Integrated Passive Component Technology:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Piscataway, NJ
IEEE Press [u.a.]
2003
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | XIX, 379 S. Ill., graph. Darst. |
| ISBN: | 0471244317 |
Staff View
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV017061889 | ||
| 003 | DE-604 | ||
| 005 | 20041126 | ||
| 007 | t | ||
| 008 | 030408s2003 ad|| |||| 00||| eng d | ||
| 016 | 7 | |a 967244285 |2 DE-101 | |
| 020 | |a 0471244317 |9 0-471-24431-7 | ||
| 035 | |a (OCoLC)890325294 | ||
| 035 | |a (DE-599)BVBBV017061889 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 |a DE-29T |a DE-92 | ||
| 050 | 0 | |a TK7874 | |
| 082 | 0 | |a 621.3815 |2 21 | |
| 084 | |a ZN 4400 |0 (DE-625)157385: |2 rvk | ||
| 084 | |a ZN 4900 |0 (DE-625)157417: |2 rvk | ||
| 245 | 1 | 0 | |a Integrated Passive Component Technology |c ed. by Richard K Ulrich ... |
| 264 | 1 | |a Piscataway, NJ |b IEEE Press [u.a.] |c 2003 | |
| 300 | |a XIX, 379 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Integrated circuits |x Design and construction | |
| 650 | 4 | |a Passive components | |
| 650 | 4 | |a Printed circuits |x Design and construction | |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Passives Bauelement |0 (DE-588)4173496-8 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Passives Bauelement |0 (DE-588)4173496-8 |D s |
| 689 | 0 | 1 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Ulrich, Richard K |e Sonstige |4 oth | |
| 700 | 1 | |a Schaper, Leonard W |e Sonstige |4 oth | |
| 856 | 4 | 2 | |m GBV Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010295135&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-010295135 | |
Record in the Search Index
| _version_ | 1809403462703644672 |
|---|---|
| adam_text |
INTEGRATED PASSIVE COMPONENT TECHNOLOGY EDITED BY RICHARD K. ULRICH
LEONARD W. SCHAPER UNIVERSITY OF ARKANSAS IEEE COMPONENTS, PACKAGING &
MANUFACTURING TECHNOLOGY SOCIETY, SPONSOR IEEE PRESS ,WILEY-
INTERSCIENCE A JOHN WILEY & SONS, INC., PUBLICATION CONTENTS
CONTRIBUTORS XV PREFACE 1 INTRODUCTION 1 RICHARD K. ULRICH 1.1 STATUS
AND TRENDS IN DISCRETE PASSIVE COMPONENTS 2 1.2 DEFINITIONS AND
CONFIGURATIONS OF INTEGRATED PASSIVES 7 1.3 COMPARISON TO INTEGRATED
ACTIVE DEVICES 10 1.4 SUBSTRATES AND INTERCONNECT SYSTEMS FOR INTEGRATED
PASSIVES 11 1.4.1 ORGANIC SUBSTRATES 12 1.4.2 INORGANIC SUBSTRATES 14
1.5 FABRICATION OF INTEGRATED PASSIVES 14 1.6 REASONS FOR INTEGRATING
