREND OF MINIATURIZATION
.-** 28 1.5.2 THE TREND OF PACKAGING INTEGRATION EVOLUTION^VSIP, SOP,
AND SOC '. V 29 1.5.3 CHIP-PACKAGING INTERACTION ': 30 1.5.4 SOLDERLESS
JOINTS 31 REFERENCES 31 PART I COPPER*TIN REACTIONS 2 COPPER-TIN
REACTIONS IN BULK SAMPLES 37 2.1 INTRODUCTION 37 2.2 WETTING REACTION OF
EUTECTIC SNPB ON CU FOILS 38 VI CONTENTS 2.2.1 CRYSTALLOGRAPHIC
RELATIONSHIP BETWEEN SCALLOP AND CU 43 2.2.2 RATE OF CONSUMPTION OF CU
IN SOLDERING REACTION WITH EUTECTIC SNPB 48 2.3 WETTING REACTION OF SNPB
ON CU FOIL AS A FUNCTION OF SOLDER COMPOSITION 48 2.4 WETTING REACTION
OF PURE SN ON CU FOILS 52 2.5 TERNARY PHASE DIAGRAM OF SN-PB-CU 53 2.5.1
TERNARY SNPBCU PHASE DIAGRAMS AT 200 AND 170 C . 56 2.5.2 5SN95PB/CU
REACTION AND TERNARY SNPBCU PHASE DIAGRAMS AT 350C 57 2.6 SOLID-STATE
REACTION OF EUTECTIC SNPB ON CU FOILS 58 2.6.1 FORMATION OF CU3SN AND
KIRKENDALL VOIDS 58 2.7 COMPARISON BETWEEN WETTING AND SOLID-STATE
REACTIONS 60 2.7.1 MORPHOLOGY OF WETTING REACTION AND SOLID-STATE AGING
60 2.7.2 KINETICS OF WETTING REACTION AND SOLID-STATE AGING 64 2.7.3
REACTIONS CONTROLLED BY RATE OF GIBBS FREE ENERGY CHANGE 67 2.8 WETTING
REACTION OF PB-FREE EUTECTIC SOLDERS ON THICK CU UBM 68 REFERENCES 70 3
COPPER-TIN REACTIONS IN THIN-FILM SAMPLES 73 3.1 INTRODUCTION 73 3.2
ROOM-TEMPERATURE REACTION IN A BILAYER THIN FILM OF SN/CU 74 3.2.1 PHASE
IDENTIFICATION BY GLANCING INCIDENCE X-RAY DIFFRACTION . .' 74 3.2.2
GROWTH KINETICS OF CU 6 SN 5 ^AND CU 3 SN 75 3.2.3 COPPER IS THE
DOMINANT DIFFUSING SPECIES ;. 80 3.2.4 KINETIC ANALYSIS OF SEQUENTIAL
FORMATION OF AND CU 3 SN .' 81 3.2.5 ATOMISTIC MODEL OF
INTERFACIAL-REACTION COEFFICIENT 89 3.2.6 MEASUREMENT OF STRAIN IN CU
AND SN THIN FILMS 92 3.3 SPALLING IN WETTING REACTION OF EUTECTIC SNPB
ON CU' THIN FILMS 93 3.4 NO SPALLING IN HIGH-PB SOLDER ON AU/CU/CU-CR
THIN FILMS 97 3.5 SPALLING IN EUTECTIC SNPB SOLDER ON AU/CU/CU-CR THIN
FILMS 100 3.6 NO SPALLING IN EUTECTIC SNPB ON CU/NI(V)/AL THIN FILMS 100
CONTENTS VII 3.7 SPALLING IN EUTECTIC SNAGCU SOLDER ON CU/NI(V)/AL THIN
FILMS 101 3.8 ENHANCED SPALLING DUE TO INTERACTION ACROSS A SOLDER JOINT
104 3.9 WETTING TIP REACTION ON THIN-FILM-COATED V-GROOVES 105
REFERENCES 108 4 COPPER-TIN REACTIONS IN FLIP CHIP SOLDER JOINTS 111 4.1
INTRODUCTION ILL 4.2 PROCESSING A FLIP CHIP SOLDER JOINT AND A COMPOSITE
SOLDER JOINT 113 4.3 CHEMICAL INTERACTION ACROSS A FLIP CHIP SOLDER
JOINT 116 4.4 ENHANCED DISSOLUTION OF CU-SN IMC BY ELECTROMIGRATION 117
4.5 ENHANCED PHASE SEPARATION IN SOLDER ALLOYS BY ELECTROMIGRATION AND
THERMOMIGRATION 119 4.6 THERMAL STABILITY OF BULK DIFFUSION COUPLES OF
SNPB ALLOYS 123 4.7 THERMAL STRESS DUE TO CHIP-PACKAGING INTERACTION 124
4.8 DESIGN AND MATERIALS SELECTION OF A FLIP CHIP SOLDER JOINT 124
REFERENCES 125 5 KINETIC ANALYSIS OF FLUX-DRIVEN RIPENING OF COPPER-TIN
SCALLOPS 127 5.1 INTRODUCTION 127 5.2 MORPHOLOGICAL STABILITY OF
SCALLOP-TYPE IMC GROWTH IN WETTING REACTIONS 128 5.2.1 ANALYSIS OF
MORPHOLOGICAL STABILITY OF SCALLOPS IN WETTING REACTIONS 131 5.3 A
SIMPLE MODEL FOR THE GROWTH OF MONO-SIZE , HEMISPHERES .*.- 135 5.4
THEORY OF NONCONSERVATIVE RIPENING WITH A CONSTANT - SURFACE AREA -?.
