Microsystem technology:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Weinheim [u.a.]
Wiley-VCH
2001
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XII, 500 S. Ill., graph. Darst. |
| ISBN: | 3527296344 |
Internformat
MARC
| LEADER | 00000nam a22000008c 4500 | ||
|---|---|---|---|
| 001 | BV013499621 | ||
| 003 | DE-604 | ||
| 005 | 20050707 | ||
| 007 | t | ||
| 008 | 001212s2001 gw ad|| |||| 00||| eng d | ||
| 016 | 7 | |a 960248749 |2 DE-101 | |
| 020 | |a 3527296344 |9 3-527-29634-4 | ||
| 035 | |a (OCoLC)632860410 | ||
| 035 | |a (DE-599)BVBBV013499621 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 044 | |a gw |c DE | ||
| 049 | |a DE-573 |a DE-91G |a DE-92 |a DE-703 |a DE-898 |a DE-1043 |a DE-M347 |a DE-522 |a DE-523 |a DE-526 | ||
| 082 | 0 | |a 621.381 |2 21 | |
| 082 | 0 | |a 620.0011 |2 21 | |
| 084 | |a ZN 3750 |0 (DE-625)157334: |2 rvk | ||
| 084 | |a ZN 4980 |0 (DE-625)157428: |2 rvk | ||
| 084 | |a ZS 4000 |0 (DE-625)158249: |2 rvk | ||
| 084 | |a TEC 025f |2 stub | ||
| 084 | |a ELT 270f |2 stub | ||
| 100 | 1 | |a Menz, Wolfgang |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Microsystem technology |c W. Menz, J. Mohr, O. Paul |
| 264 | 1 | |a Weinheim [u.a.] |b Wiley-VCH |c 2001 | |
| 300 | |a XII, 500 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Ingenieurwissenschaften | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Technology | |
| 650 | 0 | 7 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Systemtechnik |0 (DE-588)4140901-2 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |D s |
| 689 | 0 | 1 | |a Systemtechnik |0 (DE-588)4140901-2 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Mohr, Jürgen |e Verfasser |4 aut | |
| 700 | 1 | |a Paul, Oliver |e Verfasser |4 aut | |
| 856 | 4 | 2 | |m DNB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009214844&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-009214844 | |
Datensatz im Suchindex
| _version_ | 1807772632550998016 |
|---|---|
| adam_text |
CONTENT
1
GENERAL
INTRODUCTION
TO
MICROSTRUCTURE
TECHNOLOGY
.
1
1.1
WHAT
IS
MICROSTRUCTURE
TECHNOLOGY?
.
1
1.2
FROM
MICROSTRUCTURE
TECHNOLOGY
TO
MICROSYSTEMS
TECHNOLOGY
.
9
2
THE
PARALLELS
TO
MICROELECTRONICS
.
15
2.1
THE
PRODUCTION
OF
SINGLE
CRYSTAL
WAFERS
.
15
2.1.1
PRODUCTION
OF
SILICON-SINGLE
CRYSTALS
.
17
2.1.2
PRODUCTION
OF
GAAS
SINGLE
CRYSTALS
.
24
2.2
BASIC
TECHNICAL
PROCESSES
.
26
2.2.1
FILM
DEPOSITION
.
27
2.2.2
LITHOGRAPHY
(FILM
PATTERNING)
.
30
2.2.3
SURFACE
MODIFICATION
.
31
2.2.4
ETCHING
(FILM
REMOVAL)
.
35
2.3
PACKAGING
TECHNOLOGY
.
36
2.3.1
REQUIREMENTS
FOR
PACKAGING
TECHNOLOGY
.
36
2.3.2
HYBRID
TECHNOLOGY
.
37
2.4
CLEAN
ROOM
TECHNIQUES
.
39
3
THE
PHYSICAL
AND
CHEMICAL
BASICS
IN
MICROTECHNOLOGY
.
45
3.1
CRYSTALS
AND
CRYSTALLOGRAPHY
.
45
3.1.1
LATTICE
AND
TYPES
OF
LATTICES
.
46
3.1.2
STEREOGRAPHIC
PROJECTION
.
48
3.1.3
THE
SILICON
SINGLE
CRYSTAL
.
53
3.1.4
RECIPROCAL
LATTICE
AND
THE
ANALYSIS
OF
THE
CRYSTAL
STRUCTURE
.
55
3.2
METHODS
TO
DETERMINE
THE
CRYSTALLINE
STRUCTURE
.
62
3.2.1
X-RAY
DIFFRACTION
.