PASSIVE DEVICES 17 1.7 PROBLEMS WITH INTEGRATING PASSIVE DEVICES 20
1.7.1 COST MODELING 22 1.8 APPLICATIONS FOR INTEGRATED PASSIVES 23 1.8.1
REPLACING SURFACE MOUNT DISCRETES WITH ARRAYS 23 AND NETWORKS 1.8.2
DECOUPLING 24 1.8.3 DC/DC CONVERSION 26 1.8.4 PASSIVE REPLACEMENT IN FR4
27 1.8.5 PASSIVE REPLACEMENT IN HDI 27 1.9 THE PAST AND FUTURE OF
INTEGRATED PASSIVES 27 1.10 ORGANIZATION OF THIS BOOK 29 REFERENCES 30 2
CHARACTERISTICS AND PERFORMANCE OF PLANAR RESISTORS 33 RICHARD K. ULRICH
2.1 PERFORMANCE PARAMETERS 33 2.1.1 RESISTANCE OF PLANAR RESISTORS 3 3
2.1.2 RESISTIVITY OF MATERIALS 3 5 VII VLII CONTENTS 2.1.3 TEMPERATURE
EFFECTS 37 2.1.4 VALUE STABILITY 38 2.2 RESISTANCE IN ELECTRONIC
MATERIALS 40 2.2.1 RESISTIVITY AND CHARGE CARRIERS 40 2.2.2
SEMICONDUCTING OXIDES 41 2.2.3 TUNNELING 43 2.2.4 TEMPERATURE,
COMPOSITION, AND MORPHOLOGY EFFECTS 43 2.3 SIZING INTEGRATED RESISTORS
45 2.3.1 THERMAL ISSUES 46 2.3.2 PARASITIC CAPACITANCE BETWEEN MEANDERS
49 2.3.3 PARASITIC CAPACITANCE TO GROUND 51 2.3.4 LUMPED VERSUS
DISTRIBUTED PERFORMANCE 52 2.4 TRIMMING 52 REFERENCES 53 3 INTEGRATED
RESISTOR MATERIALS AND PROCESSES 55 RICHARD K. ULRICH 3.1
SINGLE-COMPONENT METALS 56 3.2 METAL ALLOYS AND METAL-NONMETAL COMPOUNDS
58 3.2.1 TANTALUM NITRIDE 59 3.2.2 TITANIUM OXY-NITRIDE 60 3.2.3 NICKEL
PHOSPHIDE 60 3.3 SEMICONDUCTORS 61 3.3.1 SILICON 61 3.3.2 SEMICONDUCTING
OXIDES 61 3.4 CERMETS 61 3.5 POLYMER THICK FILM 63 3.6 INK JET
DEPOSITION 65 3.7 COMMERCIALIZED PROCESSES 66 3.7.1 OHMEGA-PLY 66 3.7.2
DUPONT INTERRA* 66 3.7.3 MACDERMID M-PASS* 68 3.7.4 POLYMER THICK FILM
70 3.7.5 SHIPLEY INSITE* 70 3.8 SUMMARY 70 REFERENCES 73 4 DIELECTRIC
MATERIALS FOR INTEGRATED CAPACITORS 75 RICHARD K. ULRICH 4.1
POLARIZABILITY AND CAPACITANCE 76 4.2 CAPACITANCE DENSITY 79 4.3
TEMPERATURE EFFECTS 82 4.4 FREQUENCY AND VOLTAGE EFFECTS 83 4.5 AGING
EFFECTS 4.6 COMPOSITION AND MORPHOLOGY EFFECTS 4.7 LEAKAGE AND BREAKDOWN
4.8 DISSIPATION FACTOR 4.9 COMPARISON TO EIA DIELECTRIC CLASSIFICATIONS
4.10 MATCHING DIELECTRIC MATERIALS TO APPLICATIONS 4.10.1 DECOUPLING AND
ENERGY STORAGE 4.10.2 ANALOG FUNCTIONS 4.10.3 TERMINATION OF
TRANSMISSION LINES REFERENCES CONTENTS IX 84 85 86 89 91 93 96 96 96 97
5 SIZE AND CONFIGURATION OF INTEGRATED CAPACITORS 101 RICHARD K. ULRICH
5.1 5.2 5.3 5.4 5.5 5.6 COMPARISON OF INTEGRATED AND DISCRETE AREAS
LAYOUT OPTIONS TOLERANCE MIXED DIELECTRIC STRATEGIES CV PRODUCT MAXIMUM
CAPACITANCE DENSITY AND BREAKDOWN VOLTAGE REFERENCES 101 105 106 107 108
