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Foundations of interconnect and microstrip design:

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New Title:	Edwards, Terence C. Foundations for microstrip circuit design
Previous Title:	Edwards, Terence C. Foundations for microstrip circuit design
Main Author:	Edwards, Terence Charles (Author)
Format:	Book
Language:	English
Published:	Chichester [u.a.] Wiley 2000
Edition:	3. ed.
Subjects:	Micro-elektronica Transmissielijnen Microwave integrated circuits Strip transmission lines Mikrowellenschaltung Mikrowellenstreifenleitung Integrierte Mikrowellenschaltung
Online Access:	Publisher description Table of Contents Inhaltsverzeichnis
Item Description:	früher u.d.T.: Foundations for microstrip circuit design
Physical Description:	XX, 512 S. Ill., graph. Darst.
ISBN:	0471607010

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adam_text	FOUNDATIONS OF INTERCONNECT AND MICROSTRIP DESIGN THIRD EDITION T. C. EDWARDS ENGALCO, UK M. B. STEER NORTH CAROLINA STATE UNIVERSITY, USA UNIVERSITY OFLEEDS, UK JOHN WILEY & SONS, LTD CHICHESTER * NEW YORK * WEINHEIM * BRISBANE * SINGAPORE * TORONTO CONTENTS PREFACE XVII ACKNOWLEDGEMENTS XIX 1 FUNDAMENTALS OF SIGNAL TRANSMISSION ON INTERCONNECTS 1 1.1 INTERCONNECT AS PART OF A PACKAGING HIERARCHY 1 1.2 THE PHYSICAL BASIS OF INTERCONNECTS 2 1.2.1 WHAT AN INTERCONNECT IS AND HOW INFORMATION IS TRANSMITTED . 3 1.3 THE PHYSICS, A GUIDED WAVE 4 1.3.1 TRANSMISSION OF A PULSE 4 1.3.2 TRANSVERSE ELECTROMAGNETIC LINES (TEM-LINES) 6 1.3.3 MULTIMODING 8 1.3.4 THE EFFECT OF DIELECTRIC 8 1.3.5 FREQUENCY-DEPENDENT CHARGE DISTRIBUTION 9 1.3.6 DISPERSION 11 1.4 WHEN AN INTERCONNECT SHOULD BE TREATED AS A TRANSMISSION LINE . . . . 12 1.5 THE CONCEPT OF RADIO FREQUENCY TRANSMISSION LINES 14 1.6 PRIMARY TRANSMISSION LINE CONSTANTS 14 1.7 SECONDARY CONSTANTS FOR TRANSMISSION LINES 15 1.8 TRANSMISSION LINE IMPEDANCES 17 1.9 REFLECTION 18 1.9.1 REFLECTION AND VOLTAGE STANDING-WAVE RATIO (VSWR) 18 1.9.2 FORWARD AND BACKWARD TRAVELLING PULSES 19 1.9.3 EFFECT ON SIGNAL INTEGRITY 19 1.10 MULTIPLE CONDUCTORS 23 1.11 RETURN CURRENTS 25 1.11.1 COMMON IMPEDANCE COUPLING 27 1.12 MODELLING OF INTERCONNECTS 28 1.13 SUMMARY 29 2 ON-CHIP INTERCONNECTS FOR DIGITAL SYSTEMS 31 2.1 OVERVIEW OF ON-CHIP INTERCONNECTS 31 2.1.1 TYPES OF ON-CHIP INTERCONNECTS 32 2.2 EXPERIMENTAL CHARACTERIZATION OF AN ON-CHIP INTERCONNECT 34 2.3 RC MODELLING ON-CHIP INTERCONNECTS 36 VIII CONTENTS 2.3.1 DELAY MODELLING 37 2.3.2 RC MODELLING 40 2.4 MODELLING INDUCTANCE 42 2.4.1 WHEN ARE INDUCTANCE EFFECTS IMPORTANT? 