Proceedings: April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado
Saved in:
| Corporate Author: | |
|---|---|
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Piscataway, NJ
IEEE Service Center
1997
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | X, 379 S. Ill., graph. Darst. |
| ISBN: | 0780337875 0780337891 |
Staff View
MARC
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| 245 | 1 | 0 | |a Proceedings |b April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado |c 1997 International Conference on Multichip Modules |
| 264 | 1 | |a Piscataway, NJ |b IEEE Service Center |c 1997 | |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-008133145 | ||
Record in the Search Index
| _version_ | 1804126614608412672 |
|---|---|
| adam_text | Table of Contents
Session WAI
Markets
&
Infrastructure
Session Chairs:
Rick Reid, Amkor Electronics; Howard Green, MicroModide Systems
001
007
Oil
014
019
025
029
035
Innovation Problems in
MCM
Technology
Richard Duffy and Maurice Sage,
ВРА,
Ltd.
Benchmark Market Pricing for Single and Multichip
Substrates
Mark V. Christensen,
Prismark
Partners LCC
MCMs: Niche Market or Mainstream Product?
E. Jan Vardaman, TechSearch International Inc.
Europractice-MCM: A European Initiative to
Create a MCM Infrastructure and to Stimulate
Commercial MCM Take-up
Rory Doyle, National Microelectronics Research Center; Hans
Hentzell,
ШС
A Process to Improve Capability in North American
Electronics Manufacturing
Ron Gedney and Jim McElroy,
NEMI
Trends in Flip Chip and Advanced Interconnection
David H. Francis, International
Interconnection Intelligence
043
A Discussion of a GaAs MCM Fabricated at
MicroModule Systems Through the Multichip Module
Designers Access Service (MIDAS)
Jennifer Peltier and Wes
Hansford,
Information
Sciences
Institute; Claude
Gauthier,
Ronald Lomax, Mini Nanua,
Phiroze Parakh and Sean Stetson, University of Michigan
048
053
A Novel Thick Film on Ceramic MCM Technology
Offering MCM-D Performance
Peter G. Barnwell and Jim Wood, Heraeus Inc., Cermalloy
Division
MCM-C Cost Comparison: Fodel® vs. Diffusion
Patterning™ vs. GreenTape™
Jay Page,
D.I.
Amey, R. Draudt, M.
Inman
and S.J. Horowitz,
DuPom Electronic
Materials
Session WA2
MCM-C and MCM-D
Session Chairs:
Tom Ross, VTMC; Steven Annas, Vispro Corporation
MCM-D tor High Speed Digital Applications
—
Electrical Modelling and Performance Evaluation
Claudio
Truzzi, Eric Beyne and Edwin Ringoot, Multichip
Module DomainllMEC
A Family of High Performance MCM-C/D Packages
Utileing CoFired Alumina Multilayer Ceramic and a
Shielded Thin Film Redistribution Structure
William Shutler,
Hai
Longworth, John
Pernacchia, Eric
Perfecto
and Ronald Shields, IBM Microelectronics
Session WP1
MCM-L
Session Chairs:
Bill G. Petefish, W.L. Gore Associates; Carl V. Reynolds, Johnson
Monkey Semiconductor Packages, Inc.
059
High Performace MCM-L Package for Digital
Processing Applications
John
С
Mosko, W.L. Gore
&
Associates, Inc.
064
MCM-L Substrates Fabricated Using Patterned
TLPS Conductive Composites
Goran Matijasevic, Catherine Gallagher and Pradeep
Gandhi, Toranaga Technologies; Dick
Pommer
and Raj
Kumar, Litronic Industries
070
Surface Laminar Circuit™ (Carrier) and Flip Chip
Assembly Enabling Technologies for Advanced
Computer Applications
Miguel A. Jimarez, IBM Microelectronics
075
HiGH-DENsmr Laminate Substrates Using a Non-
suBTRAcnvE Manufacturing Process
John
W. Lott,
DuPont Electronic Materials; Richard K.
Kraus,
Computing Devices International; Cynthia F. Murphy,
MCC
Table of Contents
081
087
Session WP2
Flip Chip and CSP
Session Chairs:
Raymond A. Ffflion, GE Corporate R&D
Châties
£.
Bauer, TechLead
Сотр.
Adhesive Based Flip Chip Technology for Assembly on
Polyimtoe Flex Substrates
R. Wayne Johnson, David Price,
Dan Maslyk,
Michael
Palmer, Stuart Wentworth and Charles Ellis, Auburn
University; John Czarnowski and Justin Bolger, Merix Corp.