109 111 6 PROCESSING INTEGRATED CAPACITORS 113 RICHARD K. ULRICH 6.1 6.2
6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 SPUTTERING CVD, PECVD AND MOCVD
ANODIZATION 6.3.1 BENEFITS OF ANODIZATION FOR CAPACITOR DIALECTICS 6.3.2
FILM FORMATION DURING ANODIZATION 6.3.3 TA ANODIZATION 6.3.4 DIELECTRICS
FROM ANODIZED TA 6.3.5 PATTERNING TA AND TA 2 O 5 6.3.6 FERROELECTRICS
BY ANODIZATION SOL-GEL AND HYDROTHERMAL FERROELECTRICS THIN- AND
THICK-FILM POLYMERS THICK-FILM DIELECTRICS 6.6.1 FERROELECTRIC POWDER
DISPERSED IN POLYMER INTERLAYER INSULATION INTERDIGITATED CAPACITORS
CAPACITOR PLATE MATERIALS TRIMMING INTEGRATED CAPACITORS COMMERCIALIZED
INTEGRATED CAPACITOR TECHNOLOGIES 6.11.1 DUPONT INTERRA* 6.11.2 3-MC-PLY
114 116 117 118 118 120 121 123 124 124 126 127 127 129 130 131 131 132
132 133 X CONTENTS 6.11.3 DUPONTHK4 133 6.11.4 MOTOROLA'S MEZZANINE
CAPACITOR 135 6.11.5 SANMINA BC2000* 135 6.11.6 NCHIP 135 6.12 SUMMARY
135 REFERENCES 138 7 DEFECTS AND YIELD ISSUES 145 RICHARD K. ULRICH 7.1
CAUSES OF FATAL DEFECTS IN INTEGRATED CAPACITORS 145 7.2 MEASUREMENT OF
DEFECT DENSITY 146 7.3 DEFECT DENSITY AND SYSTEM YIELD 147 7.3.1
PREDICTING YIELD FROM DEFECT DENSITY 148 7.4 YIELD ENHANCEMENT
TECHNIQUES FOR CAPACITORS 149 7.5 CONCLUSIONS 150 REFERENCES 151 8
ELECTRICAL PERFORMANCE OF INTEGRATED CAPACITORS 153 RICHARD K. ULRICH
AND LEONARD W. SCHAPER 8.1 MODELING IDEAL PASSIVES 154 8.2 MODELING REAL
CAPACITORS 154 8.3 ELECTRICAL PERFORMANCE OF DISCRETE AND INTEGRATED
CAPACITORS 158 8.3.1 INDUCTANCE OF THE CAPACITOR ALONE 158 8.3.2
INDUCTANCE OF THE CAPACITOR'S LEADS AND CONTACTS 164 8.3.3 EQUIVALENT
SERIES RESISTANCE 165 8.3.4 CAPACITORS AS DISTRIBUTED DEVICES 165 8.4
DISSIPATION FACTOR OF REAL CAPACITORS 166 8.5 MEASUREMENT OF CAPACITOR
PROPERTIES 166 8.5.1 ESR AND ESL MEASUREMENT WITH AN 167 IMPEDANCE
ANALYZER 8.5.2 ESR AND ESL MEASUREMENT WITH A 170 NETWORK ANALYZER 8.6
SUMMARY 174 REFERENCES 175 9 DECOUPLING 177 LEONARD W. SCHAPER 9.1 POWER
DISTRIBUTION 177 9.2 DECOUPLING WITH DISCRETE CAPACITORS 181 9.3
DECOUPLING WITH INTEGRATED CAPACITORS 183 9.4 DIELECTRICS AND
CONFIGURATIONS FOR INTEGRATED DECOUPLING 185 9.5 INTEGRATED DECOUPLING
AS AN ENTRY APPLICATION 187 REFERENCES 189 CONTENTS XI 10 INTEGRATED
INDUCTORS 191 GEERT J. CARCHON AND WALTER DE RAEDT 10.1 INTRODUCTION 191
10.2 INDUCTOR BEHAVIOR AND PERFORMANCE PARAMETERS 192 10.2.1 INDUCTOR
LAYOUTS AND VALUES 192 10.2.2 INDUCTOR OPERATING PRINCIPLES 194 10.2.3
