Lumped elements for RF and microwave circuits:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boston
Artech House
2003
|
| Schriftenreihe: | Artech House microwave library
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | XIX, 488 S. Ill., graph. Darst. : 24 cm |
| ISBN: | 1580533094 |
Internformat
MARC
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| 010 | |a 2003048102 | ||
| 020 | |a 1580533094 |c alk. paper |9 1-58053-309-4 | ||
| 035 | |a (OCoLC)248963480 | ||
| 035 | |a (DE-599)BVBBV019372858 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
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| 100 | 1 | |a Bahl, Inder J. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Lumped elements for RF and microwave circuits |c Inder Bahl |
| 264 | 1 | |a Boston |b Artech House |c 2003 | |
| 300 | |a XIX, 488 S. |b Ill., graph. Darst. : 24 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Artech House microwave library | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Lumped elements (Electronics) | |
| 650 | 4 | |a Microwave integrated circuits | |
| 650 | 4 | |a Passive components | |
| 650 | 4 | |a Radio frequency integrated circuits | |
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Datensatz im Suchindex
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| adam_text |
IMAGE 1
LUMPED ELEMENTS FOR RF
AND MICROWAVE CIRCUITS
INDER BAHL
AN
ARTECH HOUSE BOSTON * LONDON WWW.ARTECHHOUSE.COM
IMAGE 2
CONTENTS
PREFACE XVII
1
1.1
1.2
1.3
1.4
1.4.1 1.4.2
1.4.3
1.5
1.6
1.7
2
2.1
ACKNOWLEDGMENTS
INTRODUCTION
HISTORY OF LUMPED ELEMENTS
WHY USE LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS?
L, C, R CIRCUIT ELEMENTS
BASIC DESIGN OF LUMPED ELEMENTS CAPACITOR INDUCTOR
RESISTOR
LUMPED-ELEMENT MODELING
FABRICATION
APPLICATIONS
REFERENCES
INDUCTORS
INTRODUCTION
XIX
1
1
2
4
6
7
8
8
9
11
12
13
17
17
VII
IMAGE 3
VIII
LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS
2.2
2.2.1 2.2.2
2.2.3 2.2.4
2.2.5 2.2.6
2.2.7 2.2.8
2.2.9 2.2.10 2.2.11
2.3
2.4 2.4.1 2.4.2
2.4.3 2.4.4
2.4.5
2.5 2.5.1 2.5.2
2.6 2.6.1 2.6.2
3
3.1 3.1.1 3.1.2
3.1.3 3.1.4
3.1.5 3.1.6
3.1.7
BASIC DEFINITIONS INDUCTANCE MAGNETIC ENERGY
MUTUAL INDUCTANCE EFFECTIVE INDUCTANCE IMPEDANCE TIME CONSTANT QUALITY
FACTOR
SELF-RESONANT FREQUENCY MAXIMUM CURRENT RATING MAXIMUM POWER RATING
OTHER PARAMETERS
INDUCTOR CONFIGURATIONS
INDUCTOR MODELS ANALYTICAL MODELS COUPLED-LINE APPROACH MUTUAL
INDUCTANCE APPROACH
NUMERICAL APPROACH MEASUREMENT-BASED MODEL
COUPLING BETWEEN INDUCTORS LOW-RESISTIVITY SUBSTRATES HIGH-RESISTIVITY
SUBSTRATES
ELECTRICAL REPRESENTATIONS SERIES AND PARALLEL REPRESENTATIONS NETWORK
REPRESENTATIONS REFERENCES
PRINTED INDUCTORS
INDUCTORS ON SI SUBSTRATE CONDUCTOR LOSS SUBSTRATE LOSS LAYOUT
CONSIDERATIONS INDUCTOR MODEL
