Copper-fundamental mechanisms for microelectronic applications:
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York [u.a.]
Wiley
2000
|
| Series: | A Wiley-Interscience publication
|
| Subjects: | |
| Item Description: | Literaturangaben |
| Physical Description: | XXVIII, 337 S. Ill., graph. Darst. |
| ISBN: | 0471252565 |
Staff View
MARC
| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV021956713 | ||
| 003 | DE-604 | ||
| 005 | 20040302000000.0 | ||
| 007 | t | ||
| 008 | 001023s2000 ad|| |||| 00||| eng d | ||
| 020 | |a 0471252565 |9 0-471-25256-5 | ||
| 035 | |a (OCoLC)42296592 | ||
| 035 | |a (DE-599)BVBBV021956713 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-706 | ||
| 050 | 0 | |a TK7871.85 | |
| 082 | 0 | |a 621.3815/2 |2 21 | |
| 100 | 1 | |a Murarka, Shyam P. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Copper-fundamental mechanisms for microelectronic applications |c Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| 264 | 1 | |a New York [u.a.] |b Wiley |c 2000 | |
| 300 | |a XXVIII, 337 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a A Wiley-Interscience publication | |
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Copper | |
| 650 | 4 | |a Metallizing | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Semiconductors |x Junctions | |
| 650 | 4 | |a Semiconductors |x Materials | |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Physikalische Eigenschaft |0 (DE-588)4134738-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kupfer |0 (DE-588)4033734-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chemische Eigenschaft |0 (DE-588)4371174-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Metallisieren |0 (DE-588)4169599-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Halbleiter |0 (DE-588)4022993-2 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Physikalische Eigenschaft |0 (DE-588)4134738-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Chemische Eigenschaft |0 (DE-588)4371174-1 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Kupfer |0 (DE-588)4033734-0 |D s |
| 689 | 2 | 1 | |a Metallisieren |0 (DE-588)4169599-9 |D s |
| 689 | 2 | 2 | |a Halbleiter |0 (DE-588)4022993-2 |D s |
| 689 | 2 | 3 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 2 | |8 1\p |5 DE-604 | |
| 689 | 3 | 0 | |a Chemische Eigenschaft |0 (DE-588)4371174-1 |D s |
| 689 | 3 | |5 DE-604 | |
| 700 | 1 | |a Verner, Igor V. |e Verfasser |4 aut | |
| 700 | 1 | |a Gutmann, Ronald J. |e Verfasser |4 aut | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-015171863 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Record in the Search Index
| _version_ | 1804135923359678464 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. |
| author_facet | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. |
| author_role | aut aut aut |
| author_sort | Murarka, Shyam P. |
| author_variant | s p m sp spm i v v iv ivv r j g rj rjg |
| building | Verbundindex |
| bvnumber | BV021956713 |
| callnumber-first | T - Technology |
| callnumber-label | TK7871 |
| callnumber-raw | TK7871.85 |
| callnumber-search | TK7871.85 |
| callnumber-sort | TK 47871.85 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)42296592 (DE-599)BVBBV021956713 |
| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/2 |
| dewey-search | 621.3815/2 |
| dewey-sort | 3621.3815 12 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02147nam a2200601zc 4500</leader><controlfield tag="001">BV021956713</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20040302000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">001023s2000 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0471252565</subfield><subfield code="9">0-471-25256-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)42296592</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV021956713</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-706</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7871.85</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815/2</subfield><subfield code="2">21</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Murarka, Shyam P.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Copper-fundamental mechanisms for microelectronic applications</subfield><subfield code="c">Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York [u.a.]