62
3.2.2
ELECTRON
BEAM
DIFFRACTION
.
64
3.3
BASIC
CONCEPTS
OF
ELECTROPLATING
.
66
3.3.1
THE
ELECTRODE-ELECTROLYTE
INTERFACE
.
69
3.3.2
POLARIZATION
AND
OVERPOTENTIAL
.
73
3.3.3
MECHANISMS
OF
CATHODIC
METAL
DEPOSITION
.
74
3.4
MATERIALS
OF
MICROSYSTEMS
TECHNOLOGY
.
81
VIII
CONTENT
4
BASIC
TECHNOLOGIES
IN
MEMS
.
109
4.1
BASIC
PRINCIPLES
OF
VACUUM
TECHNOLOGY
.
109
4.1.1
THE
MEAN
FREE
PATH
.
110
4.1.2
THE
MONOLAYER
TIME
.
112
4.1.3
VELOCITY
OF
ATOMS
AND
MOLECULES
.
114
4.1.4
GAS
DYNAMICS
.
115
4.1.5
THE
CLASSIFICATION
OF
TECHNICAL
VACUUMS
.
116
4.2
VACUUM
PRODUCTION
.
117
4.2.1
PUMPS
FOR
ROUGH-AND
FINE
VACUUMS
.
118
4.2.2
HIGH
VACUUM-AND
ULTRAHIGH
VACUUM
PUMPS
.
119
4.3
VACUUM
MEASUREMENT
.
125
4.3.1
PRESSURE
TRANSDUCER
.
125
4.3.2
THERMAL
CONDUCTIVITY
VACUUM
GAUGE
.
126
4.3.3
FRICTION
TYPE
VACUUM
GAUGE
.
126
4.3.4
THERMIONIC
IONIZATION
VACUUM
GAUGE
.
127
4.3.5
COLD
CATHODE
IONIZATION
GAUGE
(PENNING
PRINCIPLE)
.
127
4.3.6
LEAKAGE
AND
LEAK
DETECTION
.
128
4.4
PROPERTIES
OF
THIN
FILMS
.
129
4.4.1
STRUCTURE
ZONE
MODEL
.
129
4.4.2
ADHESIVE
STRENGTH
OF
THE
LAYER
.
132
4.5
PHYSICAL
AND
CHEMICAL
COATING
TECHNIQUES
.
133
4.5.1
EVAPORATION
.
133
4.5.2
SPUTTERING
.
135
4.5.3
ION
PLATING
OR
PLASMA
ASSISTED
DEPOSITION
.
139
4.5.4
ION
CLUSTER
BEAM
TECHNOLOGY
.
140
4.5.5
CVD
PROCESSES
.
143
4.5.6
EPITAXY
.
146
4.5.7
PLASMA
POLYMERIZATION
.
148
4.5.8
OXIDATION
.
148
4.6
STRUCTURING
OF
THIN
FILMS
WITH
DRY
ETCH
PROCESSES
.
151
4.6.1
PHYSICAL
ETCH
TECHNOLOGIES
.
155
4.6.2
COMBINED
PHYSICAL
AND
CHEMICAL
ETCH
TECHNOLOGIES
.
158
4.6.3
CHEMICAL
ETCHING
TECHNOLOGIES
.
162
4.7
ANALYSIS
OF
THIN
FILMS
AND
SURFACES
.
164
4.7.1
ELECTRON
PROBE
MICROANALYSIS
(EPM)
.
165
4.7.2
AUGER
ELECTRON
SPECTROSCOPY
(AES)
.
166
4.7.3
X-RAY
PHOTOELECTRON
SPECTROSCOPY
(XPS)
.
168
4.7.4
SECONDARY
ION
MASS
SPECTROSCOPY
(SIMS)
.
168
4.7.5
SECONDARY
NEUTRAL
PARTICLE
MASS
SPECTROSCOPY
(SNMS)
.
169
4.7.6
ION
SCATTERING
SPECTROSCOPY
(ISS)
.
169
4.7.7
RUTHERFORD
BACK
SCATTERING
SPECTROSCOPY
(RBS)
.
169
4.7.8
SCANNING
TUNNELING
MICROSCOPE
.
170
CONTENT
IX
5
LITHOGRAPHY
.
171
5.1
OVERVIEW
AND
HISTORY
.
171
5.2
RESISTS
.
171
5.3
PROCESS
OF
LITHOGRAPHY
.
175
5.4
COMPUTER
AIDED
DESIGN
(CAD)
.
176
5.4.1
CAD-LAY
OUT
.