43 2.4.2 INDUCTANCE EXTRACTION 45 2.5 DESIGN APPROACHES TO HANDLING INTERCONNECT EFFECTS 46 2.5.1 PERFORMANCE-DRIVEN ROUTING 46 2.5.2 TRANSMISSION LINE RETURN PATHS 46 3 INTERCONNECT TECHNOLOGIES 49 3.1 INTRODUCTORY REMARKS 49 3.2 MICROWAVE FREQUENCIES AND APPLICATIONS 49 3.3 TRANSMISSION LINE STRUCTURES 52 3.3.1 IMAGELINE 52 3.3.2 MICROSTRIP 54 3.3.3 FINLINE 54 3.3.4 INVERTED MICROSTRIP 55 3.3.5 SLOTLINE 55 3.3.6 TRAPPED INVERTED MICROSTRIP 56 3.3.7 COPLANAR WAVEGUIDE (CPW) 56 3.3.8 COPLANAR STRIP (CPS) AND DIFFERENTIAL LINE 57 3.3.9 STRIPLINE 57 3.3.10 SUMMARY OF INTERCONNECT PROPERTIES 58 3.4 SUBSTRATES FOR HYBRID MICROCIRCUITS 59 3.4.1 FR4 ( PRINTED CIRCUIT BOARD ) 60 3.4.2 CERAMIC SUBSTRATES 60 3.4.3 SOFTBOARD 63 3.4.4 OVERALL APPRAISAL * ALTERNATIVE SUBSTRATES AND STRUCTURES ... 63 3.4.5 SAPPHIRE * THE BENCHMARK SUBSTRATE MATERIAL 63 3.5 THIN-FILM MODULES 64 3.5.1 PLATE-THROUGH TECHNIQUE 64 3.5.2 ETCH-BACK TECHNIQUE 65 3.5.3 EQUIPMENT REQUIRED 65 3.5.4 THIN RESISTIVE FILMS 65 3.6 THICK-FILM MODULES 66 3.6.1 PASTES, PRINTING AND PROCESSING FOR THICK-FILM MODULES 66 3.7 MONOLITHIC TECHNOLOGY 67 3.7.1 INTRODUCTION 67 3.7.2 MULTILAYER INTERCONNECT 69 3.7.3 METALLIZATION 69 3.7.4 LOW-K DIELECTRICS 70 3.7.5 MIC AND MMIC APPROACHES COMPARED 71 3.8 PRINTED CIRCUIT BOARDS 71 3.8.1 ORGANIC PCBS 73 3.8.2 CERAMIC PCBS 74 3.9 MULTICHIP MODULES 74 3.9.1 MCM-L SUBSTRATES 75 * CONTENTS IX 3.9.2 MCM-C SUBSTRATES 75 3.9.3 MCM-D SUBSTRATES 76 3.9.4 CHARACTERIZATION OF INTERCONNECTS ON AN MCM: A CASE STUDY . . 77 3.9.5 MCM SUMMARY 79 4 MICROSTRIP DESIGN AT LOW FREQUENCIES 83 4.1 THE MICROSTRIP DESIGN PROBLEM 83 4.1.1 DIGITAL INTERCONNECT 83 4.1.2 A TRANSISTOR AMPLIFIER INPUT NETWORK 84 4.1.3 THE GEOMETRY OF MICROSTRIP 85 4.2 THE QUASI-TEM MODE OF PROPAGATION 86 4.3 STATIC-TEM PARAMETERS 86 4.3.1 THE CHARACTERISTIC IMPEDANCE ZQ 87 4.3.2 THE EFFECTIVE MICROSTRIP PERMITTIVITY E E FF 88 4.3.3 SYNTHESIS: THE WIDTH-TO-HEIGHT RATIO W/H 89 4.3.4 WAVELENGTH A, AND PHYSICAL LENGTH L 90 4.4 APPROXIMATE GRAPHICALLY-BASED SYNTHESIS 90 4.5 FORMULAS FOR ACCURATE STATIC-TEM DESIGN CALCULATIONS 92 4.5.1 SYNTHESIS FORMULAS (ZQ AND / GIVEN) 93 4.5.2 ANALYSIS FORMULAS (W/H AND S R GIVEN) 94 4.5.3 OVERALL ACCURACIES TO BE EXPECTED FROM THE PREVIOUS EXPRESSIONS 94 4.6 ANALYSIS TECHNIQUES REQUIRING SUBSTANTIAL COMPUTER POWER 94 4.7 A WORKED EXAMPLE OF STATIC-TEM SYNTHESIS 95 4.7.1 GRAPHICAL DETERMINATION 96 4.7.2 ACCURATELY CALCULATED RESULTS 96 4.7.3 FINAL DIMENSIONS OF THE MICROSTRIP ELEMENT 97 4.8 MICROSTRIP ON A DIELECTRICALLY ANISOTROPIC SUBSTRATE 97 4.9 MICROSTRIP ON A FERRITE SUBSTRATE 103 4.10 EFFECTS OF STRIP THICKNESS, ENCLOSURE AND MANUFACTURING TOLERANCES . . . 