Q-ENHANCEMENT TECHNIQUES STACKED-COIL INDUCTOR TEMPERATURE DEPENDENCE
18 18 18 20 20 21 21 22
23 23 23 23
24
25 25 28 34 36 38
45 45 46
50 50
51 52
57
58 60
63 64
65 69 80 84
IMAGE 4
CONTENTS IX
3.2
3.2.1 3.2.2 3.2.3 3.2.4 3.2.5 3.2.6
3.3
3.4
3.4.1
3.4.2
3.4.3
3.5
4.1 4.1.1 4.1.2
4.2 4.2.1 4.2.2 4.2.3 4.2.4
4.2.5 4.2.6 4.2.7
4.3 4.3.1 4.3.2
4.3.3
4.4
INDUCTORS ON GAAS SUBSTRATE INDUCTOR MODELS
FIGURE OF MERIT COMPREHENSIVE INDUCTOR DATA Q-ENHANCEMENT TECHNIQUES
COMPACT INDUCTORS
HIGH CURRENT HANDLING CAPABILITY INDUCTORS
PRINTED CIRCUIT BOARD INDUCTORS
HYBRID INTEGRATED CIRCUIT INDUCTORS
THIN-FILM INDUCTORS THICK-FILM INDUCTORS LTCC INDUCTORS
FERROMAGNETIC INDUCTORS REFERENCES
WIRE INDUCTORS
WIRE-WOUND INDUCTORS ANALYTICAL EXPRESSIONS COMPACT HIGH-FREQUENCY
INDUCTORS
BOND WIRE INDUCTOR SINGLE AND MULTIPLE WIRES WIRE NEAR A CORNER
WIRE ON A SUBSTRATE BACKED BY A GROUND PLANE WIRE ABOVE A SUBSTRATE
BACKED BY A GROUND PLANE CURVED WIRE CONNECTING SUBSTRATES
TWISTED WIRE MAXIMUM CURRENT HANDLING OF WIRES
WIRE MODELS NUMERICAL METHODS FOR BOND WIRES MEASUREMENT-BASED MODEL FOR
AIR CORE INDUCTORS
MEASUREMENT-BASED MODEL FOR BOND WIRES
MAGNETIC MATERIALS REFERENCES
86
87 88
88 104 112
116
118
121 121
124 126
127 129
137
137 137 144
146
147 150
151
153 154
155 155
156 156
156 158
160 161
IMAGE 5
X LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS
5
5.1
5.2
5.2.1
5.2.2
5.2.3 5.2.4
5.2.5 5.2.6
5.2.7 5.2.8
5.2.9 5.2.10 5.2.11
5.3 5.3.1 5.3.2
5.4 5.4.1
5.4.2
5.4.3 5.4.4
5.5
5.5.1 5.5.2
5.5.3
5.6
5.6.1
5.6.2
6
6.1
6.1.1
CAPACITORS
INTRODUCTION
CAPACITOR PARAMETERS
CAPACITOR VALUE
EFFECTIVE CAPACITANCE
TOLERANCES TEMPERATURE COEFFICIENT
QUALITY FACTOR
EQUIVALENT SERIES RESISTANCE
SERIES AND PARALLEL RESONANCES DISSIPATION FACTOR OR LOSS TANGENT
TIME CONSTANT
RATED VOLTAGE
RATED CURRENT
CHIP CAPACITOR TYPES
MULTILAYER DIELECTRIC CAPACITOR
MULTIPLATE CAPACITOR
DISCRETE PARALLEL PLATE CAPACITOR ANALYSIS VERTICALLY MOUNTED SERIES
CAPACITOR
FLAT-MOUNTED SERIES CAPACITOR
FLAT-MOUNTED SHUNT CAPACITOR
MEASUREMENT-BASED MODEL
VOLTAGE AND CURRENT RATINGS MAXIMUM VOLTAGE RATING
MAXIMUM RF CURRENT RATING
MAXIMUM POWER DISSIPATION
CAPACITOR ELECTRICAL REPRESENTATION
SERIES AND SHUNT CONNECTIONS
NETWORK REPRESENTATIONS
REFERENCES
MONOLITHIC CAPACITORS
MIM CAPACITOR MODELS SIMPLE LUMPED EQUIVALENT CIRCUIT
163
163
165 165 166 166
166
167 167
167 170 170
170
170
171
171 172
173
173 176
177 178
181 181
181
182
185 185
187 188
191
192
193
IMAGE 6
CONTENTS
XI
6.1.2
6.1.3 6.1.4
6.1.5
6.2
6.2.1
6.2.2
6.2.3 6.2.4
6.2.5
6.3
6.3.1 6.3.2
6.3.3
6.4
6.4.1
6.4.2
6.4.3
7
7.1
7.1.1 7.1.2
7.1.3 7.1.4
7.2
7.2.1
7.2.2
7.2.3 7.2.4
7.2.5
7.3
COUPLED MICROSTRIP-BASED DISTRIBUTED MODEL
SINGLE MICROSTRIP-BASED DISTRIBUTED MODEL EC MODEL FOR MIM CAPACITOR ON
SI
EM SIMULATIONS
HIGH-DENSITY CAPACITORS