139 5.5 SIZE DISTRIBUTION OF SCALLOPS .'I 142 5.5.1 DEPENDENCE OF CUESNS
MORPHOLOGY ON , Y SOLDER COMPOSITION.' .- 143 5.5.2 SIZE DISTRIBUTION
AND AVERAGE RADIUS OF SCALLOPS 147 5.6 NANO CHANNELS BETWEEN SCALLOPS
150 REFERENCES 150 6 SPONTANEOUS TIN WHISKER GROWTH: MECHANISM AND
PREVENTION 153 6.1 INTRODUCTION 153 6.2 MORPHOLOGY OF SPONTANEOUS SN
WHISKER GROWTH 154 VIII CONTENTS 6.3 STRESS GENERATION (DRIVING FORCE)
IN SN WHISKER GROWTH BY CU-SN REACTION 157 6.4 EFFECT OF SURFACE SN
OXIDE ON STRESS GRADIENT GENERATION AND WHISKER GROWTH 160 6.5
MEASUREMENT OF STRESS DISTRIBUTION BY SYNCHROTRON RADIATION
MICRO-DIFFRACTION 163 6.6 STRESS RELAXATION (KINETIC PROCESS) IN SN
WHISKER GROWTH BY CREEP: BROKEN OXIDE MODEL 168 6.7 IRREVERSIBLE
PROCESSES 169 6.8 KINETICS OF GRAIN BOUNDARY DIFFUSION-CONTROLLED
WHISKER GROWTH 170 6.9 ACCELERATED TEST OF SN WHISKER GROWTH 175 6.10
PREVENTION OF SPONTANEOUS SN WHISKER GROWTH 178 REFERENCES 180 7 SOLDER
REACTIONS ON NICKEL, PALLADIUM, AND GOLD 183 7.1 INTRODUCTION 183 7.2
SOLDER REACTIONS ON BULK AND THIN-FILM NI 184 7.2.1 REACTION BETWEEN
EUTECTIC SNPB AND ELECTROLESS NI(P) 188 7.2.2 REACTION BETWEEN EUTECTIC
PB-FREE SOLDERS AND ELECTROLESS NI(P) 191 7.2.3 FORMATION OF (CU, NI) E
SN 5 VERSUS (NI, CU) 3 SN 4 193 7.2.4 FORMATION OF KIRKENDALL VOIDS 194
7.3 SOLDER REACTIONS ON BULK AND THIN-FILM PD 194 7.3.1 REACTION BETWEEN
EUTECTIC SNPB AND PD FOIL 194 7.3.2 REACTION BETWEEN EUTECTIC SNPB AND
PD THIN FILM 197 7.4 SOLDER REACTIONS ON BULK AND THIN-FILM AU 198 7.4.1
REACTION BETWEEN EUTECTIC SNPB AND AU FOIL 198 7.4.2 REACTION BETWEEN
EUTECTIC SNPB AND AU . THIN FILM .;. 204 REFERENCES .*'.%. 204 PART II
ELECTROMIGRATION AND THERMOMIGRATION 8 FUNDAMENTALS OF ELECTROMIGRATION
211 8.1 INTRODUCTION 211 8.2 ELECTROMIGRATION IN METALLIC INTERCONNECTS
214 8.3 ELECTRON WIND FORCE OF ELECTROMIGRATION 217 8.4 CALCULATION OF
THE EFFECTIVE CHARGE NUMBER 221 8.5 EFFECT OF BACK STRESS ON
ELECTROMIGRATION AND VICE VERSA 222 CONTENTS IX 8.6 MEASUREMENT OF
CRITICAL LENGTH, CRITICAL PRODUCT, EFFECTIVE CHARGE NUMBER 225 8.7 WHY
IS THERE BACK STRESS IN ELECTROMIGRATION? 226 8.8 MEASUREMENT OF THE
BACK STRESS INDUCED BY ELECTROMIGRATION 229 8.9 CURRENT CROWDING AND
CURRENT DENSITY GRADIENT FORCE 230 8.10 ELECTROMIGRATION IN ANISOTROPIC
CONDUCTOR OF BETA-SN 235 8.11 ELECTROMIGRATION OF A GRAIN BOUNDARY IN
ANISOTROPIC CONDUCTOR 238 8.12 AC ELECTROMIGRATION 240 REFERENCES 241 9
ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 245 9.1 INTRODUCTION 245 9.2
UNIQUE BEHAVIORS OF ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 247
9.2.1 LOW CRITICAL PRODUCT OF SOLDER ALLOYS 247 9.2.2 CURRENT CROWDING
IN FLIP CHIP SOLDER JOINTS 247 9.2.3 PHASE SEPARATION IN EUTECTIC SOLDER