Reliability of Large Conductive Polymer Flip Chip
Assemblies for Multichip Modules (MCMs)
Leonard
Schaper,
Kaoni
Maner
and Simon
Ang,
University of
Arkansas HiDEC
Simple Method of Flip-Chip Bonding on a Resin
Substrate
Kenji Matsuda, Ippei Fujiyama and Yasuhide Chigawa, R&D
Center, PFU Limited
Low-Cost Flip Chip Consortium
-
First Year Results
L. Nguyen and M. Baker, National Semiconductor Corp.
Second Level Assembly of
Сшр
Scale, Chip-on-Flex
Packages
RjL Ffflion,
D.M.
Shaddock, W.E. Burdiek and H. Kapadia,
GE Corporate R&D
Stud-Bump Bonding Technique onto an Advanced
Organic Substrate for MCM-L
Tsukasa Shiraishi, Kazuyoshi
Amami,
Šatoru
Yuhaku,
Yoshiriro Bessho,
Kazao Eda
and
lom
Ishida, Matsushita
Electric Industrial Co., Ltd.
092
098
104
109
115
121
Low Loss, Low Temperature Cofired Ceramics with
Higher Dielectric Constants for Multichip Modules
(MCM)
Galina
Kniajer,
Kenton Dechant and
Prasad
Apte,
The
Westaim Corporation
128
134
142
148
Materials, Processes and Reliability Evaluation of
Photodielectrics
for Sequential Circuit Application
Weiping
Li and
Rao
luminala,
Georgia
Instituie
of
Technology;
Rolf Funer
and Chuck Sullivan, AMP Circuits
colaminated single and
multichip
flip package
Development
Craig
N.
Emsberger, CTS Corporation; Sunil Thomas, Texas
Instruments, Inc.
Evaluation of Die Coating Materials for Chip-on-
Board Technology Insertion in
Spaceborne
Applications
Binh Q.
Le,
Elbert Nhan, Richard H.
Maurer,
Ark L. Lew,
Juan R. Lander and Seppo J. Lehtonen, The Johns Hopkins
University/Applied
Physics
Lab.; M.
Ann Garrison Damn,
NASA Goddard Space Flight Center
New Developments in Microspheres That May Be
Added to MCM-L and MCM-C Substrates for
Multichip Modules
Dave Kellerman, Material Solutions·, Noel Tessier, Emerson
and Cuming Composites
Session THAI
Advanced Materials
Session Chairs:
Wniiam R. Bratschun, Motorola, lac.
Rajen
Chanchani,
Sandia
National Laboratories
Recent Advances in High Temperature
Superconductor
Мілзісшр
Modules
John W. Cooksey, Steve S.
Scott, W.D.
Brown,
S.S.
Ang, R.G.
Florence and S.
Afonso,
University of Arkansas
HiĐEC
Session THA2
Interconnect Technologies
Session Chairs:
Marty Neese, Jabil Circuit, Inc.; Robert Newberry, Chrysler-Acustar
154
Cost Effective Approach to Fine Pitch BGAs
Jeff
Mikš,
Dwight Daniels, Motorola, Inc.
160
Fabrication of a DRAM Cube Using a Novel Laser
Patterned
3-D
Interconnect Process
Vincent
Malba,
Vladimir Liberman and Anthony F.
Bernhardt,
Lawrence Lwermore National Laboratory
Table of Contents
165
170
177
Further Investigation Into the Use of Acoustic !
202
Micro Imaging for Analyzing Fup Chip Integrity and
,
Failure Modes Through Correlative Studies
Janet E. Semmens and
Lawrence W. Kessler,
Sonoscan, Inc.
Thermosonic Gold Ball Bonding to Alternate
Plating Finishes on Laminate MCM Substrates
Chris Dann,
R.
Wayne Johnson and
N.
Mike Bozack, Auburn
University; Cheryl Kromis, Joe Hams and Mamie Kasdler,
AVEX Electronics
Status of NCMS Chip-On-Board Project
Alan R. Janus, Hughes Aircraft Company
Workstation MCM Technology Comparison with Five
Designs
Steven Ladd and James E. Mandry, Interchip Systems, Inc.;
Samauel J. Horowitz, Daniel I. Amey, Jay
В
Page, DuPont
Electronic
Materials·,
Dave Holmes, C-MAC Industries, Inc.
Design and Packaging of a Pentium^-Processor-
Based MCM-D for Wearable Personal Computers,
Notebooks, and Embedded Control Applications
Sammy
Mok, Rob
Reintchimdt and Larry Smith,
MicroModule Systems
208
Session THA3
Design
&
Test
Session Chairs:
Steven Ladd,
InterChip
System, Inc.
Carol Marnow, MicroModule Systems
181
Test Strategies for
3-D
Stack of Multichip Modules
Space Flight Computer
Koppolu Sasidhar, A. Chatterjee, Georgia Institute of
Technology; Leon Alkalai, Jet Propulsion Labs
187
Investigation of Design and Performance of
MuuncHiP Modules including Electromagnetic
СОМРАТІВІШТ
Marcus Lankford, Kyle Davis, R. Wayne Johnson, M.E.
