EMC: silicon to systems, Silicon Valley, 1996; symposium record
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| Format: | Conference Proceeding Book |
|---|---|
| Language: | Undetermined |
| Published: |
Piscataway, NJ
IEEE [u.a.]
1996
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | XV, 561 S.: Ill., graph. Darst. |
| ISBN: | 0780332075 |
Staff View
MARC
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| 245 | 1 | 0 | |a EMC |b silicon to systems, Silicon Valley, 1996; symposium record |c IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, Calif., Santa Clara Convention Center, August 19 - 23, 1996 |
| 246 | 1 | 3 | |a Santa Clara 1996 |
| 264 | 1 | |a Piscataway, NJ |b IEEE [u.a.] |c 1996 | |
| 300 | |a XV, 561 S.: Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Elektromagnetische Verträglichkeit |0 (DE-588)4138552-4 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |y 1996 |z Santa Clara Calif. |2 gnd-content | |
| 689 | 0 | 0 | |a Elektromagnetische Verträglichkeit |0 (DE-588)4138552-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 711 | 2 | |a International Symposium on Electromagnetic Compatibility |d 1996 |c Santa Clara, Calif. |j Sonstige |0 (DE-588)1400860-9 |4 oth | |
| 856 | 4 | 2 | |m Digitalisierung TU Muenchen |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007435421&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-007435421 | ||
Record in the Search Index
| _version_ | 1804125588898709504 |
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| adam_text | CONTENTS
Session
Al:
Special Session
FCC Update and
Regulatory
Status
Streamlining the
FCC
Equipment
Authorization Process in Response to
Changing Global Markets
Julius P.
Knapp, Art
Wall, Federal
Communications Commission
Session
Al:
Special Session
Global Commercial EMC Standards
Introductory Remarks
11
Herbert K.
Mertei, Mertei
Associates
The USA Emission and Immunity EMC
12
Standards
Donald
N.
Heirman, Lucent Technologies Inc.
The European Emission Specifications
18
Manfred Stecher,
Rhode and
Schwarz GmbH
and Co. KG, Germany
The European Immunity Standards
24
A. J. Maddocks, ERA Technology Ltd, England
The European Medical Device EMC
31
Specifications
Randy Anderson, Ohmeda, Inc.
The EMC Specifications of Australia,
34
China, Japan and New Zealand
Raymond T. Garrett, EMC Services Pty Ltd,
Australia
Session
A3:
ТЕМ
Cells
Mode Suppression in
ТЕМ
Cells
R. Lorch, G. Monich,
Technische Universität
Berlin, Germany
40
Use of the
ТЕМ
Cell for Compliance
43
Testing of Emissions and Immunity, an
IEC Perspective
Sigurd Bentz, Technical University of Denmark,
Denmark
Session
A4:
GTEM
Sources of Problems in the GTEM Field
48
Structure and Recommended Solutions
Diethard
Hansen, Detlef
Ristati,
Euro EMC
Service Dr.
Hansen GmbH,
Germany, William
A. Radasky, Kenneth S. Smith, Metatech
Corporation
Calculations and Measurements of Fast
52
EM Pulses in the GTEM Cell
William A. Radasky, Kenneth S. Smith
Metatech Corporation, Diethard
Hansen, Detlef
Ristau,
Euro EMC Service Dr.
Hansen GmbH,
Germany
An Algorithm for an Advanced GTEM to
58
Ground Plane Correlation of Radiated
Emission Test
Ae-kyoung Lee, Electronics and
Telecommunications Research Institute, Korea
Session A5: Special Session
Integrated Circuit EMC
Investigation of the Theoretical Basis for
63
Using a
1
GHz
ТЕМ
Cell to Evaluate the
Radiated Emissions from Integrated
Circuits
James P. Muccioli, JASTECH, Terry M. North,
Chrysler Corporation, Kevin P. Slattery,
FF
Developments USA
Achieving Reduced EMI Using
68
Microcontrollers with PLL-Based
Oscillators
Robert
DeMoor,
Texas Instruments, Inc.