JOINTS 248 9.2.4 NARROW RANGE OF CURRENT DENSITY 248 9.2.5 EFFECT OF
UNDER-BUMP METALLIZATION ON ELECTROMIGRATION 249 9.3 FAILURE MODE OF
ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 249 9.4 ELECTROMIGRATION IN
FLIP CHIP EUTECTIC SOLDER JOINTS 255 9.4.1 ELECTROMIGRATION IN EUTECTIC
SNPB FLIP CHIP SOLDER JOINTS 256 9.4.2 ELECTROMIGRATION IN EUTECTIC
SNAGCU FLIP CHIP SOLDER JOINTS 259 9.4.3 MARKER MOTION ANALYSIS USING
AREA ARRAY OF NANO-INDENTATIONS '. ." . : I 261 9.4.4
MEAN-TIME-TO-FAILURE OF FLIP CHIP SOLDER JOINTS 264 9.4.5 COMPARISON
BETWEEN EUTECTIC SNPB AND SNAGCU FLIP CHIP SOLDER JOINTS ,.':* 266
9.4.6 KINETIC ANALYSIS OF PANCAKE-TYPE VOID GJOWTH ALONG THE CONTACT
INTERFACE -. 267 9.4.7 TIME-DEPENDENT MELTING OF FLIP CHIP SOLDER JOINTS
270 9.5 ELECTROMIGRATION IN FLIP CHIP COMPOSITE SOLDER JOINTS 272 9.5.1
THIN-FILM CU UBM IN COMPOSITE SOLDER JOINTS 272 9.5.2 THICK CU UBM IN
COMPOSITE SOLDER JOINTS 274 9.6 EFFECT OF THICKNESS OF CU UBM ON CURRENT
CROWDING AND FAILURE MODE 275 9.6.1 CU COLUMN BUMPS 276 9.6.2 THE DESIGN
OF A NEAR-IDEAL FLIP CHIP SOLDER JOINT 280 X CONTENTS 9.7
ELECTROMIGRATION-INDUCED PHASE SEPARATION IN EUTECTIC TWO-PHASE SOLDER
ALLOY 281 9.7.1 ELECTROMIGRATION-INDUCED BACK STRESS IN TWO-PHASE
STRUCTURE 283 9.7.2 ELECTROMIGRATION-INDUCED KIRKENDALL SHIFT IN
TWO-PHASE STRUCTURE 285 9.7.3 STOCHASTIC TENDENCY IN ELECTROMIGRATION IN
TWO-PHASE STRUCTURE 286 REFERENCES 287 10 POLARITY EFFECT OF
ELECTROMIGRATION ON SOLDER REACTIONS 289 10.1 INTRODUCTION 289 10.2
PREPARATION OF V-GROOVE SAMPLES 289 10.2.1 ELECTROMIGRATION OF EUTECTIC
SNPB AS A FUNCTION OF TEMPERATURE 291 10.3 POLARITY EFFECT ON IMC GROWTH
AT THE ANODE 293 10.3.1 IMC GROWTH WITHOUT ELECTRIC CURRENT 294 10.3.2
GROWTH OF IMC AT ANODE AND CATHODE WITH ELECTRIC CURRENT 294 10.3.3 IMC
THICKNESS CHANGE WITH CURRENT DENSITY AND TEMPERATURE 295 10.3.4
COMPARISON AMONG ELECTRODES OF CU, NI, AND PD IN V-GROOVE SAMPLES 297
10.4 POLARITY EFFECT ON IMC GROWTH AT THE CATHODE 297 10.4.1 DYNAMIC
EQUILIBRIUM 299 10.5 EFFECT OF ELECTROMIGRATION ON THE COMPETING GROWTH
OF IMC 301 REFERENCES 302 11 DUCTILE-TO-BRITTLE TRANSITION OF SOLDER
JOINTS AFFECTED BY COPPER-TIN REACTION AND ELECTROMIGRATION . 305 11.1
INTRODUCTION : , 305' 11.2 TENSILE TEST AFFECTED BY ELECTROMIGRATION
.-.;: 306 11.3 SHEAR TEST AFFECTED BY ELECTROMIGRATION .' 309 11.4
IMPACT TEST .* '.?. 311 11.4.1 CHARPY TEST 311 11.4.2 MINI CHARPY
MACHINE TO TEST SOLDER JOINTS.: 314 11.5 DROP TEST 316 11.5.1
JEDEC-JESD22-B111 STANDARD OF DROP TEST 316 11.5.2 DROPPING OF A
PACKAGING BOARD VERTICALLY AND THE TORQUE ON SOLDER BALLS 320 11.6
CONVERTING A MINI CHARPY IMPACT MACHINE TO PERFORM DROP TEST 322 11.6.1
