Dry etching for VLSI:
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York [u.a.]
Plenum Pr.
1991
|
| Series: | Updates in applied physics and electrical technology
|
| Subjects: | |
| Physical Description: | XVII, 237 S. |
| ISBN: | 0306438356 |
Staff View
MARC
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| 100 | 1 | |a Roosmalen, A. J. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Dry etching for VLSI |c A. J. Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
| 264 | 1 | |a New York [u.a.] |b Plenum Pr. |c 1991 | |
| 300 | |a XVII, 237 S. | ||
| 336 | |b txt |2 rdacontent | ||
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| 490 | 0 | |a Updates in applied physics and electrical technology | |
| 650 | 4 | |a Integrated circuits |x Very large scale integration |x Design and construction | |
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| 650 | 4 | |a Semiconductors |x Etching | |
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| 700 | 1 | |a Baggerman, J. A. |e Verfasser |4 aut | |
| 700 | 1 | |a Brader, S. J. |e Verfasser |4 aut | |
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Record in the Search Index
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| author | Roosmalen, A. J. Baggerman, J. A. Brader, S. J. |
| author_facet | Roosmalen, A. J. Baggerman, J. A. Brader, S. J. |
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| bvnumber | BV021903746 |
| callnumber-first | T - Technology |
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| callnumber-search | TK7871.85 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZM 7660 ZN 4950 |
| ctrlnum | (OCoLC)23142645 (DE-599)BVBBV021903746 |
| dewey-full | 621.381/52 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/52 |
| dewey-search | 621.381/52 |
| dewey-sort | 3621.381 252 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| format | Book |
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| id | DE-604.BV021903746 |
| illustrated | Not Illustrated |
| index_date | 2024-07-02T16:04:49Z |
| indexdate | 2024-07-09T20:47:04Z |
| institution | BVB |
| isbn | 0306438356 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015118925 |
| oclc_num | 23142645 |
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| owner | DE-706 |
| owner_facet | DE-706 |
| physical | XVII, 237 S. |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | Plenum Pr. |
| record_format | marc |
| series2 | Updates in applied physics and electrical technology |
| spelling | Roosmalen, A. J. Verfasser aut Dry etching for VLSI A. J. Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader New York [u.a.] Plenum Pr. 1991 XVII, 237 S. txt rdacontent n rdamedia nc rdacarrier Updates in applied physics and electrical technology Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd rswk-swf Trockenätzen (DE-588)4222074-9 gnd rswk-swf Ätzen (DE-588)4000648-7 gnd rswk-swf Ätzen (DE-588)4000648-7 s DE-604 VLSI (DE-588)4117388-0 s Trockenätzen (DE-588)4222074-9 s 1\p DE-604 Baggerman, J. A. Verfasser aut Brader, S. J. Verfasser aut 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Roosmalen, A. J. Baggerman, J. A. Brader, S. J. Dry etching for VLSI Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd Trockenätzen (DE-588)4222074-9 gnd Ätzen (DE-588)4000648-7 gnd |
| subject_GND | (DE-588)4117388-0 (DE-588)4222074-9 (DE-588)4000648-7 |
| title | Dry etching for VLSI |
| title_auth | Dry etching for VLSI |
| title_exact_search | Dry etching for VLSI |
| title_exact_search_txtP | Dry etching for VLSI |
| title_full | Dry etching for VLSI A. J. Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
| title_fullStr | Dry etching for VLSI A. J. Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
| title_full_unstemmed | Dry etching for VLSI A. J. Roosmalen ; J. A. G. Baggerman ; S. J. H. Brader |
| title_short | Dry etching for VLSI |
| title_sort | dry etching for vlsi |
| topic | Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI (DE-588)4117388-0 gnd Trockenätzen (DE-588)4222074-9 gnd Ätzen (DE-588)4000648-7 gnd |
| topic_facet | Integrated circuits Very large scale integration Design and construction Plasma etching Semiconductors Etching VLSI Trockenätzen Ätzen |
| work_keys_str_mv | AT roosmalenaj dryetchingforvlsi AT baggermanja dryetchingforvlsi AT bradersj dryetchingforvlsi |