Modern solder technology for competitive electronics manufacturing:
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York [u.a.]
McGraw-Hill
1996
|
| Series: | Electronic packaging and interconnection series
|
| Subjects: | |
| Physical Description: | XLIV, 622 S. Ill., graph. Darst. |
| ISBN: | 0070317496 |
Staff View
MARC
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Record in the Search Index
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| any_adam_object | |
| author | Hwang, Jennie S. |
| author_facet | Hwang, Jennie S. |
| author_role | aut |
| author_sort | Hwang, Jennie S. |
| author_variant | j s h js jsh |
| building | Verbundindex |
| bvnumber | BV011207944 |
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| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
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| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV011207944 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:05:48Z |
| institution | BVB |
| isbn | 0070317496 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007517532 |
| oclc_num | 33276885 |
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| owner_facet | DE-29T |
| physical | XLIV, 622 S. Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | Electronic packaging and interconnection series |
| spelling | Hwang, Jennie S. Verfasser aut Modern solder technology for competitive electronics manufacturing Jennie S. Hwang New York [u.a.] McGraw-Hill 1996 XLIV, 622 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging and interconnection series Electronic packaging Solder and soldering Elektronik (DE-588)4014346-6 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Elektronik (DE-588)4014346-6 s Löten (DE-588)4036162-7 s DE-604 |
| spellingShingle | Hwang, Jennie S. Modern solder technology for competitive electronics manufacturing Electronic packaging Solder and soldering Elektronik (DE-588)4014346-6 gnd Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4014346-6 (DE-588)4036162-7 |
| title | Modern solder technology for competitive electronics manufacturing |
| title_auth | Modern solder technology for competitive electronics manufacturing |
| title_exact_search | Modern solder technology for competitive electronics manufacturing |
| title_full | Modern solder technology for competitive electronics manufacturing Jennie S. Hwang |
| title_fullStr | Modern solder technology for competitive electronics manufacturing Jennie S. Hwang |
| title_full_unstemmed | Modern solder technology for competitive electronics manufacturing Jennie S. Hwang |
| title_short | Modern solder technology for competitive electronics manufacturing |
| title_sort | modern solder technology for competitive electronics manufacturing |
| topic | Electronic packaging Solder and soldering Elektronik (DE-588)4014346-6 gnd Löten (DE-588)4036162-7 gnd |
| topic_facet | Electronic packaging Solder and soldering Elektronik Löten |
| work_keys_str_mv | AT hwangjennies modernsoldertechnologyforcompetitiveelectronicsmanufacturing |