Fracture processes in microelectronics:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Dordrecht [u.a.]
Kluwer
2001
|
| Schlagworte: | |
| Beschreibung: | Literaturangaben. - In: International journal of fracture ; 109 (2001),1 : Special issu |
| Beschreibung: | VI, 139 S. Ill., graph. Darst. |
Internformat
MARC
| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV021964193 | ||
| 003 | DE-604 | ||
| 005 | 20040302000000.0 | ||
| 007 | t | ||
| 008 | 020118s2001 ad|| |||| 00||| eng d | ||
| 035 | |a (OCoLC)47134658 | ||
| 035 | |a (DE-599)BVBBV021964193 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-706 | ||
| 082 | 0 | |a 621.381 5 |2 21 | |
| 245 | 1 | 0 | |a Fracture processes in microelectronics |c guest ed. Robert Goldstein |
| 264 | 1 | |a Dordrecht [u.a.] |b Kluwer |c 2001 | |
| 300 | |a VI, 139 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Literaturangaben. - In: International journal of fracture ; 109 (2001),1 : Special issu | ||
| 650 | 7 | |a Contraintes (mécanique) |2 ram | |
| 650 | 7 | |a Couches minces |2 ram | |
| 650 | 7 | |a Microélectronique |2 ram | |
| 650 | 7 | |a Rupture, Mécanique de la |2 ram | |
| 650 | 0 | 7 | |a Bruchmechanik |0 (DE-588)4112837-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Bruchmechanik |0 (DE-588)4112837-0 |D s |
| 689 | 1 | |5 DE-604 | |
| 700 | 1 | |a Goldstein, Robert |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-015179343 | ||
Datensatz im Suchindex
| _version_ | 1804135933050617856 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| building | Verbundindex |
| bvnumber | BV021964193 |
| ctrlnum | (OCoLC)47134658 (DE-599)BVBBV021964193 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 5 |
| dewey-search | 621.381 5 |
| dewey-sort | 3621.381 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01263nam a2200385zc 4500</leader><controlfield tag="001">BV021964193</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20040302000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">020118s2001 ad|| |||| 00||| eng d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)47134658</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV021964193</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-706</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381 5</subfield><subfield code="2">21</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Fracture processes in microelectronics</subfield><subfield code="c">guest ed. Robert Goldstein</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Dordrecht [u.a.]</subfield><subfield code="b">Kluwer</subfield><subfield code="c">2001</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">VI, 139 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Literaturangaben. - In: International journal of fracture ; 109 (2001),1 : Special issu</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Contraintes (mécanique)</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Couches minces</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microélectronique</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Rupture, Mécanique de la</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bruchmechanik</subfield><subfield code="0">(DE-588)4112837-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Bruchmechanik</subfield><subfield code="0">(DE-588)4112837-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Goldstein, Robert</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-015179343</subfield></datafield></record></collection> |
| id | DE-604.BV021964193 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:08:44Z |
| indexdate | 2024-07-09T20:48:22Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015179343 |
| oclc_num | 47134658 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | VI, 139 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | Kluwer |
| record_format | marc |
| spelling | Fracture processes in microelectronics guest ed. Robert Goldstein Dordrecht [u.a.] Kluwer 2001 VI, 139 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Literaturangaben. - In: International journal of fracture ; 109 (2001),1 : Special issu Contraintes (mécanique) ram Couches minces ram Microélectronique ram Rupture, Mécanique de la ram Bruchmechanik (DE-588)4112837-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s DE-604 Bruchmechanik (DE-588)4112837-0 s Goldstein, Robert Sonstige oth |
| spellingShingle | Fracture processes in microelectronics Contraintes (mécanique) ram Couches minces ram Microélectronique ram Rupture, Mécanique de la ram Bruchmechanik (DE-588)4112837-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4112837-0 (DE-588)4039207-7 |
| title | Fracture processes in microelectronics |
| title_auth | Fracture processes in microelectronics |
| title_exact_search | Fracture processes in microelectronics |
| title_exact_search_txtP | Fracture processes in microelectronics |
| title_full | Fracture processes in microelectronics guest ed. Robert Goldstein |
| title_fullStr | Fracture processes in microelectronics guest ed. Robert Goldstein |
| title_full_unstemmed | Fracture processes in microelectronics guest ed. Robert Goldstein |
| title_short | Fracture processes in microelectronics |
| title_sort | fracture processes in microelectronics |
| topic | Contraintes (mécanique) ram Couches minces ram Microélectronique ram Rupture, Mécanique de la ram Bruchmechanik (DE-588)4112837-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Contraintes (mécanique) Couches minces Microélectronique Rupture, Mécanique de la Bruchmechanik Mikroelektronik |
| work_keys_str_mv | AT goldsteinrobert fractureprocessesinmicroelectronics |