EMI
Contribution
of the Drive Current
72
and Output Phase Lag in CMOS Gate
Oscillator
Jean Claude Perrin, Texas Instruments Europe
A TEM-Celt Based Method for Radiative
76
Susceptibility Characterization of Low-
Power Microcontrollers
Andy Engel,
CSIC, Hector Astrain, AISL, John
Cagle, Steven Ledford, CSIC, Mali Mahalingam,
AISL
Session A6:
Properties of Shielded Materials
Degeneration of Shielding Effectiveness of
82
Planar Shields Due to Oblique Incident
Plane Waves
Fang Han, NOKIA Research Center, Texas,
Linchang Zhang, Northern Jiaotong University,
Beijing, China
Numerical Computation of
Anisotropie 87
Shielding Materials Based on the Method
of Moments
M.
Kimmel,
H.
Singer,
Technische Universität
Hamburg-Harburg,
Germany
Shielding Properties of Thin Curved
92
Surfaces
S. S.
Seker,
Bogazici University, Istanbul,
Turkey, B. Altay, TUBITAK-Marmara Research
Center, Kocaeli, Turkey
Shielding Performance of Ferromagnetic
95
Cylindrical Cans
S. Celozzi, M.
D Amore,
University of Rome
La Sapienza ,
Italy
Terminal Effect of Finite Length
101
Underground Cables to Illumination of
External Fields
Fang Han, Radio Communications Laboratory,
NOKIA Research Center, William T. Smith,
University of Kentucky
Session A7: Special Session
Numerical Techniques in EMC
Frequency-Domain Finite Element
107
Methods for Electromagnetic Field
Simulation: Fundamentals, State of the
Art, and Applications to EMI/EMC
Analysis
Andreas
С
Cangellaris, University of Arizona
The Application of the Finite-Difference
117
Time-Domain Method to EMC Analysis
Stephen D. Gedney, University of Kentucky
State of the Art in the Method of Moments
122
Hermann Singer,
Heinz-Dietrich
Brans,
Guido
Burger,
Technische Universität Hamburg-
Harburg,
Germany
Partial Element Equivalent Circuit
128
(PEEC) Method and its Application in the
Frequency and Time Domain
Albert Ruehli, IBM Research Division, T.J.
Watson Research Center
Session Bl:
Absorber Lined Chambers
Calibration of Fully Anechoic Rooms and
134
Correlation With OATS Measurements
Roger A. McConnell, Clark Vitek, CKC
Laboratories, Inc.
Criteria for Absorber s Reflectivity Lined
140
і«
Semi-Anechoic Chambers Using Ray-
Tracing Technique
Yoshiyuki Naito, Hiroki Anzai, Takahashi
Yamazaki, Tetsuya Mizumoto, Department of
Physical Electronics, Tokyo Institute of
Technology, Japan
Analysis of Semi-Anechoic Chambers
143
Using Ray-Tracing Technique
Hiroki Anzai, Takeshi Kishimoto, Takashi
Yamazaki, Yoshiyuki Naito and Tetsuya
Mizumoto,
Dept.
of Physical Electronics, Tokyo
Institute of Technology, Japan
ix
Real Performance of Semi-Anechoic
146
Chambers Depending on Absorber
Technology
A.
Enders,
II, Physikalishes
Institut der
Universität zu
Koin,
Germany
Real Free Space Antenna Factors for
151
Validating Completely Absorber Lined
Chambers?
Dick J.
Groot
Boerle, GASTEC NV, The
Netherlands, Frank B. J. Leferink,
Hollandse
Signalapparaten B.V.,
The Netherlands
Analysis of the Effect of
Ferrite
Tile Gap
156
on EMC Chamber Having
Ferrite
Absorber Walls
Kefeng Liu, EMC Test Systems, L. P.