Baginski and Hayden Hontgas, Auburn University; Kevin
Slattery, Robert Newberry and John Evans, Chrysler
Corporation
193
Design Standards tor Effective MCM Design
Steven Ladd, Interchip System, Inc.
196
Design and Development Challenges for Complex
Laminate Multichip Modules
Christopher Cotton and Dennis R.
Kling,
Raytheon Company;
George Sebesta, CECOM RDEC AMSEL-KD-AS-BE
Session THP1
.
Substrate Processing
>
Session Chairs:
Dale McHerron, IBM Microelectronics
| Chung W. Ho, MicroModule Systems
214
A New Built-up Epoxy Resin
PCB
Technology for
High Density Surface Mount Package and Device
Attachment
Masaaiki Harazooo, Yasutoshi Iwata and Seiichi
Talami
Kyocera
Corporation
218
Uniform Copper Electroplating tor Application to
Мишсшр
Modules
John H. Glezen,
H.A.
Naseem, R.K.
Ulrich, L.W.
Schaper
and W.D. Brown,
НЮЕС,
University of Arkansas
224
Properties and Processing AVATREL™ as a High
Performance Dielectric
N.R. Grove, Paul A. Kohl and
S.A.
Bidstrup-Allen, Georgia
Institute
of Technology; R.A. Shick, B.L. Goodall and S.
Jayaraman, B.F. Goodrich
228
Statistical Process Control Applied to Automated
Dispense of Silver Filled Epoxy for Commercial
Millimeter Wave
Миш
Chip Module
Robert Spinazzola, M/A-COM
234
Development of Large Area Processing for Thin Film
Substrates
E. Chieh, J. Lykins, C. Ho, L.
Moresco,
M. Koblis, M.
Harangh and M. Skinner, MicroModule Systems
(MMS); E
Garrou,
S. Cummings and R. Heistand, Dow Chemical
Co.
Table of Contents
Session THP2
Known Good Die
5et*ion
Chairs:
Bob Feugate, Intel; haxty Gilg,
MCC
240
To KGD or Not to KGD? That is the Question!
Phillip J. Spletter, Somntoge; Cathy Rebel;
Sandia
National
Labs.
245
250
259
265
272
278
284
Practical Characterization or PBGA Substrates for
Beoad Bandwidth High Frequency Operation
Thomas C. Evans and
ВШ
Bright,
Symbios
Logic, Inc.;
Carnea
Mattéi
and Ron Huemoeller, Amkor Electronics, Inc.
290
Motorola Fast Static RAM Known Good Die
;
Manufacturing Process
j
Don
Kost, Tony Benner,
Christina
Сопша,
Carlos Leal, Dale
Robinson, Valerie Ward, James Wilson, Motorola
85°C and 125°C Probe with Enhanced Reliability
Screens (AcnvmES of the Sematech PTAB for Die
Level Product Assurance)
Richard Arnold, Brett Brackett, Sid Siddiqui end Mike
Wong, Texas Instruments
A Wafer-Level Burn-in Technology Using the
Contactor Controlled Thermal Expansion
Yoshiro
Nakata
and Hiroaki Fujimoto, Matsushita Electric
Industrial Co., Ltd.;
Uso
Miyan&ga and Shimchi
Oki, Rfoto
Laboratory, Matsushita
Electronics
Corp.
An Infrastructure tor the Dissemination of
Information on KGD
Mike G. Roughton and Donald Radley, CODUS, Ltd.; Arun S.
Amirtham, Philips Semiconductors;
Claudio
Tnizzi,
ШЕС
A Framework for the Management of
MCM
Test
Strategies
Chryssa Dislis, University of Reading; A.E
Alani,
LSI Logic;
I.B Jalowiecki,
Brunei University
296
303
Session THP3
Modeling and Analysis
Session Chain
Robert C. Rye, Lucent Rcknalogies/Bell Labs
Signai
Integrity and Power Distribution System
Analyses for a
4x4
ATM Swttch
MCM
Yee
L
Low and Robert C. Frye,
Вей
Laboratories, Lucent
Technologies
309
315
371
Simulated and Practical Behavior of State-of-the-
Art
MCM
via Structures
Daiqing Li, Charles
£.
Free and Keith E.G. Pitt, Middlesex
University; Peter G. Barnwell, Heraeus Inc., CermaUoy
Division
Thermal Analysis for Hich-Performance Small
Devkes
lakashi Kitahaa and Kiyomoto Nakai, PFU Limited,
CAE
Division
Session
FAI
New Applications
Session Chairs:
Robert Clarke, Teledyne
Electronic
Technologies
Ronald J. Jensen, Honeywell, Inc.
