Thermo-mechanical characterization of evolving packaging materials and structures: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California
Gespeichert in:
| Format: | Tagungsbericht Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York, N.Y.
American Soc. of Mechanical Engineers
1998
|
| Schriftenreihe: | EEP / Electrical and Electronic Packaging Division, ASME
24 |
| Schlagworte: | |
| Beschreibung: | V, 141 S. Ill., graph. Darst. |
| ISBN: | 0791815919 |
Internformat
MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV013241271 | ||
| 003 | DE-604 | ||
| 005 | 20011023 | ||
| 007 | t | ||
| 008 | 000710s1998 ad|| |||| 00||| eng d | ||
| 020 | |a 0791815919 |9 0-7918-1591-9 | ||
| 035 | |a (OCoLC)40617398 | ||
| 035 | |a (DE-599)BVBBV013241271 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 | ||
| 050 | 0 | |a TK7870.15 | |
| 082 | 0 | |a 621.381/046 |2 21 | |
| 084 | |a ZN 1700 |0 (DE-625)157243: |2 rvk | ||
| 245 | 1 | 0 | |a Thermo-mechanical characterization of evolving packaging materials and structures |b presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California |c ed. by Sheng Liu ... |
| 264 | 1 | |a New York, N.Y. |b American Soc. of Mechanical Engineers |c 1998 | |
| 300 | |a V, 141 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a EEP / Electrical and Electronic Packaging Division, ASME |v 24 | |
| 650 | 4 | |a Deformations (Mechanics) |v Congresses | |
| 650 | 4 | |a Electronic packaging |x Materials |x Fatigue |v Congresses | |
| 650 | 4 | |a Electronic packaging |x Testing |v Congresses | |
| 650 | 4 | |a Thermal stresses |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 700 | 1 | |a Liu, Sheng |e Sonstige |4 oth | |
| 711 | 2 | |a International Mechanical Engineering Congress and Exposition |d 1998 |c Anaheim, Calif. |j Sonstige |0 (DE-588)5330437-8 |4 oth | |
| 810 | 2 | |a Electrical and Electronic Packaging Division, ASME |t EEP |v 24 |w (DE-604)BV012594760 |9 24 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-009023798 | ||
Datensatz im Suchindex
| _version_ | 1804128001676279808 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV013241271 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 1700 |
| ctrlnum | (OCoLC)40617398 (DE-599)BVBBV013241271 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01626nam a2200385 cb4500</leader><controlfield tag="001">BV013241271</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20011023 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">000710s1998 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0791815919</subfield><subfield code="9">0-7918-1591-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)40617398</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV013241271</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7870.15</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">21</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 1700</subfield><subfield code="0">(DE-625)157243:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Thermo-mechanical characterization of evolving packaging materials and structures</subfield><subfield code="b">presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California</subfield><subfield code="c">ed. by Sheng Liu ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New York, N.Y.</subfield><subfield code="b">American Soc. of Mechanical Engineers</subfield><subfield code="c">1998</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">V, 141 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">EEP / Electrical and Electronic Packaging Division, ASME</subfield><subfield code="v">24</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Deformations (Mechanics)</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="x">Materials</subfield><subfield code="x">Fatigue</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="x">Testing</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal stresses</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Liu, Sheng</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="711" ind1="2" ind2=" "><subfield code="a">International Mechanical Engineering Congress and Exposition</subfield><subfield code="d">1998</subfield><subfield code="c">Anaheim, Calif.</subfield><subfield code="j">Sonstige</subfield><subfield code="0">(DE-588)5330437-8</subfield><subfield code="4">oth</subfield></datafield><datafield tag="810" ind1="2" ind2=" "><subfield code="a">Electrical and Electronic Packaging Division, ASME</subfield><subfield code="t">EEP</subfield><subfield code="v">24</subfield><subfield code="w">(DE-604)BV012594760</subfield><subfield code="9">24</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-009023798</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV013241271 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:42:18Z |
| institution | BVB |
| institution_GND | (DE-588)5330437-8 |
| isbn | 0791815919 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009023798 |
| oclc_num | 40617398 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | V, 141 S. Ill., graph. Darst. |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | American Soc. of Mechanical Engineers |
| record_format | marc |
| series2 | EEP / Electrical and Electronic Packaging Division, ASME |
| spelling | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California ed. by Sheng Liu ... New York, N.Y. American Soc. of Mechanical Engineers 1998 V, 141 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier EEP / Electrical and Electronic Packaging Division, ASME 24 Deformations (Mechanics) Congresses Electronic packaging Materials Fatigue Congresses Electronic packaging Testing Congresses Thermal stresses Congresses (DE-588)1071861417 Konferenzschrift gnd-content Liu, Sheng Sonstige oth International Mechanical Engineering Congress and Exposition 1998 Anaheim, Calif. Sonstige (DE-588)5330437-8 oth Electrical and Electronic Packaging Division, ASME EEP 24 (DE-604)BV012594760 24 |
| spellingShingle | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California Deformations (Mechanics) Congresses Electronic packaging Materials Fatigue Congresses Electronic packaging Testing Congresses Thermal stresses Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California |
| title_auth | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California |
| title_exact_search | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California |
| title_full | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California ed. by Sheng Liu ... |
| title_fullStr | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California ed. by Sheng Liu ... |
| title_full_unstemmed | Thermo-mechanical characterization of evolving packaging materials and structures presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California ed. by Sheng Liu ... |
| title_short | Thermo-mechanical characterization of evolving packaging materials and structures |
| title_sort | thermo mechanical characterization of evolving packaging materials and structures presented at the 1998 asme international mechanical engineering congress and exposition november 15 20 1998 anaheim california |
| title_sub | presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15 - 20, 1998, Anaheim, California |
| topic | Deformations (Mechanics) Congresses Electronic packaging Materials Fatigue Congresses Electronic packaging Testing Congresses Thermal stresses Congresses |
| topic_facet | Deformations (Mechanics) Congresses Electronic packaging Materials Fatigue Congresses Electronic packaging Testing Congresses Thermal stresses Congresses Konferenzschrift |
| volume_link | (DE-604)BV012594760 |
| work_keys_str_mv | AT liusheng thermomechanicalcharacterizationofevolvingpackagingmaterialsandstructurespresentedatthe1998asmeinternationalmechanicalengineeringcongressandexpositionnovember15201998anaheimcalifornia AT internationalmechanicalengineeringcongressandexpositionanaheimcalif thermomechanicalcharacterizationofevolvingpackagingmaterialsandstructurespresentedatthe1998asmeinternationalmechanicalengineeringcongressandexpositionnovember15201998anaheimcalifornia |