Session B2:
Properties of Absorber Materials
Investigation on Convenient Measuring
162
Method of Oblique Incident
Characteristics for Absorbing Panel in
Low Frequency Range (Lower than I
GHz)
Hiroshi Kurihara, Yoshihito Hirai, Yasuo
Hashimoto, Ken Ishino, TDK Corporation,
Japan, Kouichi Shiramizu, Fujita Corporation,
Japan
A Matrix Surface Impedance Formulation
168
for the Analysis of EM-Interaction to
Finite Laminated Composite Slabs
M. S.
Sarto,
University of Rome
La Sapienza ,
Italy
Low Frequency Representation of Radio-
174
Frequency Absorbers
R. Johnk, J.
Randa,
National Institute of
Standards and Technology
Session B3:
Mode Stirred and Reverberation
Chambers
Evanescent Modes in a Unique Mode-
180
Stirred Chamber
-
THe
Advanced
Technology Chamber
(АТС)
-
Design,
Construction, Operation and Data
C. E.
Goldblum,
David Lane, J. L. Press, L.
Rayadurga, Rand B
Enterprises, L. Cohen,
Naval Research Laboratory
EM V Testing of Aircraft: A Comparison of
185
the Mode-Stirred and Standard Methods
Diane R. Kempf, Naval Air Warfare Center
Frequency Characterization of
190
Reverberation Chambers
Michael O. Hatfield, Naval Surface Warfare
Center
Dahlgren
Division, Michael D. Slocum,
Computer Sciences Corporation
Session B4: Modeling I
Using Spreadsheet Programs on Personal
194
Computers for Electromagnetic Coupling
Calculations
Lothar
O. Hoeft,
Consultant for Electromagnetic
Effects
An Expert System Approach to EMC
200
Modeling
T. Hubing, J.
Drewniak,
T.
Van
Doren, N.
Kashyap, University of Missouri
-
Rolla
Spice and IBIS Modeling Kits: The Basis
204
for Signal Integrity Analysis
Roland H. G. Cuny, Siemens
Nixdorf
Informationssystems
AG,
Germany
Models for the Near Field Interaction of a
209
Magnetic Field From Point Sources
Representing Transformers and Power
Supplies
anda
Ferromagnetic Cylindrical
Shell
Dr. Theodore R. Anderson, Naval Undersea
Warfare Center New London Detachment
Transient Formulation of Lossy Ground
213
Return Parameters
f
or Time-Domain
Transmission Line Analysis
M.
D Amore,
M. S. Saroto,
University of Rome
La Sapienza ,
Italy
Analysis of a Shipboard Frequency-
219
Hopping Communication System
Shing Ted Li, Jodi McGee, Daniel
Tam, Hans
Wiesenfarth, Naval Command, Control, Ocean
Surveillance Center, Michael Maiuzzo,
Sentei
Corporation, Donald Wheeler,
ІІТШ
Session B5: Modeling II
Efficient Modeling of Transmission Line
225
Networks Discontinuities
S. Celozzi, University of Rome
La Sapienza
Italy, A. Orlandi, University of
L Aquila,
Italy
Modeling of Radiated Electromagnetic
230
Emission Coming From Interface Cables
of an Equipment
Dr. Zhu Desheng, Chong Weng Hoe,
Lau Chee
Kin
-
Singapore Institute of Standards and
Industrial Research (SISIR), Republic of
Singapore
Inductance Calculations: Experimental
235
Investigations
Frank B. J. Leferink,
Hollandse
Signaalapparaten
В.
V., The Netherlands
Session B6:
Statistical Aspects of EMC
Statistical Comparison ofSite-to-Site
241
Measurement
Reproducibüity
Lowell E.
Kolb,
Hewlett-Packard Company
A Process for the Analysis of the Physics
245
of Measurement and Determination of
Uncertainty of EMC Test Procedures
Edwin L, Bronaugh, EdB EMC Consultants,
John. D. M. Osburn, EMC Test Systems, L. P.
Comparison of Measured and Theoretical
250
Statistical Parameters of Complex Cavities
Gustav
J.