177
5.4.2
ALIGNMENT
PATTERNS
AND
TEST
STRUCTURES
.
178
5.4.3
ORGANIZATION
OF
THE
DESIGN
(HIERARCHY,
LAYERS)
.
181
5.5
ELECTRON
BEAM
LITHOGRAPHY
.
182
5.5.1
GAUSSIAN
BEAMS
.
182
5.5.2
WRITE
STRATEGY
WITH
GAUSSIAN
BEAMS
.
185
5.5.3
SHAPED
BEAMS
.
187
5.5.4
POST
PROCESSOR
.
189
5.5.5
PROXIMITY
EFFECT
.
190
5.6
OPTICAL
LITHOGRAPHY
.
192
5.6.1
MASKS
.
193
5.6.2
SHADOW
PROJECTION
.
194
5.6.3
IMAGING
PROJECTION
.
196
5.6.4
FURTHER
DEVELOPMENTS
.
198
5.6.5
OPTICAL
LITHOGRAPHY
FOR
MICROMECHANICS
.
200
5.7
ION
BEAM
LITHOGRAPHY
.
202
5.8
X-RAY
LITHOGRAPHY
.
202
5.8.1
MASKS
.
203
5.8.2
X-RAY
SOURCES
.
204
5.8.3
SYNCHROTRON
RADIATION
.
204
5.8.4
APPLICATION
OF
X-RAY
LITHOGRAPHY
.
208
6
SILICON
MICROSYSTEM
TECHNOLOGY
.
209
6.1
SILICON
TECHNOLOGY
.
210
6.1.1
IC
PROCESSES
AND
SUBSTRATES
.
210
6.1.2
FOUNDRY
TECHNOLOGIES
.
214
6.2
SILICON
MICROMACHINING
.
215
6.2.1
INTRODUCTION
.
215
6.2.2
WET
ETCHING
.
220
6.2.3
BASIC
ETCH
SHAPES
.
227
6.2.4
ETCHING
CONTROL
.
234
6.2.5
CHARACTERIZATION
OF
ANISOTROPIC
WET
ETCHANTS
.
239
6.2.6
DRY
ETCHING
.
241
6.3
SURFACE
MICROMACHINING
.
248
6.3.1
POLYSILICON
MICROMACHINING
.
250
6.3.2
SACRIFICIAL
ALUMINUM
MICROMACHINING
.
253
6.3.3
SACRIFICIAL
POLYMER
MICROMACHINING
.
254
6.3.4
STICTION
.
255
6.4
MICRO
TRANSDUCERS
AND
SYSTEMS
BASED
ON
SILICON
TECHNOLOGY
.
.
257
6.4.1
MECHANICAL
DEVICES
AND
SYSTEMS
.
257
6.4.2
THERMAL
MICRO
DEVICES
AND
SYSTEMS
.
263
X
CONTENT
6.4.3
DEVICES
AND
SYSTEMS
FOR
RADIANT
SIGNALS
.
273
6.4.4
MAGNETIC
DEVICES
AND
SYSTEMS
.
278
6.4.5
CHEMICAL
MICROSENSORS
.
280
6.4.6
MICROMACHINED
DEVICES
FOR
ELECTRICAL
SIGNAL
PROCESSING
.
285
6.5
SUMMARY
AND
OUTLOOK
.
287
7
THE
LIGA
PROCESS
.
289
7.1
OVERVIEW
.
289
7.2
MASK
PRODUCTION
.
291
7.2.1
THE
PRINCIPLE
CONSTRUCTION
OF
A
MASK
.
291
7.2.2
PRODUCTION
OF
THE
CARRIER
FOIL
.
294
7.2.3
STRUCTURING
OF
THE
RESIST
FOR
X-RAY
INTERMEDIATE
MASKS
.
295
7.2.4
ELECTROPLATING
WITH
GOLD
FOR
X-RAY
MASKS
.
298
7.2.5
PRODUCTION
OF
PROCESS
MASKS
.
299
7.2.6
WINDOW
FOR
ALIGNMENT
IN
X-RAY
PROCESS
MASKS
.
301
7.3
X-RAY
LITHOGRAPHY
.
301
7.3.1
PRODUCTION
OF
THICK
RESIST
LAYERS
.
302
7.3.2
BEAM
INDUCED
REACTIONS
AND
DEVELOPMENT
OF
RESISTS
.
303
7.3.3
REQUIREMENTS
ON
THE
ABSORBED
RADIATION
DOSAGE
.