DROPPING OF A CHIP SIZE PACKAGE HORIZONTALLY IN MINI CHARPY MACHINE 323
CONTENTS XI 11.6.2 DROPPING OF A CHIP SIZE PACKAGE VERTICALLY IN MINI
CHARPY MACHINE 325 11.7 CREEP AND ELECTROMIGRATION 325 REFERENCES 326 12
THERMOMIGRATION 327 12.1 INTRODUCTION 327 12.2 THERMOMIGRATION IN FLIP
CHIP SOLDER JOINTS OF SNPB 329 12.2.1 THERMOMIGRATION IN UNPOWERED
COMPOSITE SOLDER JOINTS 329 12.2.2 IN SITU OBSERVATIO N OF
THERMOMIGRATION 332 12.2.3 RANDOM STATES OF PHASE SEPARATION IN EUTECTIC
TWO-PHASE STRUCTURES 333 12.2.4 THERMOMIGRATION IN UNPOWERED EUTECTIC
SNPB SOLDER JOINTS 335 12.3 FUNDAMENTALS OF THERMOMIGRATION 338 12.3.1
DRIVING FORCE OF THERMOMIGRATION 338 12.3.2 ENTROPY PRODUCTION 340
12.3.3 EFFECT OF CONCENTRATION GRADIENT ON THERMOMIGRATION 341 12.3.4
THE CRITICAL LENGTH BELOW WHICH NO THERMOMIGRATION OCCURS IN A PURE
METAL 342 12.3.5 THERMOMIGRATION IN A EUTECTIC TWO-PHASE ALLOY 343 12.4
THERMOMIGRATION AND DC ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 344
12.5 THERMOMIGRATION AND AC ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS
344 12.6 THERMOMIGRATION AND CHEMICAL REACTION IN SOLDER JOINTS 345 12.7
THERMOMIGRATION AND CREEP IN SOLDER JOINTS. 345 REFERENCES :.,. ".'.
346 APPENDIX A: DIFFUSIVITY OF VACANCY MECHANISM OF DIFFUSION IN SOLIDS
* "".' 347 APPENDIX B: GROWTH AND RIPENING EQUATIONS^ OF PRECIPITATES "
* 351 APPENDIX C: DERIVATION OF HUNTINGTON'S ELECTRON WIND FORCE 359
SUBJECT INDEX 365 |
| adam_txt |
KING-NING TU SOLDER JOINT TECHNOLOGY MATERIALS, PROPERTIES, AND
RELIABILITY QA SPRINGER CONTENTS 1 INTRODUCTION 1 1.1 INTRODUCTION OF
SOLDER JOINT 1 1.2 LEAD-FREE SOLDERS 4 1.2.1 EUTECTIC PB-FREE SOLDERS 4
1.2.2 HIGH-TEMPERATURE PB-FREE SOLDERS 8 1.3 SOLDER JOINT TECHNOLOGY 9
1.3.1 SURFACE MOUNT TECHNOLOGY 9 1.3.2 PIN-THROUGH-HOLE TECHNOLOGY 10
1.3.3 C-4 FLIP CHIP TECHNOLOGY 12 1.4 RELIABILITY PROBLEMS IN SOLDER
JOINT TECHNOLOGY 16 1.4.1 SN WHISKERS 16 1.4.2 SPALLING OF INTERFACIAL
INTERMETALLIC COMPOUNDS IN DIRECT CHIP ATTACHMENT 17 1.4.3
THERMAL-MECHANICAL STRESSES 22 1.4.4 IMPACT FRACTURE 25 1.4.5
ELECTROMIGRATION AND THERMOMIGRATION., 25 1.4.6 RELIABILITY SCIENCE ON
THE BASIS OF NONEQUILIBRIUFN THERMODYNAMICS ! .; ; 26 1.5 FUTURE
TRENDS IN ELECTRONIC PACKAGING FF 28 1.5.1 THE TREND OF MINIATURIZATION
.-** 28 1.5.2 THE TREND OF PACKAGING INTEGRATION EVOLUTION^VSIP, SOP,
AND SOC '. V 29 1.5.3 CHIP-PACKAGING INTERACTION ': 30 1.5.4 SOLDERLESS
JOINTS 31 REFERENCES 31 PART I COPPER*TIN REACTIONS 2 COPPER-TIN
REACTIONS IN BULK SAMPLES 37 2.1 INTRODUCTION 37 2.2 WETTING REACTION OF
EUTECTIC SNPB ON CU FOILS 38 VI CONTENTS 2.2.1 CRYSTALLOGRAPHIC
RELATIONSHIP BETWEEN SCALLOP AND CU 43 2.2.2 RATE OF CONSUMPTION OF CU
