APA (7th ed.) Citation

Schwizer, J. (2003). CMOS force sensors for wire bonding and flip chip process characterization ([Mikrofiche-Ausg.].).

Chicago Style (17th ed.) Citation

Schwizer, Jürg. CMOS Force Sensors for Wire Bonding and Flip Chip Process Characterization. [Mikrofiche-Ausg.]. 2003.

MLA (9th ed.) Citation

Schwizer, Jürg. CMOS Force Sensors for Wire Bonding and Flip Chip Process Characterization. [Mikrofiche-Ausg.]. 2003.