Application of fracture mechanics in electronic packaging: presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas
Saved in:
| Format: | Conference Proceeding Book |
|---|---|
| Language: | English |
| Published: |
New York, N.Y.
American Soc. of Mechanical Engineers
1997
|
| Series: | American Society of Mechanical Engineers / Applied Mechanics Division: AMD
222 American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP 20 |
| Subjects: | |
| Physical Description: | VI, 193 S. Ill., graph. Darst. |
| ISBN: | 0791818276 |
Staff View
MARC
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Record in the Search Index
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| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
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| genre_facet | Konferenzschrift |
| id | DE-604.BV012786313 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:33:39Z |
| institution | BVB |
| institution_GND | (DE-588)5277575-6 |
| isbn | 0791818276 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008696208 |
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| physical | VI, 193 S. Ill., graph. Darst. |
| publishDate | 1997 |
| publishDateSearch | 1997 |
| publishDateSort | 1997 |
| publisher | American Soc. of Mechanical Engineers |
| record_format | marc |
| series2 | American Society of Mechanical Engineers / Applied Mechanics Division: AMD American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP |
| spelling | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by William T. Chen ... New York, N.Y. American Soc. of Mechanical Engineers 1997 VI, 193 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier American Society of Mechanical Engineers / Applied Mechanics Division: AMD 222 American Society of Mechanical Engineers / Electrical and Electronic Packaging Division: EEP 20 Electronic packaging Materials Fracture Congresses Fracture mechanics Congresses Multichip modules (Microelectronics) Materials Fracture Congresses (DE-588)1071861417 Konferenzschrift gnd-content Chen, William T. Sonstige oth International Mechanical Engineering Congress and Exposition 1997 Dallas, Tex. Sonstige (DE-588)5277575-6 oth Applied Mechanics Division: AMD American Society of Mechanical Engineers 222 (DE-604)BV001894732 222 Electrical and Electronic Packaging Division: EEP American Society of Mechanical Engineers 20 (DE-604)BV012594760 20 |
| spellingShingle | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas Electronic packaging Materials Fracture Congresses Fracture mechanics Congresses Multichip modules (Microelectronics) Materials Fracture Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_auth | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_exact_search | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| title_full | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by William T. Chen ... |
| title_fullStr | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by William T. Chen ... |
| title_full_unstemmed | Application of fracture mechanics in electronic packaging presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas ed. by William T. Chen ... |
| title_short | Application of fracture mechanics in electronic packaging |
| title_sort | application of fracture mechanics in electronic packaging presented at the 1997 asme international mechanical engineering congress and exposition november 16 21 1997 dallas texas |
| title_sub | presented at The 1997 ASME International Mechanical Engineering Congress and Exposition, November 16 - 21, 1997, Dallas, Texas |
| topic | Electronic packaging Materials Fracture Congresses Fracture mechanics Congresses Multichip modules (Microelectronics) Materials Fracture Congresses |
| topic_facet | Electronic packaging Materials Fracture Congresses Fracture mechanics Congresses Multichip modules (Microelectronics) Materials Fracture Congresses Konferenzschrift |
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