105 4.10.1 EFFECTS OF FINITE STRIP THICKNESS 105 4.10.2 EFFECTS OF A METALLIC ENCLOSURE 107 4.10.3 EFFECTS DUE TO MANUFACTURING TOLERANCES 108 4.11 PULSE PROPAGATION ALONG MICROSTRIP LINES 109 4.12 RECOMMENDATIONS RELATING TO THE STATIC-TEM APPROACHES 110 4.12.1 THE PRINCIPAL STATIC-TEM SYNTHESIS FORMULAS 111 4.12.2 MICROSTRIP ON A SAPPHIRE (ANISOTROPIC) SUBSTRATE 111 4.12.3 DESIGN CORRECTIONS FOR NON-SEMICONDUCTOR SUBSTRATES 112 5 MICROSTRIP AND STRIPLINE AT HIGH FREQUENCIES 113 5.1 THE SCOPE OF THIS CHAPTER 113 5.2 DISPERSION IN MICROSTRIP 113 5.3 APPROXIMATE CALCULATIONS ACCOUNTING FOR DISPERSION 118 5.4 ACCURATE DESIGN FORMULAS 122 5.4.1 EDWARDS AND OWENS EXPRESSIONS 122 5.4.2 EXPRESSIONS SUITABLE FOR MILLIMETRE-WAVE DESIGN 124 5.4.3 DISPERSION CURVES DERIVED FROM SIMULATIONS 128 5.5 EFFECTS DUE TO FERRITE AND TO DIELECTRICALLY ANISOTROPIC SUBSTRATES . . . 130 X CONTENTS 5.5.1 EFFECTS OF FERRITE SUBSTRATES 130 5.5.2 EFFECTS OF A DIELECTRICALLY ANISOTROPIC SUBSTRATE 130 5.6 DESIGNS REQUIRING DISPERSION CALCULATIONS * WORKED EXAMPLES 131 5.7 FIELD SOLUTIONS 133 5.7.1 ONE EXAMPLE OF A CLASSIC FREQUENCY-DEPENDENT COMPUTER-BASED FIELD SOLUTION 133 5.7.2 ANALYSIS OF ARBITRARY PLANAR CONFLGURATIONS 134 5.7.3 ASYMMETRY EFFECTS 135 5.7.4 TIME-DOMAIN APPROACHES 136 5.8 PREQUENCY-DEPENDENCE OF THE MICROSTRIP CHARACTERISTIC IMPEDANCE . . . 137 5.8.1 DIFFERENT DEFINITIONS AND TRENDS WITH INCREASING FREQUENCY . . . 137 5.8.2 USE OF THE PLANAR WAVEGUIDE MODEL 139 5.8.3 A FURTHER ALTERNATIVE EXPRESSION 140 5.8.4 A DESIGN ALGORITHM FOR MICROSTRIP WIDTH 141 5.8.5 AN EXAMPLE DERIVED FROM A SIMULATION 142 5.9 OPERATING FREQUENCY LIMITATIONS 142 5.9.1 THE TM MODE LIMITATION 142 5.9.2 THE LOWEST-ORDER TRANSVERSE MICROSTRIP RESONANCE 145 5.10 POWER LOSSES AND PARASITIC COUPLING 147 5.10.1 Q-FACTOR AND ATTENUATION COEMCIENT 147 5.10.2 CONDUCTOR LOSSES 149 5.10.3 DIELECTRIC LOSS 149 5.10.4 RADIATION 150 5.10.5 SURFACE-WAVE PROPAGATION 151 5.10.6 PARASITIC COUPLING 151 5.10.7 RADIATION AND SURFACE-WAVE LOSSES FROM DISCONTINUITIES 152 5.10.8 LOSSES IN MICROSTRIP ON SEMI-INSULATING GAAS 152 5.11 SUPERCONDUCTING MICROSTRIPS 153 5.12 STRIPLINE DESIGN 156 5.12.1 SYMMETRICAL STRIPLINE FORMULAS 156 5.13 DESIGN RECOMMENDATIONS 157 5.13.1 RECOMMENDATION 1 158 5.13.2 RECOMMENDATION 2 158 5.13.3 RECOMMENDATION 3 158 5.13.4 RECOMMENDATION 4 158 5.13.5 RECOMMENDATION 5 158 5.13.6 CHARACTERISTIC IMPEDANCE AS A FUNCTION OF FREQUENCY 159 5.13.7 COMPUTER-AIDED DESIGN 159 6 CPW DESIGN FUNDAMENTALS 161 6.1 INTRODUCTION * PROPERTIES OF COPLANAR WAVEGUIDE 161 6.2 MODELLING CPWS 166 6.2.1 EFFECTIVE PERMITTIVITY 167 6.2.2 