MULTILAYER CAPACITORS
ULTRA-THIN-FILM CAPACITORS
HIGH-K CAPACITORS
FRACTAL CAPACITORS
FERROELECTRIC CAPACITORS
CAPACITOR SHAPES
RECTANGULAR CAPACITORS
CIRCULAR CAPACITORS
OCTAGONAL CAPACITORS
DESIGN CONSIDERATIONS
Q-ENHANCEMENT TECHNIQUES TUNABLE CAPACITOR
MAXIMUM POWER HANDLING
REFERENCES
INTERDIGITAL CAPACITORS
INTERDIGITAL CAPACITOR MODELS APPROXIMATE ANALYSIS /-INVERTER NETWORK
EQUIVALENT REPRESENTATION
FULL-WAVE ANALYSIS
MEASUREMENT-BASED MODEL
DESIGN CONSIDERATIONS
COMPACT SIZE MULTILAYER CAPACITOR
Q-ENHANCEMENT TECHNIQUES
VOLTAGE TUNABLE CAPACITOR
HIGH-VOLTAGE OPERATION
INTERDIGITAL STRUCTURE AS A PHOTODETECTOR
REFERENCES
194
198
202
204
206
208
211
212
212
214
216
217 218
218
220
220
223
223
227
229
230
230
235 236
238
239
239 241
244
247
249
249
251
IMAGE 7
XII LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS
8
8.1
8.2
8.2.1
8.2.2
8.2.3 8.2.4
8.2.5 8.2.6
8.2.7 8.2.8
8.3
8.3.1 8.3.2
8.3.3
8.4
8.5 8.5.1 8.5.2
8.5.3
8.6
8.6.1 8.6.2
8.7
8.8
9
9.1
9.1.1 9.1.2
9.2
9.2.1
RESISTORS
INTRODUCTION
BASIC DEFINITIONS POWER RATING
TEMPERATURE COEFFICIENT
RESISTOR TOLERANCES MAXIMUM WORKING VOLTAGE MAXIMUM FREQUENCY OF
OPERATION
STABILITY NOISE
MAXIMUM CURRENT RATING
RESISTOR TYPES
CHIP RESISTORS
MCM RESISTORS
MONOLITHIC RESISTORS
HIGH-POWER RESISTORS
RESISTOR MODELS
EC MODEL
DISTRIBUTED MODEL MEANDER LINE RESISTOR
RESISTOR REPRESENTATIONS
NETWORK REPRESENTATIONS
ELECTRICAL REPRESENTATIONS
EFFECTIVE CONDUCTIVITY
THERMISTORS
REFERENCES
VIA HOLES
TYPES OF VIA HOLES VIA HOLE CONNECTION
VIA HOLE GROUND
VIA HOLE MODELS ANALYTICAL EXPRESSION
253
253
255 255 256 256
256
257
257 257
257
257 258
258
258
265
267 268
269 270
272 272
272
274
276
276
279
279 279 281
282
283
IMAGE 8
CONTENTS XIII
9.2.2
9.2.3 9.2.4
9.2.5
9.3 9.3.1 9.3.2
9.4
9.5
10
10.1
10.2 10.2.1 10.2.2
10.3 10.3.1 10.3.2
11
11.1
11.1.1 11.1.2
11.1.3 11.1.4
11.1.5 11.1.6
11.1.7
11.2 11.2.1 11.2.2
QUASISTATIC METHOD PARALLEL PLATE WAVEGUIDE MODEL METHOD OF MOMENTS
MEASUREMENT-BASED MODEL
VIA FENCE COUPLING BETWEEN VIA HOLES
RADIATION FROM VIA GROUND PLUG
PIATED HEAT SINK VIA
VIA HOLE LAYOUT
REFERENCES
AIRBRIDGES AND DIELECTRIC CROSSOVERS
AIRBRIDGE AND CROSSOVER
ANALYSIS TECHNIQUES QUASISTATIC METHOD
FULL-WAVE ANALYSIS
MODELS ANALYTICAL MODEL
MEASUREMENT-BASED MODEL REFERENCES
TRANSFORMERS AND BALUNS
BASIC THEORY PARAMETERS DEFINITION
ANALYSIS OF TRANSFORMERS IDEAL TRANSFORMERS EQUIVALENT CIRCUIT
REPRESENTATION
EQUIVALENT CIRCUIT OF A PRACTICAL TRANSFORMER WIDEBAND IMPEDANCE
MATCHING TRANSFORMERS TYPES OF TRANSFORMERS
WIRE-WRAPPED TRANSFORMERS TAPPED COIL TRANSFORMERS BOND WIRE TRANSFORMER
284
286
287 289
290
293 293
294
294
296
299
299
301 301
306
308 308 310
315
317
318
318
319 322
323 325 326
329
329
329 332
11.3 TRANSMISSION-LINE TRANSFORMERS 332
IMAGE 9
