Reliability, yield, and stress burn-in: a unified approach for microelectronics systems manufacturing & software development
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Boston [u.a.]
Kluwer
1998
|
| Subjects: | |
| Physical Description: | XXVI, 394 S. graph. Darst. |
| ISBN: | 0792381076 |
Staff View
MARC
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Record in the Search Index
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| author | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho |
| author_facet | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho |
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| author_sort | Kuo, Way |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)37878683 (DE-599)BVBBV013150024 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV013150024 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:39:53Z |
| institution | BVB |
| isbn | 0792381076 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008959184 |
| oclc_num | 37878683 |
| open_access_boolean | |
| owner | DE-634 |
| owner_facet | DE-634 |
| physical | XXVI, 394 S. graph. Darst. |
| publishDate | 1998 |
| publishDateSearch | 1998 |
| publishDateSort | 1998 |
| publisher | Kluwer |
| record_format | marc |
| spelling | Kuo, Way Verfasser aut Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim Boston [u.a.] Kluwer 1998 XXVI, 394 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Zuverlässigkeit (DE-588)4059245-5 s DE-604 Chien, Wei-Ting Kary Verfasser aut Kim, Taeho Verfasser aut |
| spellingShingle | Kuo, Way Chien, Wei-Ting Kary Kim, Taeho Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4059245-5 |
| title | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_auth | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_exact_search | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development |
| title_full | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_fullStr | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_full_unstemmed | Reliability, yield, and stress burn-in a unified approach for microelectronics systems manufacturing & software development by Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
| title_short | Reliability, yield, and stress burn-in |
| title_sort | reliability yield and stress burn in a unified approach for microelectronics systems manufacturing software development |
| title_sub | a unified approach for microelectronics systems manufacturing & software development |
| topic | Circuits intégrés - Développement - Fiabilité ram Logiciels - Développement - Fiabilité ram Microélectronique - Fiabilité ram Semiconducteurs - Logiciels - Fiabilité ram Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement (DE-588)4014360-0 gnd Zuverlässigkeit (DE-588)4059245-5 gnd |
| topic_facet | Circuits intégrés - Développement - Fiabilité Logiciels - Développement - Fiabilité Microélectronique - Fiabilité Semiconducteurs - Logiciels - Fiabilité Computer software Development Reliability Integrated circuits Design and construction Reliability Microelectronics Reliability Semiconductors Computer programs Reliability Elektronisches Bauelement Zuverlässigkeit |
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