EQUIVALENT CIRCUIT 196 10.2.4 EXTRACTION OF THE EQUIVALENT CIRCUIT
PARAMETERS 198 10.2.5 FIGURE OF MERITS: Q , Q IC , FOMI 200 10.2.6
SPIRAL INDUCTOR LAYOUTS 206 10.2.7 IMPROVING Q L BY TECHNOLOGY AND
LAYOUT PARAMETERS 208 10.3 INDUCTOR PERFORMANCE PREDICTION 216 10.3.1
TRANSMISSION LINE INDUCTOR 217 10.3.2 SPIRAL INDUCTORS 217 10.4
INTEGRATED INDUCTOR EXAMPLES 224 10.4.1 INDUCTORS INTEGRATED ON 10-20
FT-CM SI SUBSTRATES 224 10.4.2 GAAS MMIC INDUCTORS 224 10.4.3 MCM-D
INDUCTORS 226 10.4.4 LTCC 230 10.4.5 INTEGRATION OF ON-CHIP SI INDUCTORS
THROUGH 231 WAFER-LEVEL PACKAGING TECHNIQUES 10.5 USE OF INDUCTORS IN
CIRCUITS: EXAMPLES 232 10.5.1 FILTERS 233 10.5.2 VOLTAGE-CONTROLLED
OSCILLATORS 235 10.5.3 SIZE-REDUCTION TECHNIQUES 235 10.5.4 COUPLED
SPIRAL INDUCTORS 237 10.6 CONCLUSIONS 238 ACKNOWLEDGMENTS 238 REFERENCES
238 11 MODELING OF INTEGRATED INDUCTORS AND RESISTORS FOR 247 MICROWAVE
APPLICATIONS ZHENWEN WANG, M. JAMAL DEEN, AND A. H. RAHAL 11.1
INTRODUCTION 247 11.1.1 MINIATURE HYBRID MICROWAVE INTEGRATED CIRCUIT
(MHMIC) 248 11.1.2 GOALS OF THIS CHAPTER 248 11.2 MODELING OF SPIRAL
INDUCTORS 249 11.2.1 GEOMETRY OF THE SPIRAL INDUCTOR 249 11.2.2 INDUCTOR
CIRCUIT MODEL 250 11.2.3 CALCULATION OF INDUCTANCE 250 11.2.4 GROUND
PLANE EFFECT ON INDUCTANCE 252 11.2.5 SERIES RESISTANCE 253 11.2.6
PARASITIC CAPACITANCE 254 XM CONTENTS 11.2.7 SUMMARY OF SPIRAL INDUCTOR
MODEL 257 11.2.8 QUALITY FACTOR OF A SPIRAL INDUCTOR 257 11.2.9 INDUCTOR
SYNTHESIS 258 11.2.10 DESIGN AND DE-EMBEDDING OF INDUCTOR TEST STRUCTURE
259 11.2.11 MEASUREMENT SETUP AND CALIBRATION SPECIFICATIONS 261 11.2.12
EXPERIMENTAL VERIFICATION 261 11.2.13 LOW-PASS FILTER 263 11.2.14
EXTENSION OF THE MODEL TO SPIRAL INDUCTORS ON SILICON SUBSTRATES 265
11.3 MODELING OF THIN-FILM RESISTORS 271 11.3.1 STEP DISCONTINUITY IN
MICROSTRIP WIDTH 273 11.3.2 HIGH SHEET RESISTANCE MICROSTRIP MODEL 274
11.3.3 EXPERIMENTAL VERIFICATION 278 11.3.4 S-PARAMETER MEASUREMENT
SETUP 278 11.3.5 MEASUREMENT CALIBRATION 278 11.4 CONCLUSIONS 282
REFERENCES 282 APPENDIX: CHARACTERISTICS OF MICROSCRIPT LINES 284 A. 1
CHARERISTIC IMPEDANCE Z L AND EFFECTIVE DIELECTRIC CONSTANT 234 E EFF
UNDER STATIC TEM APPROXIMATION A.2 DISPERSION MODELS OF EFFECTIVE
DIELECTRIC CONTANT EFF AND 286 CHARACTERISTIC IMPEDANCE Z T A.3
LUMPED-ELEMENT MODEL OF A MICROSTRIP LINE 288 A.4 MICROSTRIP LOSSES 288
12 OTHER APPLICATIONS AND INTEGRATION TECHNOLOGIES 293 ELIZABETH LOGON,
GEERT J. CARCHON, WALTER DE RAEDT, RICHARD R. ULRICH, AND LEONARD W.