IN SOLDERING REACTION WITH EUTECTIC SNPB 48 2.3 WETTING REACTION OF SNPB
ON CU FOIL AS A FUNCTION OF SOLDER COMPOSITION 48 2.4 WETTING REACTION
OF PURE SN ON CU FOILS 52 2.5 TERNARY PHASE DIAGRAM OF SN-PB-CU 53 2.5.1
TERNARY SNPBCU PHASE DIAGRAMS AT 200 AND 170 C . 56 2.5.2 5SN95PB/CU
REACTION AND TERNARY SNPBCU PHASE DIAGRAMS AT 350C 57 2.6 SOLID-STATE
REACTION OF EUTECTIC SNPB ON CU FOILS 58 2.6.1 FORMATION OF CU3SN AND
KIRKENDALL VOIDS 58 2.7 COMPARISON BETWEEN WETTING AND SOLID-STATE
REACTIONS 60 2.7.1 MORPHOLOGY OF WETTING REACTION AND SOLID-STATE AGING
60 2.7.2 KINETICS OF WETTING REACTION AND SOLID-STATE AGING 64 2.7.3
REACTIONS CONTROLLED BY RATE OF GIBBS FREE ENERGY CHANGE 67 2.8 WETTING
REACTION OF PB-FREE EUTECTIC SOLDERS ON THICK CU UBM 68 REFERENCES 70 3
COPPER-TIN REACTIONS IN THIN-FILM SAMPLES 73 3.1 INTRODUCTION 73 3.2
ROOM-TEMPERATURE REACTION IN A BILAYER THIN FILM OF SN/CU 74 3.2.1 PHASE
IDENTIFICATION BY GLANCING INCIDENCE X-RAY DIFFRACTION . .' 74 3.2.2
GROWTH KINETICS OF CU 6 SN 5 ^AND CU 3 SN 75 3.2.3 COPPER IS THE
DOMINANT DIFFUSING SPECIES ;. 80 3.2.4 KINETIC ANALYSIS OF SEQUENTIAL
FORMATION OF AND CU 3 SN .' 81 3.2.5 ATOMISTIC MODEL OF
INTERFACIAL-REACTION COEFFICIENT 89 3.2.6 MEASUREMENT OF STRAIN IN CU
AND SN THIN FILMS 92 3.3 SPALLING IN WETTING REACTION OF EUTECTIC SNPB
ON CU' THIN FILMS 93 3.4 NO SPALLING IN HIGH-PB SOLDER ON AU/CU/CU-CR
THIN FILMS 97 3.5 SPALLING IN EUTECTIC SNPB SOLDER ON AU/CU/CU-CR THIN
FILMS 100 3.6 NO SPALLING IN EUTECTIC SNPB ON CU/NI(V)/AL THIN FILMS 100
CONTENTS VII 3.7 SPALLING IN EUTECTIC SNAGCU SOLDER ON CU/NI(V)/AL THIN
FILMS 101 3.8 ENHANCED SPALLING DUE TO INTERACTION ACROSS A SOLDER JOINT
104 3.9 WETTING TIP REACTION ON THIN-FILM-COATED V-GROOVES 105
REFERENCES 108 4 COPPER-TIN REACTIONS IN FLIP CHIP SOLDER JOINTS 111 4.1
INTRODUCTION ILL 4.2 PROCESSING A FLIP CHIP SOLDER JOINT AND A COMPOSITE
SOLDER JOINT 113 4.3 CHEMICAL INTERACTION ACROSS A FLIP CHIP SOLDER
JOINT 116 4.4 ENHANCED DISSOLUTION OF CU-SN IMC BY ELECTROMIGRATION 117
4.5 ENHANCED PHASE SEPARATION IN SOLDER ALLOYS BY ELECTROMIGRATION AND
THERMOMIGRATION 119 4.6 THERMAL STABILITY OF BULK DIFFUSION COUPLES OF
SNPB ALLOYS 123 4.7 THERMAL STRESS DUE TO CHIP-PACKAGING INTERACTION 124
4.8 DESIGN AND MATERIALS SELECTION OF A FLIP CHIP SOLDER JOINT 124
REFERENCES 125 5 KINETIC ANALYSIS OF FLUX-DRIVEN RIPENING OF COPPER-TIN
SCALLOPS 127 5.1 INTRODUCTION 127 5.2 MORPHOLOGICAL STABILITY OF
SCALLOP-TYPE IMC GROWTH IN WETTING REACTIONS 128 5.2.1 ANALYSIS OF
MORPHOLOGICAL STABILITY OF SCALLOPS IN WETTING REACTIONS 131 5.3 A
SIMPLE MODEL FOR THE GROWTH OF MONO-SIZE , HEMISPHERES .*.- 135 5.4
THEORY OF NONCONSERVATIVE RIPENING WITH A CONSTANT - SURFACE AREA -?.
