Package and solder joint reliability analysed by FEM simulation and experiments:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Oxford
Elsevier
2004
|
| Subjects: | |
| Item Description: | Literaturangaben. - In: Microelectronics reliability ; 44 (2004),12 : Special section |
| Physical Description: | S. 1892 - 2054 Ill., graph. Darst. |
Staff View
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| indexdate | 2024-07-09T20:48:58Z |
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| spelling | Package and solder joint reliability analysed by FEM simulation and experiments guest eds. B. Vandevelde ... Oxford Elsevier 2004 S. 1892 - 2054 Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben. - In: Microelectronics reliability ; 44 (2004),12 : Special section Verdrahtung (DE-588)4187633-7 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Integrierte Schaltung (DE-588)4027242-4 s DE-604 Verdrahtung (DE-588)4187633-7 s Vandevelde, Bart Sonstige oth |
| spellingShingle | Package and solder joint reliability analysed by FEM simulation and experiments Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4187633-7 (DE-588)4027242-4 (DE-588)1071861417 |
| title | Package and solder joint reliability analysed by FEM simulation and experiments |
| title_auth | Package and solder joint reliability analysed by FEM simulation and experiments |
| title_exact_search | Package and solder joint reliability analysed by FEM simulation and experiments |
| title_exact_search_txtP | Package and solder joint reliability analysed by FEM simulation and experiments |
| title_full | Package and solder joint reliability analysed by FEM simulation and experiments guest eds. B. Vandevelde ... |
| title_fullStr | Package and solder joint reliability analysed by FEM simulation and experiments guest eds. B. Vandevelde ... |
| title_full_unstemmed | Package and solder joint reliability analysed by FEM simulation and experiments guest eds. B. Vandevelde ... |
| title_short | Package and solder joint reliability analysed by FEM simulation and experiments |
| title_sort | package and solder joint reliability analysed by fem simulation and experiments |
| topic | Verdrahtung (DE-588)4187633-7 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Verdrahtung Integrierte Schaltung Konferenzschrift |
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