306
7.3.4
INFLUENCES
ON
THE
QUALITY
OF
THE
STRUCTURE
.
310
7.4
GALVANIC
DEPOSITION
.
316
7.4.1
GALVANIC
DEPOSITION
OF
NICKEL
FOR
THE
PRODUCTION
OF
MICROSTRUCTURES
.
316
7.4.2
MOLD
INSERT
FABRICATION
.
321
7.4.3
ELECTRODEPOSITION
OF
FURTHER
METALS
AND
ALLOYS
.
322
7.5
PLASTIC
MOLDING
IN
THE
LIGA
PROCESS
.
324
7.5.1
PRODUCTION
OF
MICROSTRUCTURES
BY
REACTION
INJECTION
MOLDING
.
.
324
7.5.2
FABRICATION
OF
MICROSTRUCTURES
BY
INJECTION
MOLDING
.
327
7.5.3
FABRICATION
OF
MICROSTRUCTURES
BY
HOT
EMBOSSING
.
333
7.5.4
PRODUCTION
OF
METALLIC
MICROSTRUCTURES
FROM
MOLDED
PLASTIC
STRUCTURES
(SECOND
ELECTROPLATING)
.
337
7.6
VARIATIONS
AND
ADDITIONAL
STEPS
OF
THE
LIGA
TECHNOLOGY
.
341
7.6.1
SACRIFICIAL
LAYER
TECHNOLOGY
.
341
7.6.2
3D-STRUCTURING
.
344
7.6.3
PRODUCTION
OF
LIGHT-CONDUCTING
STRUCTURES
BY
MOLDING
.
347
7.7
EXAMPLES
OF
APPLICATIONS
.
349
7.7.1
RIGID
METALLIC
MICROSTRUCTURES
.
349
7.7.2
MOVING
MICROSTRUCTURES,
MICROSENSORS
AND
MICROACTUATORS
.
.
.
353
7.7.3
FLUIDIC
MICROSTRUCTURES
.
366
7.7.4
LIGA-STRUCTURES
FOR
OPTICAL
USES
.
368
CONTENT
XI
8
ALTERNATIVE
PROCESSES
OF
MICROSTRUCTURING
.
381
8.1
MECHANICAL
MICROMANUFACTURING
.
381
8.1.1
PRODUCTION
PROCESS
AND
PRIMARY
STRUCTURES
.
382
8.1.2
EXAMPLES
OF
APPLICATIONS
.
386
8.2
ELECTRO-DISCHARGE
MACHINING
.
394
8.2.1
THE
BASICS
OF
EDM
.
394
8.2.2
APPLICATIONS
OF
EDM
FOR
MICROSYSTEMS
.
397
8.3
LASER
MICROMACHINING
.
399
9
PACKAGING
AND
INTERCONNECTING
TECHNIQUES
(PIT)
.
403
9.1
HYBRID
TECHNOLOGY
.
404
9.1.1
SUBSTRATES
AND
PASTES
.
404
9.1.2
LAYER
PRODUCTION
.
407
9.1.3
PLACEMENT
AND
SOLDERING
OF
THE
CIRCUIT
COMPONENTS
.
408
9.1.4
MOUNTING
AND
CONTACTING
OF
SILICON
DIES
.
412
9.2
WIRE-BONDING
TECHNIQUES
.
413
9.2.1
THERMOCOMPRESSION
WIRE-BONDING
(HOT-PRESSURE
WELDING
BONDING)
.
413
9.2.2
ULTRASONIC
WIRE-BONDING
(ULTRASONIC
BONDING)
.
414
9.2.3
THERMOSONIC
WIRE-BONDING
(ULTRASONIC
HOT-PRESSURE
WELDING)
.
414
9.2.4
BALL-WEDGE
BONDING
.
415
9.2.5
WEDGE-WEDGE
BONDING
.
416
9.2.6
ADVANTAGES
AND
DISADVANTAGES
OF
THE
WIRE-BOND
PROCESSES
.
.
.
417
9.2.7
TEST
PROCESSES
AND
ALTERNATIVES
.
417
9.3
NEW
CONTACTING
TECHNOLOGIES
.
418
9.3.1
THE
TAB
TECHNOLOGY
.
418
9.3.2
THE
FLIP-CHIP
TECHNOLOGIES
.
420
9.4
ADHESION
.
422
9.4.1
ISOTROPIC
ADHESION
.
422
9.4.2
ANISOTROPIC
ADHESION
.
424
9.5
ANODIC
BONDING
.
425
9.5.1
WAFER-TO-GLASS
BONDING
.