139 5.5 SIZE DISTRIBUTION OF SCALLOPS .'I 142 5.5.1 DEPENDENCE OF CUESNS
MORPHOLOGY ON , Y SOLDER COMPOSITION.' .- 143 5.5.2 SIZE DISTRIBUTION
AND AVERAGE RADIUS OF SCALLOPS 147 5.6 NANO CHANNELS BETWEEN SCALLOPS
150 REFERENCES 150 6 SPONTANEOUS TIN WHISKER GROWTH: MECHANISM AND
PREVENTION 153 6.1 INTRODUCTION 153 6.2 MORPHOLOGY OF SPONTANEOUS SN
WHISKER GROWTH 154 VIII CONTENTS 6.3 STRESS GENERATION (DRIVING FORCE)
IN SN WHISKER GROWTH BY CU-SN REACTION 157 6.4 EFFECT OF SURFACE SN
OXIDE ON STRESS GRADIENT GENERATION AND WHISKER GROWTH 160 6.5
MEASUREMENT OF STRESS DISTRIBUTION BY SYNCHROTRON RADIATION
MICRO-DIFFRACTION 163 6.6 STRESS RELAXATION (KINETIC PROCESS) IN SN
WHISKER GROWTH BY CREEP: BROKEN OXIDE MODEL 168 6.7 IRREVERSIBLE
PROCESSES 169 6.8 KINETICS OF GRAIN BOUNDARY DIFFUSION-CONTROLLED
WHISKER GROWTH 170 6.9 ACCELERATED TEST OF SN WHISKER GROWTH 175 6.10
PREVENTION OF SPONTANEOUS SN WHISKER GROWTH 178 REFERENCES 180 7 SOLDER
REACTIONS ON NICKEL, PALLADIUM, AND GOLD 183 7.1 INTRODUCTION 183 7.2
SOLDER REACTIONS ON BULK AND THIN-FILM NI 184 7.2.1 REACTION BETWEEN
EUTECTIC SNPB AND ELECTROLESS NI(P) 188 7.2.2 REACTION BETWEEN EUTECTIC
PB-FREE SOLDERS AND ELECTROLESS NI(P) 191 7.2.3 FORMATION OF (CU, NI) E
SN 5 VERSUS (NI, CU) 3 SN 4 193 7.2.4 FORMATION OF KIRKENDALL VOIDS 194
7.3 SOLDER REACTIONS ON BULK AND THIN-FILM PD 194 7.3.1 REACTION BETWEEN
EUTECTIC SNPB AND PD FOIL 194 7.3.2 REACTION BETWEEN EUTECTIC SNPB AND
PD THIN FILM 197 7.4 SOLDER REACTIONS ON BULK AND THIN-FILM AU 198 7.4.1
REACTION BETWEEN EUTECTIC SNPB AND AU FOIL 198 7.4.2 REACTION BETWEEN
EUTECTIC SNPB AND AU . THIN FILM .;. 204 REFERENCES .*'.%. 204 PART II
ELECTROMIGRATION AND THERMOMIGRATION 8 FUNDAMENTALS OF ELECTROMIGRATION
211 8.1 INTRODUCTION 211 8.2 ELECTROMIGRATION IN METALLIC INTERCONNECTS
214 8.3 ELECTRON WIND FORCE OF ELECTROMIGRATION 217 8.4 CALCULATION OF
THE EFFECTIVE CHARGE NUMBER 221 8.5 EFFECT OF BACK STRESS ON
ELECTROMIGRATION AND VICE VERSA 222 CONTENTS IX 8.6 MEASUREMENT OF
CRITICAL LENGTH, CRITICAL PRODUCT, EFFECTIVE CHARGE NUMBER 225 8.7 WHY
IS THERE BACK STRESS IN ELECTROMIGRATION? 226 8.8 MEASUREMENT OF THE
BACK STRESS INDUCED BY ELECTROMIGRATION 229 8.9 CURRENT CROWDING AND
CURRENT DENSITY GRADIENT FORCE 230 8.10 ELECTROMIGRATION IN ANISOTROPIC
CONDUCTOR OF BETA-SN 235 8.11 ELECTROMIGRATION OF A GRAIN BOUNDARY IN
ANISOTROPIC CONDUCTOR 238 8.12 AC ELECTROMIGRATION 240 REFERENCES 241 9
ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 245 9.1 INTRODUCTION 245 9.2
UNIQUE BEHAVIORS OF ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 247
9.2.1 LOW CRITICAL PRODUCT OF SOLDER ALLOYS 247 9.2.2 CURRENT CROWDING
IN FLIP CHIP SOLDER JOINTS 247 9.2.3 PHASE SEPARATION IN EUTECTIC SOLDER
JOINTS 248 9.2.4 NARROW RANGE OF CURRENT DENSITY 248 9.2.5 EFFECT OF
UNDER-BUMP METALLIZATION ON ELECTROMIGRATION 249 9.3 FAILURE MODE OF
ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 249 9.4 ELECTROMIGRATION IN
FLIP CHIP EUTECTIC SOLDER JOINTS 255 9.4.1 ELECTROMIGRATION IN EUTECTIC
SNPB FLIP CHIP SOLDER JOINTS 256 9.4.2 ELECTROMIGRATION IN EUTECTIC
SNAGCU FLIP CHIP SOLDER JOINTS 259 9.4.3 MARKER MOTION ANALYSIS USING
AREA ARRAY OF NANO-INDENTATIONS '. ." . : I 261 9.4.4
MEAN-TIME-TO-FAILURE OF FLIP CHIP SOLDER JOINTS 264 9.4.5 COMPARISON
