Microelectronic bonding process monitoring by integrated sensors:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Mikrofilm Buch |
| Sprache: | English |
| Veröffentlicht: |
Zürich
Physical Electronics Laboratory, ETH Zürich
2000
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| Ausgabe: | [Mikrofiche-Ausg.] |
| Schlagworte: | |
| Beschreibung: | Zugl.: Zürich, Techn. Hochsch., Diss., 2000. - Mikrofiche-Ausg.: 2 Mikrofiches : 24x |
| Beschreibung: | II, 105 S. Ill., graph. Darst. |
Internformat
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Datensatz im Suchindex
| _version_ | 1804128582576898048 |
|---|---|
| any_adam_object | |
| author | Mayer, Michael |
| author_facet | Mayer, Michael |
| author_role | aut |
| author_sort | Mayer, Michael |
| author_variant | m m mm |
| building | Verbundindex |
| bvnumber | BV013763959 |
| classification_tum | ELT 216d |
| ctrlnum | (OCoLC)635175717 (DE-599)BVBBV013763959 |
| discipline | Elektrotechnik |
| edition | [Mikrofiche-Ausg.] |
| format | Microfilm Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV013763959 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:51:32Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009407633 |
| oclc_num | 635175717 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | II, 105 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | Physical Electronics Laboratory, ETH Zürich |
| record_format | marc |
| spelling | Mayer, Michael Verfasser aut Microelectronic bonding process monitoring by integrated sensors presented by Michael Mayer [Mikrofiche-Ausg.] Zürich Physical Electronics Laboratory, ETH Zürich 2000 II, 105 S. Ill., graph. Darst. txt rdacontent h rdamedia he rdacarrier Zugl.: Zürich, Techn. Hochsch., Diss., 2000. - Mikrofiche-Ausg.: 2 Mikrofiches : 24x Mikroform (DE-588)4039216-8 gnd rswk-swf Prozessüberwachung (DE-588)4133922-8 gnd rswk-swf Integrierter Sensor (DE-588)4235815-2 gnd rswk-swf Echtzeitsystem (DE-588)4131397-5 gnd rswk-swf CMOS (DE-588)4010319-5 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf Chip (DE-588)4197163-2 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Chip (DE-588)4197163-2 s CMOS (DE-588)4010319-5 s Bonden (DE-588)4232594-8 s Prozessüberwachung (DE-588)4133922-8 s Echtzeitsystem (DE-588)4131397-5 s Integrierter Sensor (DE-588)4235815-2 s Mikroform (DE-588)4039216-8 s DE-604 |
| spellingShingle | Mayer, Michael Microelectronic bonding process monitoring by integrated sensors Mikroform (DE-588)4039216-8 gnd Prozessüberwachung (DE-588)4133922-8 gnd Integrierter Sensor (DE-588)4235815-2 gnd Echtzeitsystem (DE-588)4131397-5 gnd CMOS (DE-588)4010319-5 gnd Bonden (DE-588)4232594-8 gnd Chip (DE-588)4197163-2 gnd |
| subject_GND | (DE-588)4039216-8 (DE-588)4133922-8 (DE-588)4235815-2 (DE-588)4131397-5 (DE-588)4010319-5 (DE-588)4232594-8 (DE-588)4197163-2 (DE-588)4113937-9 |
| title | Microelectronic bonding process monitoring by integrated sensors |
| title_auth | Microelectronic bonding process monitoring by integrated sensors |
| title_exact_search | Microelectronic bonding process monitoring by integrated sensors |
| title_full | Microelectronic bonding process monitoring by integrated sensors presented by Michael Mayer |
| title_fullStr | Microelectronic bonding process monitoring by integrated sensors presented by Michael Mayer |
| title_full_unstemmed | Microelectronic bonding process monitoring by integrated sensors presented by Michael Mayer |
| title_short | Microelectronic bonding process monitoring by integrated sensors |
| title_sort | microelectronic bonding process monitoring by integrated sensors |
| topic | Mikroform (DE-588)4039216-8 gnd Prozessüberwachung (DE-588)4133922-8 gnd Integrierter Sensor (DE-588)4235815-2 gnd Echtzeitsystem (DE-588)4131397-5 gnd CMOS (DE-588)4010319-5 gnd Bonden (DE-588)4232594-8 gnd Chip (DE-588)4197163-2 gnd |
| topic_facet | Mikroform Prozessüberwachung Integrierter Sensor Echtzeitsystem CMOS Bonden Chip Hochschulschrift |
| work_keys_str_mv | AT mayermichael microelectronicbondingprocessmonitoringbyintegratedsensors |