Molded interconnect devices: 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany
Saved in:
| Format: | Conference Proceeding Book |
|---|---|
| Language: | English |
| Published: |
Bamberg
Meisenbach
2002
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | 275 S. Ill., graph. Darst. |
| ISBN: | 3875251504 |
Staff View
MARC
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| 245 | 1 | 0 | |a Molded interconnect devices |b 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany |c MID 2002. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
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Record in the Search Index
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|---|---|
| adam_text | Table
of
Contents
Part
1 :
Introduction
Welcome Reception
and Introduction
-
Use
of MID- Potentials by Optimised Product Design and Stable
Manufacturing Processes
K.
Feldmann,
FAPS, University of Erlangen-Nuremberg (D)
Chairman of the Research Association
3-D
MID
e.V.
Keynote Speech:
15
Co-operation Networks
-
Stage for Innovative Products
and Technologies
D.
Harting,
President
/
Partner,
HARTING
KGaA, Espelkamp (D),
President of the ZVEI
Part
2:
Micro Structures
A
3/2
Normally Closed Polymer Piezoelectric
Microvalve
with
23
Integrated MID Electronics
G. Munz,
Festo
AG
&
Co,
Esslingen
(D)
M.
Weinmann,
Festo
AG
&
Co,
Esslingen
(D)
M.
Maichl, Festo AG
&
Co,
Esslingen
(D)
A. Miinzenmaier, Festo AG
&
Co,
Esslingen
(D)
С
Hanisch,
Festo AG
&
Co,
Esslingen
(D)
P. Post,
Festo AG
&
Co,
Esslingen
(D)
H.
Kück, HSG-IMAT, Stuttgart
(D)
W.
Eberhardt, HSG-IMAT, Stuttgart
(D)
С
Pein, HSG-IMAT, Stuttgart
(D)
F. Pöhlau, Oechsler AG, Ansbach (D)
Development
of Integrated Electrical and Mechanical
33
Assemblies Using Two Shot Moulding and Selective
Metallization Technique
K. Murphy, Bourns Electronics Ireland, Cork (IRL)
Part
6:
Bonding on MID
2-
Shot- MIDs with Integrated
Microstructures
for
155
Applications with Wire- Bond- Connections
F. Pöhlau,
Oechsler
AG,
Ansbach (D)
T.
Gerhäußer
University of Stuttgart, IZFM, Stuttgart (D)
W. Eberhardt, HSG-
IMAT,
Stuttgart (D)
Ultrasonic Wire Bonding on Electroless Plated MIDs
163
U.
Scholz,
HSG-
IMAT,
Stuttgart (D)
W. Eberhardt, HSG-
IMAT,
Stuttgart (D)
H.
Kück,
HSG-
IMAT,
Stuttgart (D)
Hybrids on MID for Aircrafts
173
E. Leipe, MIDEE,
Kranzberg
(D)
В.
Rösener, LPKF Laser & Electronics AG, Bad Salzuflen (D)
Laser
Welding of
Micro Parts
on Three
Dimensional
187
Circuit Boards
Α.
Ostendorf, Laserzentrum Hannover, Hannover (D)
С
Kulik,
Laserzentrum Hannover, Hannover (D)
J. Zeadan, Laserzentrum Hannover, Hannover (D)
M. Schmidt, Bayerisches Laserzentrum gGmbH, Erlangen (D)
M.
Horn,
Bayerisches Laserzentrum gGmbH, Erlangen (D)
Part
7:
MID- Manufacturing
Production Processes for MID Prototypes
203
M. Fahrner,
MIDID,
Villingen-Schwenningen (D)
Flexible Printed Cicuits for
3D-
Applications
219
H.
Schenk, Freudenberg Mektec GmbH &
Co KG,
Weilheim (D)
Low Shear In- Mould Decoration- Processes for
225
the Manufacture of
3D-
MIDs
R.
Dörfler, LKT,
University of
Eriangen-Nuremberg, Erlangen (D)
G.
W.
Ehrenstein,
LKT,
University of Eriangen-Nuremberg,
Erlangen
(D)
Part
8:
MID in Telecommunications
Empirical Comparison of Plated vs. Stamped Metal
237
in Miniature Antennas
M. Radanovich, Tyco electronics, Rochester (USA)
RF-MID-Micro Switches for Telecom Applications
245
E. Leipe, MIDEE,
Kranzberg (D)
Adjustment free MID Waveguide for Ka-Band
255
M. Mukuda, Mitsubishi Electric Corp., Hyogo (J)
T. Inuzuka, Mitsubishi Electric Corp., Hyogo (J)
F. Baba,
Mitsubishi Electric Corporation, Kanagawa, (J)
N.
Yoneda, Mitsubishi Electric Corporation, Kanagawa, (J)
K. Yamasaki, Mitsubishi Electric Corporation, Hyogo, (J)
K. Henmi, Mitsubishi Electric Corporation, Hyogo, (J)
H. Asao, Mitsubishi Electric Corporation, Hyogo, (J)
MicroMID™ as High Frequency Contact Solution
265
С
Ernst,
HARTING
Electro- Optics GmbH
&
CO KG, Espelkamp (D)
M.
Hüske,
LPKF Laser
&
Electronics
AG,
Garbsen (D)
|
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| format | Conference Proceeding Book |
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| genre_facet | Konferenzschrift 2002 Erlangen |
| id | DE-604.BV014822832 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:07:38Z |
| institution | BVB |
| institution_GND | (DE-588)10049438-9 |
| isbn | 3875251504 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-010030303 |
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| physical | 275 S. Ill., graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
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| publisher | Meisenbach |
| record_format | marc |
| spelling | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany MID 2002. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... MID 2002 Bamberg Meisenbach 2002 275 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Integriertes Bauelement (DE-588)4161936-5 gnd rswk-swf Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd rswk-swf Spritzgussteil (DE-588)4182581-0 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2002 Erlangen gnd-content Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 s DE-604 Integriertes Bauelement (DE-588)4161936-5 s Spritzgussteil (DE-588)4182581-0 s Feldmann, Klaus Sonstige oth MID 5 2002 Erlangen Sonstige (DE-588)10049438-9 oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010030303&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany Integriertes Bauelement (DE-588)4161936-5 gnd Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd Spritzgussteil (DE-588)4182581-0 gnd |
| subject_GND | (DE-588)4161936-5 (DE-588)4550503-2 (DE-588)4182581-0 (DE-588)1071861417 |
| title | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany |
| title_alt | MID 2002 |
| title_auth | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany |
| title_exact_search | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany |
| title_full | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany MID 2002. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_fullStr | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany MID 2002. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_full_unstemmed | Molded interconnect devices 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany MID 2002. Organized by: Research Association Molded Interconnect Devices 3-D MID e. V. Publ. by: Klaus Feldmann ... |
| title_short | Molded interconnect devices |
| title_sort | molded interconnect devices 5 international congress 25 26 september 2002 erlangen germany |
| title_sub | 5. International Congress ; 25. - 26. September 2002, Erlangen, Germany |
| topic | Integriertes Bauelement (DE-588)4161936-5 gnd Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd Spritzgussteil (DE-588)4182581-0 gnd |
| topic_facet | Integriertes Bauelement Dreidimensionaler spritzgegossener Schaltungsträger Spritzgussteil Konferenzschrift 2002 Erlangen |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010030303&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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