CMOS force sensors for wire bonding and flip chip process characterization:
Saved in:
| Main Author: | |
|---|---|
| Format: | Microfilm Book |
| Language: | English |
| Published: |
2003
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| Edition: | [Mikrofiche-Ausg.] |
| Series: | [ETH-Dissertation] ETH-Diss
15293 |
| Subjects: | |
| Item Description: | Zürich, ETH, Diss., 2003. -Zsfassung in dt. Sprache. -Mikrofiche-Ausg. : 3 Mikrofiches |
| Physical Description: | II, 149 S. Ill., graph. Darst. |
Staff View
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Record in the Search Index
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| id | DE-604.BV022068574 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:13:49Z |
| indexdate | 2024-07-09T20:50:08Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015283348 |
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| physical | II, 149 S. Ill., graph. Darst. |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| record_format | marc |
| series | [ETH-Dissertation] ETH-Diss |
| series2 | [ETH-Dissertation] ETH-Diss |
| spelling | Schwizer, Jürg Verfasser aut CMOS force sensors for wire bonding and flip chip process characterization Jürg Schwizer [Mikrofiche-Ausg.] 2003 II, 149 S. Ill., graph. Darst. h rdamedia he rdacarrier [ETH-Dissertation] ETH-Diss 15293 Zürich, ETH, Diss., 2003. -Zsfassung in dt. Sprache. -Mikrofiche-Ausg. : 3 Mikrofiches Kraftsensor (DE-588)4165452-3 gnd rswk-swf Piezoelektrische Messtechnik (DE-588)4174663-6 gnd rswk-swf Flip-Chip-Technologie (DE-588)4427284-4 gnd rswk-swf CMOS-Schaltung (DE-588)4148111-2 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf 1\p (DE-588)4113937-9 Hochschulschrift gnd-content Verbindungstechnik (DE-588)4129183-9 s DE-604 CMOS-Schaltung (DE-588)4148111-2 s Kraftsensor (DE-588)4165452-3 s Piezoelektrische Messtechnik (DE-588)4174663-6 s Flip-Chip-Technologie (DE-588)4427284-4 s [ETH-Dissertation] ETH-Diss 15293 (DE-604)BV021854884 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Schwizer, Jürg CMOS force sensors for wire bonding and flip chip process characterization [ETH-Dissertation] ETH-Diss Kraftsensor (DE-588)4165452-3 gnd Piezoelektrische Messtechnik (DE-588)4174663-6 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd CMOS-Schaltung (DE-588)4148111-2 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| subject_GND | (DE-588)4165452-3 (DE-588)4174663-6 (DE-588)4427284-4 (DE-588)4148111-2 (DE-588)4129183-9 (DE-588)4113937-9 |
| title | CMOS force sensors for wire bonding and flip chip process characterization |
| title_auth | CMOS force sensors for wire bonding and flip chip process characterization |
| title_exact_search | CMOS force sensors for wire bonding and flip chip process characterization |
| title_exact_search_txtP | CMOS force sensors for wire bonding and flip chip process characterization |
| title_full | CMOS force sensors for wire bonding and flip chip process characterization Jürg Schwizer |
| title_fullStr | CMOS force sensors for wire bonding and flip chip process characterization Jürg Schwizer |
| title_full_unstemmed | CMOS force sensors for wire bonding and flip chip process characterization Jürg Schwizer |
| title_short | CMOS force sensors for wire bonding and flip chip process characterization |
| title_sort | cmos force sensors for wire bonding and flip chip process characterization |
| topic | Kraftsensor (DE-588)4165452-3 gnd Piezoelektrische Messtechnik (DE-588)4174663-6 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd CMOS-Schaltung (DE-588)4148111-2 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| topic_facet | Kraftsensor Piezoelektrische Messtechnik Flip-Chip-Technologie CMOS-Schaltung Verbindungstechnik Hochschulschrift |
| volume_link | (DE-604)BV021854884 |
| work_keys_str_mv | AT schwizerjurg cmosforcesensorsforwirebondingandflipchipprocesscharacterization |