XIV LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS
11.4 FERRITE TRANSFORMERS 336
11.5 PARALLEL CONDUCTOR WINDING TRANSFORMERS ON SI
11.6
11.6.1 11.6.2
12
12.1 12.1.1
12.1.2
12.1.3 12.1.4
12.1.5
12.2
12.2.1 12.2.2
12.2.3
13
13.1
13.1.1 13.1.2
13.1.3
13.2 13.2.1
13.2.2
13.3
13.3.1 13.3.2
13.4
13.4.1
SUBSTRATE
SPIRAL TRANSFORMERS ON GAAS SUBSTRATE
TRIFORMER BALUN
PLANAR-TRANSFORMER BALUN REFERENCES
LUMPED-ELEMENT CIRCUITS
PASSIVE CIRCUITS FILTERS
HYBRIDS AND COUPLERS
POWER DIVIDERS/COMBINERS MATCHING NETWORKS
LUMPED-ELEMENT BIASING CIRCUIT
CONTROL CIRCUITS SWITCHES
PHASE SHIFTERS
DIGITAL ATTENUATOR REFERENCES
FABRICATION TECHNOLOGIES
INTRODUCTION MATERIALS
MASK LAYOUTS MASK FABRICATION
PRINTED CIRCUIT BOARDS PCB FABRICATION
PCB INDUCTORS
MICROWAVE PRINTED CIRCUITS
MPC FABRICATION
MPC APPLICATIONS
HYBRID INTEGRATED CIRCUITS THIN-FILM MICS
339
341
344
345 349
353
353
353 356 370
372
377
380 381
387 390 392
395
395 396
401 401
402
404
405
405
407 408
410 410
IMAGE 10
CONTENTS
XV
13.4.2
13.4.3
13.5
13.5.1 13.5.2
13.6
13.7
14
14.1
14.1.1
14.1.2
14.2
14.2.1
14.2.2
14.2.3 14.2.4
14.2.5 14.2.6
14.3
14.3.1 14.3.2
14.3.3 14.3.4
14.4
14.5
14.5.1
14.5.2
14.5.3
THICK-FILM TECHNOLOGY
COFIRED CERAMIC AND GLASS-CERAMIC TECHNOLOGY
GAAS MICS
MMIC FABRICATION
MMIC EXAMPLE
CMOS FABRICATION
MICROMACHINING FABRICATION
REFERENCES
MICROSTRIP OVERVIEW
DESIGN EQUATIONS CHARACTERISTIC IMPEDANCE AND EFFECTIVE DIELECTRIC
CONSTANT
EFFECT OF STRIP THICKNESS
DESIGN CONSIDERATIONS
EFFECT OF DISPERSION
MICROSTRIP LOSSES
QUALITY FACTOR Q
ENCLOSURE EFFECT
FREQUENCY RANGE OF OPERATION
POWER-HANDLING CAPABILITY
COUPLED MICROSTRIP LINES
EVEN-MODE CAPACITANCE
ODD-MODE CAPACITANCE
CHARACTERISTIC IMPEDANCES
EFFECTIVE DIELECTRIC CONSTANTS
MICROSTRIP DISCONTINUITIES
COMPENSATED MICROSTRIP DISCONTINUITIES
STEP-IN-WIDTH
CHAMFERED BEND
T-JUNCTION
REFERENCES
412
414
416
418
421
421
424
425
429
429
429
431
432
433
433
435
438
443 444
456
457
458
459
459
460
461
461
462
463
465
IMAGE 11
XVI LUMPED ELEMENTS FOR RF AND MICROWAVE CIRCUITS
APPENDIX 469
ABOUT THE AUTHOR 471
INDEX 473 |
| any_adam_object | 1 |
| author | Bahl, Inder J. |
| author_facet | Bahl, Inder J. |
| author_role | aut |
| author_sort | Bahl, Inder J. |
| author_variant | i j b ij ijb |
| building | Verbundindex |
| bvnumber | BV019372858 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874.54 |
| callnumber-search | TK7874.54 |
| callnumber-sort | TK 47874.54 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 5800 |
| classification_tum | ELT 220f |
| ctrlnum | (OCoLC)248963480 (DE-599)BVBBV019372858 |
| dewey-full | 621.381/32 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/32 |
| dewey-search | 621.381/32 |
| dewey-sort | 3621.381 232 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV019372858 |