Freyer,
NCEE, Michael
O. Hatfield,
Naval Surface Warfare Center
Dahlgren
Division, D. Mark Johnson, Michael B. Slocum,
Computer Sciences Corporation
Session B7:
Impact of
БМС
on Transmission Lines
A Rigorous Analysis of Twisted Pair
254
Transmission Lines Using Non-
Orthogonal FDTD and the PML
Absorbing Boundary Condition
J.
Alan Roden, IBM
Corporation, Research
Triangle Park, Stephen D. Gedney, Clayton
Paul, University of Kentucky
Study on Noise Characteristics of
259
Multilayer Twisted-Pair Wire Circuit
Xin Xu, Shuichi Nitta, Atsuo Mutoh, Tokyo
University of Agriculture and Technology,
Tokyo, Japan, Shesha Jayaram, University of
Waterloo, Ontario, Canada
Incident Field Coupling Analysis of
265
Multiconductor Transmission Lines Using
Asymptotic Waveform Evaluation
S.K. Das, Sun Microsystems, W. T. Smith,
University of Kentucky
Electrical Distribution System Power Line
271
Characterization
Domenie
A. DiClementi, Naval Surface Warfare
Center Carderock Division, David L.
Standeven,
PRC Inc.
Use of the Method of Moments to Find the
277
Charge Densities and Capacitances of a
Shielded TtvistedPair Transmission Line
Craig James, Rome Laboratory, John Norgard,
University of Colorado at Colorado Springs
State-Variable Characterization of
283
Transmission Line Terminations for
FDTD Analysis
Antonio Orlandi, University of
L Aquila,
Italy,
Clayton Paul, University of Kentucky
xi
Session
В8:
EMC
Immunity
Electromagnetic Induced Timing Defects
288
in the Synthetic Aperture Radar of
Magellan Spacecraft
Reinaldo
Perez, Jet Propulsion Laboratory,
California Institute of Technology
Computer Aided Analysis of RF Effects in
294
В
JT Circuits
F.
Fiori,
T.
Fóti,
V.
Pozzolo,
Politecnico Di
Torino,
Italy
Coupling of
Inhomogéneo
us Fields into
300
Cables over Discretized Metallic Ground
Planes of Finite Extent
H.-D.
Bruns,
Technische Universität Hamburg-
Harburg,
Germany,
F. Schlagenhaufer, EMCSI
Melbourne,
Australia
Analysis on the Effectiveness of Image
326
Planes within a Printed Circuit Board
Mark Montrose, Montrose Compliance Services
Skin-Effect Modeling of Radiated
332
Emissions from Backplanes
Dheena Moongilan, Lucent Technologies Inc.
Session C2: Radiated Emissions II
Radiated Emissions Testing of an
338
Experimental Electric Vehicle
Harry W. Gaul, Tom Huettl, Chuck Powers,
Motorola
3D-FEM Analysis of Electromagnetic
343
Emission From
PCB
Shinji Tanabe, Takahiko Itoh, Yuichiro
Murata,
Tatsuo Ozeki, Mitsubishi Electric Corporation,
Japan, Eishi Gofuku, Advanced Display Inc.,
Japan
Session Cl: Radiated Emissions I
Experimental and Numerical
305
Investigations of Fundamental Radiation
Mechanisms in
PCB
Designs with
Attached Cables
D. M. Hockanson, J. L.
Drewniak,
T. H. Hubing,
and
T. P.
Van
Doren,
University of Missouri
-
Rolla,
С.
W. Lam,
Quad Design Technologies
Prediction of Electromagnetic Emissions
311
from the Cable Connecting the Notebook
Computer s Motherboard to its Flat Panel
Display
Mike Ju, California Micro Devices, Mike
Kriege,
Apple Computer Inc.