CHARACTERISTIC IMPEDANCE 168 6.3 FORMULAS FOR ACCURATE CALCULATIONS 169 6.3.1 ANALYSIS AND SYNTHESIS APPROACHES 169 6.4 LOSS MECHANISMS 170 CONTENTS XI 6.4.1 DIELECTRIC LOSS 171 6.4.2 CONDUCTOR LOSS 171 6.4.3 RADIATION LOSS 174 6.4.4 CPW WITH INTERVENING SIC-2 LAYER 174 6.5 DISPERSION 174 6.5.1 FUNDAMENTAL AND THEORETICAL CONSIDERATIONS 174 6.5.2 RESULTS FROM TEST RUNS USING ELECTROMAGNETIC SIMULATION . . . . 178 6.5.3 EXPERIMENTAL RESULTS 183 6.6 DISCONTINUITIES 185 6.6.1 STEP CHANGES IN WIDTH AND SEPARATION 186 6.6.2 OPEN-CIRCUIT 189 6.6.3 SYMMETRIE SERIES GAP 190 6.6.4 COPLANAR SHORT-CIREUIT 192 6.6.5 RIGHT-ANGLE BENDS 194 6.6.6 T-JUNCTIONS 195 6.6.7 AIR BRIDGES 196 6.6.8 CROSS-OVER JUNETIONS 198 6.7 CIRCUIT ELEMENTS 198 6.7.1 INTERDIGITAL CAPACITORS AND STUBS 198 6.7.2 FILTERS 201 6.7.3 COUPLERS AND BALUNS 203 6.7.4 POWER DIVIDERS 205 6.8 VARIANTS UPON THE BASIC CPW STRUETURE 206 6.8.1 CPW WITH TOP AND BOTTOM METAL SHIELDS 206 6.8.2 MULTILAYER CPW 206 6.8.3 TRENCHED CPW ON A SILICON MMIC 208 6.8.4 TRANSITIONS BETWEEN CPW AND OTHER MEDIA 209 6.9 FLIP-CHIP REALIZATIONS 211 6.10 MIXERS, MICROMACHINED STRUCTURES AND OTHER CPW ISSUES 214 6.10.1 MIXERS AND FREQUENCY DOUBLER 214 6.10.2 GAAS FET CHARACTERIZATION AND SPECIALIZED RESONATORS 215 6.10.3 MICROMACHINED STRUCTURES 216 6.10.4 LEAKAGE SUPPRESSION AND 50 GHZ INTERCONNECT 216 6.10.5 LIGHT DEPENDENCE OF SILICON FGCPW 217 6.11 DIFFERENTIAL LINE AND COPLANAR STRIP (CPS) 218 6.12 SUMMARY 223 7 DISCONTINUITIES IN MICROSTRIP AND STRIPLINE 225 7.1 THE MAIN DISCONTINUITIES 225 7.2 THE FORESHORTENED OPEN-CIRCUIT 227 7.2.1 EQUIVALENT END-EFFECT LENGTH 228 7.2.2 UPPER LIMIT TO END-EFFECT LENGTH (QUASI-STATIC BASIS) 230 7.3 THE SERIES GAP 231 7.3.1 ACCURACY OF GAP CAPACITANCE CALCULATIONS 233 7.4 MICROSTRIP SHORT-CIREUITS 233 7.5 FURTHER DISCONTINUITIES 235 7.6 THE RIGHT-ANGLED BEND OR CORNER 235 XLL CONTENTS 7.7 MITRED OR MATCHED MICROSTRIP BENDS * COMPENSATION TECHNIQUES . . 237 7.8 STEP CHANGES IN WIDTH (IMPEDANCE STEPS) 240 7.8.1 THE SYMMETRICAL MICROSTRIP STEP 240 7.8.2 THE ASYMMETRICAL STEP IN MICROSTRIP 242 7.9 THE NARROW TRANSVERSE SLIT 242 7.10 THE MICROSTRIP T-JUNCTION 244 7.11 COMPENSATED T-JUNCTIONS 247 7.12 CROSS-JUNCTIONS 247 7.13 FREQUENCY DEPENDENCE OF DISCONTINUITY EFFECTS 250 7.13.1 OPEN-CIRCUITS AND SERIES GAPS 250 7.13.2 OTHER DISCONTINUITIES 256 7.13.3 CROSS- AND T-JUNCTIONS 257 7.13.4 RADIAL BENDS 260 7.13.5 FREQUENCY DEPENDENCE OF SHUNT POST PARAMETERS 261 7.14 RECOMMENDATIONS FOR THE CALCULATION OF DISCONTINUITIES 263 7.14.1 FORESHORTENED OPEN-CIRCUITS 263 7.14.2 SERIES GAPS 264 7.14.3 SHORT-CIRCUITS 264 7.14.4 RIGHT-ANGLED BENDS: MITRING 264 7.14.5 STEPS IN WIDTH 265 7.14.6 TRANSVERSE SLIT 265 7.14.7 THE T-JUNCTION 266 7.14.8 THE ASYMMETRIC CROSS-JUNCTION 267 7.15 STRIPLINE DISCONTINUITIES 267 7.15.1 BENDS 267 7.15.2 VIAS 267 7.15.3 JUNCTIONS 268 8 PARALLEL-COUPLED LINES AND DIRECTIONAL COUPLERS 269 8.1 STRUCTURE AND APPLICATIONS 269 8.2 PARAMETERS AND INITIAL SPECIFICATION 270 8.3 COUPLED MICROSTRIP LINES 271 8.4 CHARACTERISTIC IMPEDANCES IN TERMS OF THE COUPLING FACTOR (C) 273 8.5 SEMI-EMPIRICAL ANALYSIS FORMULAS AS A DESIGN AID 274 8.6 AN APPROXIMATE SYNTHESIS TECHNIQUE 276 8.7 A SPECIFIC EXAMPLE: DESIGN OF A 10 DB MICROSTRIP COUPLER 279 8.7.1 USE OF BRYANT AND WEISS CURVES 279 8.7.2 SYNTHESIS USING AKHTARZAD S TECHNIQUE 280 8.7.3 COMPARISON OF METHODS 280 8.8 COUPLED-REGION LENGTH 281 8.9 FREQUENCY RESPONSE 283 8.9.1 OVERALL EFFECTS AND GETSINGER S MODEL 283 8.9.2 MORE ACCURATE DESIGN EXPRESSIONS, INCLUDING DISPERSION 285 8.9.3 COMPLETE COUPLING SECTION RESPONSE 289 8.10 COUPLER DIRECTIVITY 290 8.11 SPECIAL COUPLER DESIGNS WITH IMPROVED PERFORMANCE 291 8.11.1 THE LANGE COUPLER 291 CONTENTS XM 8.11.2 THE UNFOLDED LANGE COUPLER 295 8.11.3 SHIELDED PARALLEL-COUPLED MICROSTRIPS 295 8.11.4 THE USE OF A DIELECTRIC OVERLAY 296 8.11.5 THE INCORPORATION OF LUMPED CAPACITORS 297 8.11.6 THE EFFECT OF A DIELECTRICALLY ANISOTROPIC SUBSTRATE 299 8.11.7 MICROSTRIP MULTIPLEXERS 300 8.11.8 MULTISECTION COUPLERS 301 8.11.9 RE-ENTRANT MODE SSOUPLERS 302 8.11.10 PATCH COUPLERS 302 8.12 THICKNESS EFFECTS, POWER LOSSES AND FABRICATION TOLERANCES 304 8.12.1 THICKNESS EFFECTS 304 8.12.2 POWER LOSSES 304 8.12.3 EFFECTS OF FABRICATION TOLERANCES 305 8.13 PLANAR COMBLINE DIRECTIONAL COUPLERS 306 8.14 CROSSTALK AND SIGNAL DISTORTION BETWEEN MICROSTRIP LINES USED IN DIGITAL SYSTEMS 307 8.15 CHOICE OF STRUCTURE AND DESIGN RECOMMENDATIONS 310 8.15.1 DESIGN PROCEDURE FOR COUPLED MICROSTRIPS, C * 3 DB 310 8.15.2 RELATIVELY LARGE COUPLING FACTORS (TYPICALLY C 3DB) . . . . 311 8.15.3 LENGTH OF THE COUPLED REGION 312 8.15.4 FREQUENCY RESPONSE 313 8.15.5 COUPLED STRUCTURES WITH IMPROVED PERFORMANCE 313 8.15.6 EFFECTS OF CONDUCTOR THICKNESS, POWER LOSSES AND PRODUCTION TOLERANCES 314 8.15.7 CROSSTALK BETWEEN MICROSTRIP LINES USED IN DIGITAL SYSTEMS . . . 314 8.15.8 POST-MANUFACTURE CIRCUIT ADJUSTMENT 314 9 POWER CAPABILITIES, TRANSITIONS AND MEASUREMENT TECHNIQUES . . 315 9.1 POWER-HANDLING CAPABILITIES 315 9.1.1 MAXIMUM AVERAGE POWER P MA UNDER CW CONDITIONS 315 9.1.2 PEAK (PULSE) POWER-HANDLING CAPABILITY 316 9.2 COAXIAL-TO-MICROSTRIP TRANSITIONS 317 9.3 WAVEGUIDE-TO-MICROSTRIP TRANSITIONS 319 9.3.1 RIDGELINE TRANSFORMER INSERT 319 9.3.2 MODE CHANGER AND BALUN 320 9.3.3 A WAVEGUIDE-TO-MICROSTRIP POWER SPLITTER 323 9.3.4 SLOT-COUPLED ANTENNA WAVEGUIDE-TO-MICROSTRIP TRANSITION . . . . 