BETWEEN EUTECTIC SNPB AND SNAGCU FLIP CHIP SOLDER JOINTS ,.':* 266
9.4.6 KINETIC ANALYSIS OF PANCAKE-TYPE VOID GJOWTH ALONG THE CONTACT
INTERFACE -. 267 9.4.7 TIME-DEPENDENT MELTING OF FLIP CHIP SOLDER JOINTS
270 9.5 ELECTROMIGRATION IN FLIP CHIP COMPOSITE SOLDER JOINTS 272 9.5.1
THIN-FILM CU UBM IN COMPOSITE SOLDER JOINTS 272 9.5.2 THICK CU UBM IN
COMPOSITE SOLDER JOINTS 274 9.6 EFFECT OF THICKNESS OF CU UBM ON CURRENT
CROWDING AND FAILURE MODE 275 9.6.1 CU COLUMN BUMPS 276 9.6.2 THE DESIGN
OF A NEAR-IDEAL FLIP CHIP SOLDER JOINT 280 X CONTENTS 9.7
ELECTROMIGRATION-INDUCED PHASE SEPARATION IN EUTECTIC TWO-PHASE SOLDER
ALLOY 281 9.7.1 ELECTROMIGRATION-INDUCED BACK STRESS IN TWO-PHASE
STRUCTURE 283 9.7.2 ELECTROMIGRATION-INDUCED KIRKENDALL SHIFT IN
TWO-PHASE STRUCTURE 285 9.7.3 STOCHASTIC TENDENCY IN ELECTROMIGRATION IN
TWO-PHASE STRUCTURE 286 REFERENCES 287 10 POLARITY EFFECT OF
ELECTROMIGRATION ON SOLDER REACTIONS 289 10.1 INTRODUCTION 289 10.2
PREPARATION OF V-GROOVE SAMPLES 289 10.2.1 ELECTROMIGRATION OF EUTECTIC
SNPB AS A FUNCTION OF TEMPERATURE 291 10.3 POLARITY EFFECT ON IMC GROWTH
AT THE ANODE 293 10.3.1 IMC GROWTH WITHOUT ELECTRIC CURRENT 294 10.3.2
GROWTH OF IMC AT ANODE AND CATHODE WITH ELECTRIC CURRENT 294 10.3.3 IMC
THICKNESS CHANGE WITH CURRENT DENSITY AND TEMPERATURE 295 10.3.4
COMPARISON AMONG ELECTRODES OF CU, NI, AND PD IN V-GROOVE SAMPLES 297
10.4 POLARITY EFFECT ON IMC GROWTH AT THE CATHODE 297 10.4.1 DYNAMIC
EQUILIBRIUM 299 10.5 EFFECT OF ELECTROMIGRATION ON THE COMPETING GROWTH
OF IMC 301 REFERENCES 302 11 DUCTILE-TO-BRITTLE TRANSITION OF SOLDER
JOINTS AFFECTED BY COPPER-TIN REACTION AND ELECTROMIGRATION . 305 11.1
INTRODUCTION : , 305' 11.2 TENSILE TEST AFFECTED BY ELECTROMIGRATION
.-.;: 306 11.3 SHEAR TEST AFFECTED BY ELECTROMIGRATION .' 309 11.4
IMPACT TEST .* '.?. 311 11.4.1 CHARPY TEST 311 11.4.2 MINI CHARPY
MACHINE TO TEST SOLDER JOINTS.: 314 11.5 DROP TEST 316 11.5.1
JEDEC-JESD22-B111 STANDARD OF DROP TEST 316 11.5.2 DROPPING OF A
PACKAGING BOARD VERTICALLY AND THE TORQUE ON SOLDER BALLS 320 11.6
CONVERTING A MINI CHARPY IMPACT MACHINE TO PERFORM DROP TEST 322 11.6.1
DROPPING OF A CHIP SIZE PACKAGE HORIZONTALLY IN MINI CHARPY MACHINE 323
CONTENTS XI 11.6.2 DROPPING OF A CHIP SIZE PACKAGE VERTICALLY IN MINI
CHARPY MACHINE 325 11.7 CREEP AND ELECTROMIGRATION 325 REFERENCES 326 12
THERMOMIGRATION 327 12.1 INTRODUCTION 327 12.2 THERMOMIGRATION IN FLIP
CHIP SOLDER JOINTS OF SNPB 329 12.2.1 THERMOMIGRATION IN UNPOWERED
COMPOSITE SOLDER JOINTS 329 12.2.2 IN SITU OBSERVATIO N OF
THERMOMIGRATION 332 12.2.3 RANDOM STATES OF PHASE SEPARATION IN EUTECTIC
TWO-PHASE STRUCTURES 333 12.2.4 THERMOMIGRATION IN UNPOWERED EUTECTIC
SNPB SOLDER JOINTS 335 12.3 FUNDAMENTALS OF THERMOMIGRATION 338 12.3.1
DRIVING FORCE OF THERMOMIGRATION 338 12.3.2 ENTROPY PRODUCTION 340
12.3.3 EFFECT OF CONCENTRATION GRADIENT ON THERMOMIGRATION 341 12.3.4
THE CRITICAL LENGTH BELOW WHICH NO THERMOMIGRATION OCCURS IN A PURE
METAL 342 12.3.5 THERMOMIGRATION IN A EUTECTIC TWO-PHASE ALLOY 343 12.4
THERMOMIGRATION AND DC ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS 344
12.5 THERMOMIGRATION AND AC ELECTROMIGRATION IN FLIP CHIP SOLDER JOINTS
344 12.6 THERMOMIGRATION AND CHEMICAL REACTION IN SOLDER JOINTS 345 12.7
THERMOMIGRATION AND CREEP IN SOLDER JOINTS. 345 REFERENCES :.,. ".'.