SCHAPER 12.1 DEMONSTRATION DEVICES FABRICATED WITH INTEGRATED PASSIVES
294 12.1.1 RC TERMINATORS 294 12.1.2 VOLTAGE DIVIDERS 297 12.1.3
RELIABILITY TEST STRUCTURES 298 12.1.4 FILTERS AND RF DEVICES 299 12.1.5
FUNCTIONAL MODULES AND SUBSYSTEMS 305 12.2 COMMERCIALIZED THIN-FILM
BUILD-UP INTEGRATED PASSIVES 313 12.2.1 CAPACITOR ARRAYS 314 12.2.2
TERMINATION 315 12.2.3 INTARSIA 316 12.2.4 SYCHIP 318 12.2.5 TELEPHUS
320 12.3 OTHER INTEGRATED PASSIVE TECHNOLOGIES 320 12.4 SUMMARY 322
ACKNOWLEDGMENTS 323 REFERENCES 323 CONTENTS XLII 13 THE ECONOMICS OF
EMBEDDED PASSIVES 327 PETER A. SANDBORN 13.1 INTRODUCTION 327 13.2
MODELING EMBEDDED PASSIVE ECONOMICS 329 13.3 KEY ASPECTS OF MODELING
EMBEDDED PASSIVE COSTS 332 13.3.1 BOARD SIZE AND ROUTING CALCULATIONS
332 13.3.2 RECURRING COST ANALYSIS 336 13.3.3 THROUGHPUT 338 13.3.4
TRIMMING EMBEDDED RESISTORS 341 13.3.5 YIELD AND TEST 343 13.3.6 LIFE
CYCLE COSTS 345 13.4 EXAMPLE CASE STUDIES 347 13.4.1 PICOCELL BOARD
APPLICATION 348 13.4.2 NEMI HAND-HELD PRODUCT SECTOR EMULATOR 352 13.4.3
FIBER CHANNEL CARD 354 13.5 SUMMARY 356 ACKNOWLEDGMENTS 357 REFERENCES
357 14 THE FUTURE OF INTEGRATED PASSIVES 361 RICHARD K. ULRICH 14.1
STATUS OF PASSIVE INTEGRATION 361 14.2 ISSUES FOR IMPLEMENTATION ON
ORGANIC SUBSTRATES 362 14.2.1 ELECTRICAL DESIGN ISSUES 362 14.2.2 BOARD
DESIGN ISSUES 363 14.2.3 FABRICATION AND MANUFACTURING ISSUES 364 14.3
PROGRESS ON BOARD-LEVEL IMPLEMENTATION 365 14.3.1 ADVANCED EMBEDDED
PASSIVES TECHNOLOGY 366 CONSORTIUM (AEPT) 14.3.2 NATIONAL ELECTRONICS
MANUFACTURING INITIATIVE (NEMI) 366 14.3.3 THE EMBEDDED CAPACITANCE
PROJECT 367 14.4 THREE WAYS IN FOR ORGANIC BOARDS 367 14.4.1 DECOUPLING
367 14.4.2 REPLACEMENT ON FR4 369 14.4.3 HIGH DENSITY INTERCONNECT 369
14.5 CONCLUSION 369 INDEX 373 ABOUT THE EDITORS |
| any_adam_object | 1 |
| building | Verbundindex |
| bvnumber | BV017061889 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4400 ZN 4900 |
| ctrlnum | (OCoLC)890325294 (DE-599)BVBBV017061889 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nam a2200000 c 4500</leader><controlfield tag="001">BV017061889</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20041126</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">030408s2003 ad|| |||| 00||| eng d</controlfield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">967244285</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0471244317</subfield><subfield code="9">0-471-24431-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)890325294</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV017061889</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield><subfield code="a">DE-29T</subfield><subfield code="a">DE-92</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7874</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">21</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4400</subfield><subfield code="0">(DE-625)157385:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4900</subfield><subfield code="0">(DE-625)157417:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Integrated Passive Component Technology</subfield><subfield code="c">ed. by Richard K Ulrich ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Piscataway, NJ</subfield><subfield code="b">IEEE Press [u.a.]