324 9.4 TRANSITIONS BETWEEN OTHER MEDIA AND MICROSTRIP 324 9.5 INSTRUMENTATION SYSTEMS FOR MICROSTRIP MEASUREMENTS 325 9.6 MEASUREMENT OF SUBSTRATE PROPERTIES 328 9.7 MICROSTRIP RESONATOR METHODS 328 9.7.1 THE RING RESONATOR 330 9.7.2 THE SIDE-COUPLED, OPEN-CIRCUIT-TERMINATED, STRAIGHT RESONATOR . 331 9.7.3 SERIES-GAP COUPLING OF MICROSTRIPS 332 9.7.4 SERIES-GAP-COUPLED STRAIGHT RESONATOR PAIRS 334 9.7.5 THE RESONANT TECHNIQUE DUE TO RICHINGS AND EASTER 336 9.7.6 THE SYMMETRICAL STRAIGHT RESONATOR 337 XIV CONTENTS 9.7.7 RESONANCE METHODS FOR THE DETERMINATION OF DISCONTINUITIES OTHER THAN OPEN-CIRCUITS 339 9.8 Q-FACTOR MEASUREMENTS 340 9.9 MEASUREMENTS ON PARALLEL-COUPLED MICROSTRIPS 341 9.10 STANDING-WAVE INDICATORS IN MICROSTRIP 343 9.11 TIME-DOMAIN REFLECTOMETRY (TDR) TECHNIQUES 344 10 INTERCONNECTS AND FILTERS IN PASSIVE RFICS AND MICS 347 10.1 RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) 347 10.1.1 ON-CHIP RESISTORS 348 10.1.2 ON-CHIP CAPACITORS 348 10.1.3 PLANAR INDUCTORS 350 10.2 TERMINATIONS AND ATTENUATORS IN MIC TECHNOLOGY 353 10.3 FURTHER THICK AND THIN FILM PASSIVE COMPONENTS 354 10.3.1 BRANCH-TYPE COUPLERS AND POWER DIVIDERS 355 10.3.2 MICROSTRIP BALUNS 360 10.3.3 A STRATEGY FOR LOW-PASS MICROWAVE FILTER DESIGN 361 10.3.4 BANDPASS ALTERS 365 10.3.5 A WORKED NUMERICAL EXAMPLE OF A PARALLEL-COUPLED BANDPASS FILTER370 10.3.6 CAD OF PARALLEL-COUPLED BANDPASS FILTERS 373 10.3.7 IMPROVEMENTS TO THE BASIC EDGE-COUPLED FILTER RESPONSE . . . . 376 10.3.8 FILTER ANALYSIS AND DESIGN INCLUDING ALL LOSSES 376 10.3.9 BANDPASS FILTERS WITH INCREASED BANDWIDTH ( 15%) 379 10.3.10 FURTHER DEVELOPMENTS IN BANDPASS FILTER DESIGN 380 10.3.11 MICROSTRIP RADIAL STUBS 380 10.3.12 DIELECTRIC RESONATORS AND FILTERS USING THEM 382 10.3.13 SPURLINE BANDSTOP FILTERS 383 10.3.14 FILTERS USING SYNTHETIC PERIODIC SUBSTRATES (ELECTROMAGNETIC BANDGAP CRYSTALS) 384 10.3.15 PASSIVE MICS WITH SWITCHING ELEMENTS 385 10.3.16 ISOLATORS AND CIRCULATORS 385 11 ACTIVE DIGITAL AND ANALOGUE ICS 389 11.1 INTRODUCTION 389 11.1.1 HIGH-SPEED DIGITAL CIRCUITS 389 11.2 CLOCK DISTRIBUTION 390 11.3 ROTARY CLOCK DISTRIBUTION 393 11.3.1 CONCEPTUAL BASIS 394 11.3.2 CIRCUIT MODEL OF A ROTARY CLOCK* 395 11.3.3 CASE STUDY: A 3 GHZ ROTARY CLOCK* 398 11.3.4 EFFECT OF COPPER INTERCONNECT 402 11.3.5 SUMMARY 405 11.4 RF AND MICROWAVE ACTIVE DEVICES 408 11.5 YIELD AND HYBRID MICS 409 11.6 AMPLIFIERS 410 11.6.1 LOW-NOISE AMPLIFIER DESIGN STRATEGY 412 11.6.2 HIGH-GAIN NARROWBAND AMPLIFIER