Investigation of EMI on Multilayer
316
Printed Circuit Boards: Radiated
Emissions
S. Caniggia, V. Costa, L. Vitucci, ITALTEL, a
Stet
and Siemens Company, Italy
Effect of Multi-Layers of Image Planes on
322
PCB
Radiation
Jinsuk Kim, Kilnam Oh, Electronics and
Telecommunications Research Institute, Korea
Session C3:
Shielding Effectiveness of Enclosures
Low Frequency Shielding Effectiveness of
347
Inhomogenous Enclosures
P.
Kistenmacher,
A. Schwab, University of
Karlsruhe, Germany
Compensating
f
or Shielded Enclosure
353
Effects on Radiated Emission
Measurements
Robert B. Smith, Eagle Systems Incorporated,
Naval Air Warfare Center Aircraft Division
Transfer Impedance Measurement of a
3 60
l^-Subrack
J.
Bernauer,
A. Schwab, University of
Karlsruhe, Germany
Non-Traditional Methods of Screening in
366
Electromagnetic Systems
S.M. Apollonskii, State
Nord-
West Politechnical
Institute, Sankt-Petersburg, Russia
XII
Session C4: EMC
Effects of Apertures I
Testing of Microwave Shielding Gaskets
3 71
and Cover Panels
-
Recent Work at Rome
Laboratories
Dr. J. P.
Quine,
С.
Brown,
К.
Fisher, J.P.
Streeter, A. J.
Pesta, Rome
Laboratories, Griffiss
AFB
3D-FEM Analysis for Shielding Effects of
375
a Metallic Enclosure with Apertures
Shinji Tanabe, Nobuyuki Nagano, Takahiko
Itoh, Yuichiro
Murata, Shigemitsu
Mizukawa,
Mitsubishi Electric Corporation, Japan
Session C5: EMC Effects of Apertures II
On the Axial Aperture Electric Field
381
Resonances of Open-Ended Missile-Like
Structures
J. Patrick Donohoe and Clayborae D. Taylor,
Mississippi State University
A Comparison of an FDTD Thin-Slot
386
Algorithm and Method of Moments for
Modeling Slots Near Comers
K.. P. Ma, J. L.
Drewniak,
T. H. Hubing, T. P.
Van
Doren,
University of Missouri
-
Roiła
A New and Simple Method for the Direct
391
Measurement of Microwave Power
Radiated From Gasketed Seams
Dr. J. P.
Quine, D.
Overrocker,
К.
Fisher, J.P.
Streeter, A. J.
Pesta, Rome
Laboratories, Griffiss
AFB
Session C6: EMC Measurements I
Development of an Embedded Terminal
392
Protection Device
(TPD)
Tester
Lothar
O. Hoeft,
Thomas
M.
Salas, BDM
Federai,
Inc., William D. Prather, Phillips
Laboratory (WSR)
Unlicensed PCS Product EMC
396
Compliance Measurement Rationale and
Alternatives
H. Stephen
Berger,
Siemens Rolm
Communications, Inc., Anatoly Tsaliovich,
Lucent Technologies Inc.
Measurement Parameter Evaluation for
402
Prescans as Part of Radiated EMI
Measurements
Wemer Schaefer, Hewlett-Packard Company
Session C7: EMC Measurements II
A New Method for Measuring the
407
Shielding Effectiveness of
Interconnections in Shielding
Technologies:
Application
to Cellular
Phone Gaskets for the Bousing
Richard Haynes, Consultant,
Philip J. Muniz, Lucent Technologies, Inc.,
Douglas C. Smith, Auspex Systems, Inc.
Investigation of the Bulk Current Injection
412
Technique by Comparison to Induced
Currents from Radiated Electromagnetic
Fields
Dawn H. Trout, NASA, George
С
Marshall
Space Flight Center
Session C8:
Non-Sinusoidal EMC Effects
Simulated and Experimental Effects of
418
ESD
on CMOS Timing Circuits
Ahmad Mahinfallah, Robert Nelson, North
Dakota State University
Computational Aspects of a Nonlinear
424
Problem Involving Electromagnetic
Transients in Ferromagnetic Shields
William J.