</subfield><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XIX, 379 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Passive components</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Printed circuits</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Passives Bauelement</subfield><subfield code="0">(DE-588)4173496-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Passives Bauelement</subfield><subfield code="0">(DE-588)4173496-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ulrich, Richard K</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Schaper, Leonard W</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">GBV Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010295135&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-010295135</subfield></datafield></record></collection> |
| id | DE-604.BV017061889 |
| illustrated | Illustrated |
| indexdate | 2024-09-06T00:13:30Z |
| institution | BVB |
| isbn | 0471244317 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-010295135 |
| oclc_num | 890325294 |
| open_access_boolean | |
| owner | DE-703 DE-29T DE-92 |
| owner_facet | DE-703 DE-29T DE-92 |
| physical | XIX, 379 S. Ill., graph. Darst. |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | IEEE Press [u.a.] |
| record_format | marc |
| spelling | Integrated Passive Component Technology ed. by Richard K Ulrich ... Piscataway, NJ IEEE Press [u.a.] 2003 XIX, 379 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Integrated circuits Design and construction Passive components Printed circuits Design and construction Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Passives Bauelement (DE-588)4173496-8 gnd rswk-swf Passives Bauelement (DE-588)4173496-8 s Integrierte Schaltung (DE-588)4027242-4 s DE-604 Ulrich, Richard K Sonstige oth Schaper, Leonard W Sonstige oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010295135&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Integrated Passive Component Technology Integrated circuits Design and construction Passive components Printed circuits Design and construction Integrierte Schaltung (DE-588)4027242-4 gnd Passives Bauelement (DE-588)4173496-8 gnd |
| subject_GND | (DE-588)4027242-4 (DE-588)4173496-8 |
| title | Integrated Passive Component Technology |
| title_auth | Integrated Passive Component Technology |
| title_exact_search | Integrated Passive Component Technology |
| title_full | Integrated Passive Component Technology ed. by Richard K Ulrich ... |
| title_fullStr | Integrated Passive Component Technology ed. by Richard K Ulrich ... |
| title_full_unstemmed | Integrated Passive Component Technology ed. by Richard K Ulrich ... |
| title_short | Integrated Passive Component Technology |
| title_sort | integrated passive component technology |
| topic | Integrated circuits Design and construction Passive components Printed circuits Design and construction Integrierte Schaltung (DE-588)4027242-4 gnd Passives Bauelement (DE-588)4173496-8 gnd |
| topic_facet | Integrated circuits Design and construction Passive components Printed circuits Design and construction Integrierte Schaltung Passives Bauelement |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010295135&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT ulrichrichardk integratedpassivecomponenttechnology AT schaperleonardw integratedpassivecomponenttechnology |