DESIGN 414 CONTENTS XV 11.6.3 DESIGN EXAMPLE 415 11.7 CUSTOM HYBRID AMPLIFIERS 417 11.7.1 STANDARD MIC AMPLIFIER MODULES 417 11.7.2 CUSTOM MIC AMPLIFIER MODULES 418 11.8 BALANCED AMPLIFIERS 420 11.9 AMPLIFIERS USING MMIC TECHNOLOGY 424 11.9.1 DESIGN OF A DECADE-BANDWIDTH DISTRIBUTED AMPLIFIER 424 11.9.2 W-BAND MMIC LNAS 426 11.10 MICROWAVE OSCILLATORS 427 11.10.1 EXAMPLE OF A DIELECTRIC RESONATOR OSCILLATOR 429 11.10.2 DRO OSCILLATOR DEVELOPMENTS 430 11.10.3 MMIC OSCILLATOR EXAMPLE 431 11.11 ACTIVE MICROWAVE ALTERS 433 11.12 PHASE SHIFTERS 434 APPENDIX A TRANSMISSION LINE THEORY 435 A.L HALF-, QUARTER- AND EIGHTH-WAVELENGTH LINES 435 A.2 SIMPLE (NARROWBAND) MATCHING 436 A.3 EQUIVALENT TWO-PORT NETWORKS 438 A.4 CHAIN (ABCD) PARAMETERS FOR A UNIFORM LENGTH OF LOSS-FREE TRANSMISSION LINE 439 A.5 PARALLEL COUPLED TRANSMISSION LINES 440 A.5.1 EVEN AND ODD MODES 440 A.5.2 OVERALL PARAMETERS FOR COUPLERS 441 A.5.3 ANALYSIS OF PARALLEL-COUPLED TEM-MODE TRANSMISSION LINES . . 442 APPENDIX B Q-FACTOR 449 B.L DEFINITION 449 B.2 LOADED Q-FACTOR 450 B.3 EXTERNAL Q-FACTOR OF AN OPEN-CIRCUITED MICROSTRIP RESONATOR 451 APPENDIX C OUTLINE OF SCATTERING PARAMETER THEORY 457 C.L INTRODUCTION 457 C.2 NETWORK PARAMETERS 457 C.3 SCATTERING PARAMETERS 459 C.3.1 SCATTERING PARAMETERS FOR A TWO-PORT NETWORK 460 C.3.2 DEFINITIONS OF TWO-PORT 5-PARAMETERS 462 C.3.3 EVALUATION OF SCATTERING PARAMETERS 463 C.3.4 MEASUREMENT OF SCATTERING PARAMETERS 464 C.3.5 AE-PARAMETER RELATIONSHIPS IN INTERPRETING INTERCONNECT MEA- SUREMENTS 465 C.3.6 MULTIPORT 5-PARAMETERS 466 C.3.7 SIGNAL-FLOW GRAPH TECHNIQUES AND AE-PARAMETERS 468 C.4 SCATTERING TRANSFER (OR T) PARAMETERS 469 C.4.1 CASCADED TWO-PORT NETWORKS: THE UTILITY OF T PARAMETERS . . . 470 APPENDIX D CAPACITANCE MATRIX EXTRACTION 471 XVI CONTENTS REFERENCES 475 INDEX 499
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author	Edwards, Terence Charles
author_facet	Edwards, Terence Charles
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author_sort	Edwards, Terence Charles
author_variant	t c e tc tce
building	Verbundindex
bvnumber	BV019809903
callnumber-first	T - Technology
callnumber-label	TK7876
callnumber-raw	TK7876
callnumber-search	TK7876
callnumber-sort	TK 47876
callnumber-subject	TK - Electrical and Nuclear Engineering
classification_rvk	ZN 5800
ctrlnum	(OCoLC)44493232 (DE-599)BVBBV019809903
dewey-full	621.381/32
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	621 - Applied physics
dewey-raw	621.381/32
dewey-search	621.381/32
dewey-sort	3621.381 232
dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik / Elektronik / Nachrichtentechnik
edition	3. ed.