Croisant,
Carl A. Feickert, Michael
K. Mclnerney, U.S. Army Construction
Engineering Reseach Laboratories
XIII
Session C9:
PCB EMC Issues
Simulation and Measurement for
430
Decoupling on Multilayer
PCB
DC Power
Buses
H. Shi, F.
Sha,
J. L.
Drewniak,
T. H. Hubing, T.
P.
Van Doren,
University of
Missouri
-
Rolla,
F.
Yuan, Quad Design Technologies
Investigation of EMI on Multilayer
436
Printed Circuit Boards: Delta-I Noise and
Power Supply Decoupling
V. Costa, R. Preatoni, S. Caniggia, Italtel, a Stet
and Siemens Company, Italy
A Optimization Technique to Minimize
442
Crosstalk in Multi-Layered and Multi-
Microstrip-Line Board of High Speed
Digital Circuits
L.
Lu
and V. Ungvichian, Florida Atlantic
University
Finite Element Analysis of Dispersion
448
Characteristics of
Microstrip
Lines Lying
Near Substrate and Ground Plane Edges
Bruce R. Grain, Lockheed Martin Aeronautical
Systems, Andrew F. Peterson, Georgia Institute
of Technology
Analysis on the Effectiveness of Clock
453
Trace Termination Methods and Trace
Lengths on a Printed Circuit Board
Mark Montrose, Montrose Compliance Services
Susceptibility Modeling Analysis of
459
Parsitics in Unshielded Products with
Long Wires Attached
Bruce Archambeault, SETH Corporation, H.
Stephen
Berger,
Siemens Rolm
Communications, Inc.
Influence of Measurement Antenna
469
Scattering on the Radiated
Electromagnetic Field
Stefan Oing, INCASES Engineering GmbH,
Germany, Hans-Jorg John, Siemens
Nixdorf
Informationssysteme
AG,
Germany
E-Field
Measurements in the Near-Field
474
of Transmitting Antennas Using an
Integrated Electro-Optical Sensor
M. Schwerdt, J.
Berger
and
K. Peterman,
Technische
Universität
Berlin, Germany
The Electromagnetic Radiation of Small
477
Circuits and Small Loop Antennas
W. Scott Bennett, Consultant
Session D2: Poster Papers
Selection of the Variable Edmax in
482
Calibration of Log Periodic Antennas
Clifford Kraft and Benjamin Banner, Lucent
Technologies Inc.
Magnetic Shielding Principles of Linear
488
Cylindrical Shield at Power-Frequency
Yaping
Du,
John Burnett, The Hong Kong
Polytechnic University, Hong Kong
The Mixed Lumped and
Nonuniform
494
Distributed Circuit Band-Pass Filter
Yoshifiimi Ohba, Risaburo Sato, Tohoku Gakuin
University, Japan, Yoshiaki
Němoto,
Tohoku
University, Japan
Field Distribution in a Passenger Vehicle
500
Kevin P. Slattery, FFD-Ricardo, Inc.
Session D3: Poster Papers
Session Dl:
БМС
Properties of Antennas
A Large Flat Biconical Antenna for
LLSC Aircraft-Illumination in the HF
Band
Elya B.
Joffe, K.T.M.
Project
Eng.,
Ltd, Israel
465
A Method to Compute Open Area Test Sue
Uncertainty using ANSI C63.4 Normalized
Site Attenuation Measurement Data
Edward R.
Heise,
Robert W.
Heise,
Eastman
Kodak Company, Commercial and Government
Systems
505
Application of Magnetic Thin Films to
508
EMI Noise Filter
Koji
Takei,
Osamu Ishii,
Masakatsu
Senda,
NTT
Interdisciplinary Research Laboratories, Japan
To Reinforce Immunities Around GHz
511
Frequencies by EMI Noise Suppression
Filters
Shinji Wakamatsu, Frank Tilley, Gerry Hubers,
Murata
Electronics North America, Inc., Yukio
Sakamoto, Toshimi Kaneko, Hidetoshi
Yamamoto, and Yoshihiro Kurokawa
-
Murata
Manufacturing Co., Ltd., Japan
Session D4:
Commercial
БМС
Standards Issues
Routes to EMC Compliance: A
515
Manufacturer Has Choices
Henry Benitez, Tektronix, Inc.