</subfield><subfield code="b">Wiley</subfield><subfield code="c">2000</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XXVIII, 337 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">A Wiley-Interscience publication</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Literaturangaben</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Copper</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallizing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Junctions</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Physikalische Eigenschaft</subfield><subfield code="0">(DE-588)4134738-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kupfer</subfield><subfield code="0">(DE-588)4033734-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chemische Eigenschaft</subfield><subfield code="0">(DE-588)4371174-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Metallisieren</subfield><subfield code="0">(DE-588)4169599-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleiter</subfield><subfield code="0">(DE-588)4022993-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Physikalische Eigenschaft</subfield><subfield code="0">(DE-588)4134738-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Chemische Eigenschaft</subfield><subfield code="0">(DE-588)4371174-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Kupfer</subfield><subfield code="0">(DE-588)4033734-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2="1"><subfield code="a">Metallisieren</subfield><subfield code="0">(DE-588)4169599-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2="2"><subfield code="a">Halbleiter</subfield><subfield code="0">(DE-588)4022993-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2="3"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="3" ind2="0"><subfield code="a">Chemische Eigenschaft</subfield><subfield code="0">(DE-588)4371174-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="3" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Verner, Igor V.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gutmann, Ronald J.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-015171863</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
| id | DE-604.BV021956713 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:08:10Z |
| indexdate | 2024-07-09T20:48:13Z |
| institution | BVB |
| isbn | 0471252565 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015171863 |
| oclc_num | 42296592 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | XXVIII, 337 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | Wiley |
| record_format | marc |
| series2 | A Wiley-Interscience publication |
| spelling | Murarka, Shyam P. Verfasser aut Copper-fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann New York [u.a.] Wiley 2000 XXVIII, 337 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier A Wiley-Interscience publication Literaturangaben Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Physikalische Eigenschaft (DE-588)4134738-9 gnd rswk-swf Kupfer (DE-588)4033734-0 gnd rswk-swf Chemische Eigenschaft (DE-588)4371174-1 gnd rswk-swf Metallisieren (DE-588)4169599-9 gnd rswk-swf Halbleiter (DE-588)4022993-2 gnd rswk-swf Physikalische Eigenschaft (DE-588)4134738-9 s DE-604 Chemische Eigenschaft (DE-588)4371174-1 s Kupfer (DE-588)4033734-0 s Metallisieren (DE-588)4169599-9 s Halbleiter (DE-588)4022993-2 s Mikroelektronik (DE-588)4039207-7 s 1\p DE-604 Verner, Igor V. Verfasser aut Gutmann, Ronald J. Verfasser aut 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Murarka, Shyam P. Verner, Igor V. Gutmann, Ronald J. Copper-fundamental mechanisms for microelectronic applications Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Mikroelektronik (DE-588)4039207-7 gnd Physikalische Eigenschaft (DE-588)4134738-9 gnd Kupfer (DE-588)4033734-0 gnd Chemische Eigenschaft (DE-588)4371174-1 gnd Metallisieren (DE-588)4169599-9 gnd Halbleiter (DE-588)4022993-2 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4134738-9 (DE-588)4033734-0 (DE-588)4371174-1 (DE-588)4169599-9 (DE-588)4022993-2 |
| title | Copper-fundamental mechanisms for microelectronic applications |
| title_auth | Copper-fundamental mechanisms for microelectronic applications |
| title_exact_search | Copper-fundamental mechanisms for microelectronic applications |
| title_exact_search_txtP | Copper-fundamental mechanisms for microelectronic applications |
| title_full | Copper-fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_fullStr | Copper-fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_full_unstemmed | Copper-fundamental mechanisms for microelectronic applications Shyam P. Murarka ; Igor V. Verner ; Ronald J. Gutmann |
| title_short | Copper-fundamental mechanisms for microelectronic applications |
| title_sort | copper fundamental mechanisms for microelectronic applications |
| topic | Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Mikroelektronik (DE-588)4039207-7 gnd Physikalische Eigenschaft (DE-588)4134738-9 gnd Kupfer (DE-588)4033734-0 gnd Chemische Eigenschaft (DE-588)4371174-1 gnd Metallisieren (DE-588)4169599-9 gnd Halbleiter (DE-588)4022993-2 gnd |
| topic_facet | Copper Metallizing Microelectronics Semiconductors Junctions Semiconductors Materials Mikroelektronik Physikalische Eigenschaft Kupfer Chemische Eigenschaft Metallisieren Halbleiter |
| work_keys_str_mv | AT murarkashyamp copperfundamentalmechanismsformicroelectronicapplications AT vernerigorv copperfundamentalmechanismsformicroelectronicapplications AT gutmannronaldj copperfundamentalmechanismsformicroelectronicapplications |