format	Book
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id	DE-604.BV019809903
illustrated	Illustrated
indexdate	2024-07-09T20:06:38Z
institution	BVB
isbn	0471607010
language	English
lccn	00043468
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-013135341
oclc_num	44493232
open_access_boolean
owner	DE-29T DE-634 DE-M347
owner_facet	DE-29T DE-634 DE-M347
physical	XX, 512 S. Ill., graph. Darst.
publishDate	2000
publishDateSearch	2000
publishDateSort	2000
publisher	Wiley
record_format	marc
spelling	Edwards, Terence Charles Verfasser aut Foundations of interconnect and microstrip design T. C. Edward ; M. B. Steer 3. ed. Chichester [u.a.] Wiley 2000 XX, 512 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier früher u.d.T.: Foundations for microstrip circuit design Micro-elektronica gtt Transmissielijnen gtt Microwave integrated circuits Strip transmission lines Mikrowellenschaltung (DE-588)4169891-5 gnd rswk-swf Mikrowellenstreifenleitung (DE-588)4169897-6 gnd rswk-swf Integrierte Mikrowellenschaltung (DE-588)4161931-6 gnd rswk-swf Mikrowellenstreifenleitung (DE-588)4169897-6 s DE-604 Integrierte Mikrowellenschaltung (DE-588)4161931-6 s Mikrowellenschaltung (DE-588)4169891-5 s 1\p DE-604 Steer, M. B. Sonstige oth 2. Auflage Edwards, Terence C. Foundations for microstrip circuit design 4. Aufl. u.d.T. Edwards, Terence C. Foundations for microstrip circuit design http://www.loc.gov/catdir/description/wiley034/00043468.html Publisher description http://www.loc.gov/catdir/toc/onix05/00043468.html Table of Contents GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=013135341&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk
spellingShingle	Edwards, Terence Charles Foundations of interconnect and microstrip design Micro-elektronica gtt Transmissielijnen gtt Microwave integrated circuits Strip transmission lines Mikrowellenschaltung (DE-588)4169891-5 gnd Mikrowellenstreifenleitung (DE-588)4169897-6 gnd Integrierte Mikrowellenschaltung (DE-588)4161931-6 gnd
subject_GND	(DE-588)4169891-5 (DE-588)4169897-6 (DE-588)4161931-6
title	Foundations of interconnect and microstrip design
title_auth	Foundations of interconnect and microstrip design
title_exact_search	Foundations of interconnect and microstrip design
title_full	Foundations of interconnect and microstrip design T. C. Edward ; M. B. Steer
title_fullStr	Foundations of interconnect and microstrip design T. C. Edward ; M. B. Steer
title_full_unstemmed	Foundations of interconnect and microstrip design T. C. Edward ; M. B. Steer
title_new	Edwards, Terence C. Foundations for microstrip circuit design
title_old	Edwards, Terence C. Foundations for microstrip circuit design
title_short	Foundations of interconnect and microstrip design
title_sort	foundations of interconnect and microstrip design
topic	Micro-elektronica gtt Transmissielijnen gtt Microwave integrated circuits Strip transmission lines Mikrowellenschaltung (DE-588)4169891-5 gnd Mikrowellenstreifenleitung (DE-588)4169897-6 gnd Integrierte Mikrowellenschaltung (DE-588)4161931-6 gnd
topic_facet	Micro-elektronica Transmissielijnen Microwave integrated circuits Strip transmission lines Mikrowellenschaltung Mikrowellenstreifenleitung Integrierte Mikrowellenschaltung
url	http://www.loc.gov/catdir/description/wiley034/00043468.html http://www.loc.gov/catdir/toc/onix05/00043468.html http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=013135341&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT edwardsterencecharles foundationsofinterconnectandmicrostripdesign AT steermb foundationsofinterconnectandmicrostripdesign

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