| illustrated | Illustrated |
| indexdate | 2024-09-06T00:13:32Z |
| institution | BVB |
| isbn | 1580533094 |
| language | English |
| lccn | 2003048102 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-012836219 |
| oclc_num | 248963480 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XIX, 488 S. Ill., graph. Darst. : 24 cm |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | Artech House |
| record_format | marc |
| series2 | Artech House microwave library |
| spelling | Bahl, Inder J. Verfasser aut Lumped elements for RF and microwave circuits Inder Bahl Boston Artech House 2003 XIX, 488 S. Ill., graph. Darst. : 24 cm txt rdacontent n rdamedia nc rdacarrier Artech House microwave library Includes bibliographical references and index Lumped elements (Electronics) Microwave integrated circuits Passive components Radio frequency integrated circuits Mikrowellenschaltung (DE-588)4169891-5 gnd rswk-swf Hochfrequenzschaltung (DE-588)4160147-6 gnd rswk-swf Bauelement (DE-588)4004741-6 gnd rswk-swf Hochfrequenzschaltung (DE-588)4160147-6 s Mikrowellenschaltung (DE-588)4169891-5 s Bauelement (DE-588)4004741-6 s DE-604 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=012836219&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Bahl, Inder J. Lumped elements for RF and microwave circuits Lumped elements (Electronics) Microwave integrated circuits Passive components Radio frequency integrated circuits Mikrowellenschaltung (DE-588)4169891-5 gnd Hochfrequenzschaltung (DE-588)4160147-6 gnd Bauelement (DE-588)4004741-6 gnd |
| subject_GND | (DE-588)4169891-5 (DE-588)4160147-6 (DE-588)4004741-6 |
| title | Lumped elements for RF and microwave circuits |
| title_auth | Lumped elements for RF and microwave circuits |
| title_exact_search | Lumped elements for RF and microwave circuits |
| title_full | Lumped elements for RF and microwave circuits Inder Bahl |
| title_fullStr | Lumped elements for RF and microwave circuits Inder Bahl |
| title_full_unstemmed | Lumped elements for RF and microwave circuits Inder Bahl |
| title_short | Lumped elements for RF and microwave circuits |
| title_sort | lumped elements for rf and microwave circuits |
| topic | Lumped elements (Electronics) Microwave integrated circuits Passive components Radio frequency integrated circuits Mikrowellenschaltung (DE-588)4169891-5 gnd Hochfrequenzschaltung (DE-588)4160147-6 gnd Bauelement (DE-588)4004741-6 gnd |
| topic_facet | Lumped elements (Electronics) Microwave integrated circuits Passive components Radio frequency integrated circuits Mikrowellenschaltung Hochfrequenzschaltung Bauelement |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=012836219&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT bahlinderj lumpedelementsforrfandmicrowavecircuits |