The Economics of Active versus Passive Substrate
MCMs for the Cost-effective Implementation of
Massively Parallel Processors
LE
Jalowiecki and W. Bazaran-Nogham, Brunei University;
C. Disliss, University of Reading
Microwave Multi-chip Module Utileing Aluminum
Silicon Carbide with
In
-Ѕгго
Cast Components and
High Density Interconnect Technology
Bradley
Dufouţ
Michael HcNulty and Stephen Miller,
Lockheed
Martín
Government Electronic Systems
Double-Sided Ceramic MCMs for
Spaceborne
Computer Applications
Ronald J. Jensen, Steve
L
ROiwniist, Mike A. Mitchell,
Al
J. Toth and Randy G. Nichols, Honeywell, Inc.
Designing a Complex
MCM
with High Power
Requirements for an Aerospace Environment
Robert Clarke, Teledyne Electronic Technologies; Timothy J.
Glahn, Raytheon
Е
-Systems, FCD
Table of Contents
323
A Comparative Analysis of A MCM Implementation
for an Automotive Controller
Robert Newberry and Larry Bosley, Chrysler Corporation;
R. Wayne Johnson, Auburn University
329
334
340
345
351
357
363
Miniaturizing Power Electronics Using Multi-Chip
Module Technology
Errol
Portei;
Mike Glover, Simon
Ang,
Keith Burgers,
Kraig Olejniczak and
Len
Schaper,
University
cf
Arkansas
Session FA2
Integrated Passives
Session Chairs:
René
E.
Coté,
Duroni;
Timothy Lenihan, Sheldahl
Modeling and Design Considerations for Embedded
Inductors in MCM-D
Jinsong Zhao and Wayne Dai, University of California;
Robert Frye and King
ТЫ,
Lucent Technologies/Bell Labs
Silicon MCM-D Technology tor RF Integration
R.G. Arnold, David J. Pedder and C.C. Faulkner,
CEC
Plessey Semiconductors
Design Considerations for Using Integrated Passive
Components
James
В
Parkerson and Leonard W.
Schaper,
University
of
Arkansas HiDEC; Timothy G. Lenihan, Sheldahl
Embedded Passive Functions tor RF and Mixed-
Signal Circuits
Raymond L. Brown, W.R. Dick Smirb
National Semiconductor
Integration of Passive Components tor Microwave
Filters in MCM-D
Philip Pieters, Steven Brebek and Eric Beyne, IMEC
Glass Ceramics Functional Substrate Development
K.
Tagami,
T.
Kubo,
С.
Makihara,
S.
Tánahashi,
H.
Emura,
J.
TanaŁa,
T. Sueyoshi, Y. Kunimaisu, Kyocera Corporation;
R. Sigliano, C. Nelson, Kyocera America, Inc.
379
Appendix
Index
of Authors
|
| any_adam_object | 1 |
| author_corporate | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_corporate_role | aut |
| author_facet | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_sort | International Conference and Exhibition on Multichip Modules Denver, Colo |
| building | Verbundindex |
| bvnumber | BV012016990 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4910 |
| classification_tum | ELT 299f |
| ctrlnum | (OCoLC)36787325 (DE-599)BVBBV012016990 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| indexdate | 2024-07-09T18:20:15Z |
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| language | English |
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| publisher | IEEE Service Center |
| record_format | marc |
| spelling | International Conference and Exhibition on Multichip Modules 6 1997 Denver, Colo. Verfasser (DE-588)5255034-5 aut Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado 1997 International Conference on Multichip Modules Piscataway, NJ IEEE Service Center 1997 X, 379 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Encapsulation (électronique) - Congrès ram Modules multipuces (microélectronique) - Congrès ram Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses (DE-588)1071861417 Konferenzschrift gnd-content Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133145&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado Encapsulation (électronique) - Congrès ram Modules multipuces (microélectronique) - Congrès ram Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado |
| title_auth | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado |
| title_exact_search | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado |
| title_full | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado 1997 International Conference on Multichip Modules |
| title_fullStr | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado 1997 International Conference on Multichip Modules |
| title_full_unstemmed | Proceedings April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado 1997 International Conference on Multichip Modules |
| title_short | Proceedings |
| title_sort | proceedings april 2 4 1997 the adam s mark hotel denver colorado |
| title_sub | April 2 - 4, 1997, the Adam's Mark Hotel ; Denver, Colorado |
| topic | Encapsulation (électronique) - Congrès ram Modules multipuces (microélectronique) - Congrès ram Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses |
| topic_facet | Encapsulation (électronique) - Congrès Modules multipuces (microélectronique) - Congrès Microelectronic packaging Congresses Multichip modules (Microelectronics) Congresses Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=008133145&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT internationalconferenceandexhibitiononmultichipmodulesdenvercolo proceedingsapril241997theadamsmarkhoteldenvercolorado |