The
ITE
Safety Standard for North
518
America
-
A Development and
Maintenance Process
Kevin L. Ravo, Underwriters Laboratories Inc.
Low Frequency Display Emissions
-
A
524
New Standard
Dave Sawdon, IBM United Kingdom Services
-
EMC Laboratory, England
European EMC and Approval
527
Requirements for Digital Cellular
Telephone Base Stations
James Cunningham, Radio Frequency
Investigation Ltd, England
Session D5:
Military EMC Standards Issues
Improvements on the MIL-STD-8548S
532
Low-Pass Cable Line
Dr.
Ferdy
Mayer
-
LEAD, France
Concerns for the Military Use of
537
Comnurrcial-Off-The-Shelf (COTS)
Equipment
David
S. Dixon, Naval
Undersea Warfare Center
xv
|
| any_adam_object | 1 |
| building | Verbundindex |
| bvnumber | BV011099421 |
| classification_tum | ELT 242f |
| ctrlnum | (OCoLC)634403729 (DE-599)BVBBV011099421 |
| discipline | Elektrotechnik |
| format | Conference Proceeding Book |
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| genre | (DE-588)1071861417 Konferenzschrift 1996 Santa Clara Calif. gnd-content |
| genre_facet | Konferenzschrift 1996 Santa Clara Calif. |
| id | DE-604.BV011099421 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-09T18:03:57Z |
| institution | BVB |
| institution_GND | (DE-588)1400860-9 |
| isbn | 0780332075 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-007435421 |
| oclc_num | 634403729 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | XV, 561 S.: Ill., graph. Darst. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | IEEE [u.a.] |
| record_format | marc |
| spelling | EMC silicon to systems, Silicon Valley, 1996; symposium record IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, Calif., Santa Clara Convention Center, August 19 - 23, 1996 Santa Clara 1996 Piscataway, NJ IEEE [u.a.] 1996 XV, 561 S.: Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1996 Santa Clara Calif. gnd-content Elektromagnetische Verträglichkeit (DE-588)4138552-4 s DE-604 International Symposium on Electromagnetic Compatibility 1996 Santa Clara, Calif. Sonstige (DE-588)1400860-9 oth Digitalisierung TU Muenchen application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007435421&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | EMC silicon to systems, Silicon Valley, 1996; symposium record Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd |
| subject_GND | (DE-588)4138552-4 (DE-588)1071861417 |
| title | EMC silicon to systems, Silicon Valley, 1996; symposium record |
| title_alt | Santa Clara 1996 |
| title_auth | EMC silicon to systems, Silicon Valley, 1996; symposium record |
| title_exact_search | EMC silicon to systems, Silicon Valley, 1996; symposium record |
| title_full | EMC silicon to systems, Silicon Valley, 1996; symposium record IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, Calif., Santa Clara Convention Center, August 19 - 23, 1996 |
| title_fullStr | EMC silicon to systems, Silicon Valley, 1996; symposium record IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, Calif., Santa Clara Convention Center, August 19 - 23, 1996 |
| title_full_unstemmed | EMC silicon to systems, Silicon Valley, 1996; symposium record IEEE 1996 International Symposium on Electromagnetic Compatibility, Santa Clara, Calif., Santa Clara Convention Center, August 19 - 23, 1996 |
| title_short | EMC |
| title_sort | emc silicon to systems silicon valley 1996 symposium record |
| title_sub | silicon to systems, Silicon Valley, 1996; symposium record |
| topic | Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd |
| topic_facet | Elektromagnetische Verträglichkeit Konferenzschrift 1996 Santa Clara Calif. |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007435421&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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