425
9.5.2
WAFER-TO-WAFER
BONDING
.
427
9.6
NEW
PACKAGING
TECHNOLOGIES
.
428
9.6.1
LOW
TEMPERATURE
COFIRED
CERAMICS
(LTCC)
.
428
XII
CONTENT
10
SYSTEM
TECHNOLOGY
.
431
10.1
DEFINITION
OF
A
MICROSYSTEM
.
431
10.2
SENSORS
.
433
10.3
ACTUATORS
.
438
10.4
SIGNAL
PROCESSING
.
439
10.4.1
SIGNAL
PROCESSING
FOR
SENSORS
IN
MICROSYSTEMS
.
440
10.4.2
NEURAL
DATA
PROCESSING
FOR
SENSOR
ARRAYS
.
444
10.5
INTERFACES
OF
MICROSYSTEMS
.
449
10.5.1
THE
LE-TRANSFER
.
452
10.5.2
THE
S-TRANSFER
.
455
10.6
THE
MODULE
CONCEPT
OF
MICROSYSTEM
TECHNOLOGY
.
456
10.7
DESIGN,
SIMULATION,
INTEGRATION,
AND
TEST
OF
MICROSYSTEMS
.
461
LITERATUR
.
465 |
| any_adam_object | 1 |
| author | Menz, Wolfgang Mohr, Jürgen Paul, Oliver |
| author_facet | Menz, Wolfgang Mohr, Jürgen Paul, Oliver |
| author_role | aut aut aut |
| author_sort | Menz, Wolfgang |
| author_variant | w m wm j m jm o p op |
| building | Verbundindex |
| bvnumber | BV013499621 |
| classification_rvk | ZN 3750 ZN 4980 ZS 4000 |
| classification_tum | TEC 025f ELT 270f |
| ctrlnum | (OCoLC)632860410 (DE-599)BVBBV013499621 |
| dewey-full | 621.381 620.0011 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics 620 - Engineering and allied operations |
| dewey-raw | 621.381 620.0011 |
| dewey-search | 621.381 620.0011 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Handwerk und Gewerbe / Verschiedene Technologien Technik Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV013499621 |
| illustrated | Illustrated |
| indexdate | 2024-08-19T00:12:09Z |
| institution | BVB |
| isbn | 3527296344 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009214844 |
| oclc_num | 632860410 |
| open_access_boolean | |
| owner | DE-573 DE-91G DE-BY-TUM DE-92 DE-703 DE-898 DE-BY-UBR DE-1043 DE-M347 DE-522 DE-523 DE-526 |
| owner_facet | DE-573 DE-91G DE-BY-TUM DE-92 DE-703 DE-898 DE-BY-UBR DE-1043 DE-M347 DE-522 DE-523 DE-526 |
| physical | XII, 500 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Menz, Wolfgang Verfasser aut Microsystem technology W. Menz, J. Mohr, O. Paul Weinheim [u.a.] Wiley-VCH 2001 XII, 500 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Ingenieurwissenschaften Engineering Nanotechnology Technology Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Systemtechnik (DE-588)4140901-2 gnd rswk-swf Mikrosystemtechnik (DE-588)4221617-5 s Systemtechnik (DE-588)4140901-2 s 1\p DE-604 Mohr, Jürgen Verfasser aut Paul, Oliver Verfasser aut DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009214844&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Menz, Wolfgang Mohr, Jürgen Paul, Oliver Microsystem technology Ingenieurwissenschaften Engineering Nanotechnology Technology Mikrosystemtechnik (DE-588)4221617-5 gnd Systemtechnik (DE-588)4140901-2 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4140901-2 |
| title | Microsystem technology |
| title_auth | Microsystem technology |
| title_exact_search | Microsystem technology |
| title_full | Microsystem technology W. Menz, J. Mohr, O. Paul |
| title_fullStr | Microsystem technology W. Menz, J. Mohr, O. Paul |
| title_full_unstemmed | Microsystem technology W. Menz, J. Mohr, O. Paul |
| title_short | Microsystem technology |
| title_sort | microsystem technology |
| topic | Ingenieurwissenschaften Engineering Nanotechnology Technology Mikrosystemtechnik (DE-588)4221617-5 gnd Systemtechnik (DE-588)4140901-2 gnd |
| topic_facet | Ingenieurwissenschaften Engineering Nanotechnology Technology Mikrosystemtechnik Systemtechnik |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009214844&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT menzwolfgang microsystemtechnology AT mohrjurgen microsystemtechnology AT pauloliver microsystemtechnology |