346 APPENDIX A: DIFFUSIVITY OF VACANCY MECHANISM OF DIFFUSION IN SOLIDS
* "".' 347 APPENDIX B: GROWTH AND RIPENING EQUATIONS^ OF PRECIPITATES "
* 351 APPENDIX C: DERIVATION OF HUNTINGTON'S ELECTRON WIND FORCE 359
SUBJECT INDEX 365 |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Tu, King-Ning |
| author_facet | Tu, King-Ning |
| author_role | aut |
| author_sort | Tu, King-Ning |
| author_variant | k n t knt |
| building | Verbundindex |
| bvnumber | BV022499065 |
| callnumber-first | T - Technology |
| callnumber-label | TA492 |
| callnumber-raw | TA492.W4 TK |
| callnumber-search | TA492.W4 TK |
| callnumber-sort | TA 3492 W4 |
| callnumber-subject | TA - General and Civil Engineering |
| classification_rvk | UQ 1100 ZM 8450 ZN 4125 |
| ctrlnum | (OCoLC)123113661 (DE-599)BVBBV022499065 |
| dewey-full | 671.56 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 671 - Metalworking & primary metal products |
| dewey-raw | 671.56 |
| dewey-search | 671.56 |
| dewey-sort | 3671.56 |
| dewey-tens | 670 - Manufacturing |
| discipline | Maschinenbau / Maschinenwesen Physik Werkstoffwissenschaften / Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Maschinenbau / Maschinenwesen Physik Werkstoffwissenschaften / Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV022499065 |
| illustrated | Illustrated |
| index_date | 2024-07-02T17:54:46Z |
| indexdate | 2024-07-20T09:19:18Z |
| institution | BVB |
| isbn | 9780387388908 0387388907 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015706154 |
| oclc_num | 123113661 |
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| physical | XVI, 368 S. Ill., graph. Darst. |
| publishDate | 2007 |
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| publisher | Springer |
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| series | Springer series in materials science |
| series2 | Springer series in materials science |
| spelling | Tu, King-Ning Verfasser aut Solder joint technology materials, properties, and reliability King-Ning Tu New York Springer 2007 XVI, 368 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Springer series in materials science 92 Metals Weldability Solder and soldering Welded joints Welded joints Reliability Lötverbindung (DE-588)4195776-3 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Löten (DE-588)4036162-7 s Lötverbindung (DE-588)4195776-3 s DE-604 Springer series in materials science 92 (DE-604)BV000683335 92 text/html http://deposit.dnb.de/cgi-bin/dokserv?id=2843028&prov=M&dok_var=1&dok_ext=htm Inhaltstext HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=015706154&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Tu, King-Ning Solder joint technology materials, properties, and reliability Springer series in materials science Metals Weldability Solder and soldering Welded joints Welded joints Reliability Lötverbindung (DE-588)4195776-3 gnd Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4195776-3 (DE-588)4036162-7 |
| title | Solder joint technology materials, properties, and reliability |
| title_auth | Solder joint technology materials, properties, and reliability |
| title_exact_search | Solder joint technology materials, properties, and reliability |
| title_exact_search_txtP | Solder joint technology materials, properties, and reliability |
| title_full | Solder joint technology materials, properties, and reliability King-Ning Tu |
| title_fullStr | Solder joint technology materials, properties, and reliability King-Ning Tu |
| title_full_unstemmed | Solder joint technology materials, properties, and reliability King-Ning Tu |
| title_short | Solder joint technology |
| title_sort | solder joint technology materials properties and reliability |
| title_sub | materials, properties, and reliability |
| topic | Metals Weldability Solder and soldering Welded joints Welded joints Reliability Lötverbindung (DE-588)4195776-3 gnd Löten (DE-588)4036162-7 gnd |
| topic_facet | Metals Weldability Solder and soldering Welded joints Welded joints Reliability Lötverbindung Löten |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=2843028&prov=M&dok_var=1&dok_ext=htm http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=015706154&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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