Silicon sensors and circuits: on-chip compatibility
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
London
Chapman and Hall
1996
|
| Series: | Sensor physics and technology series
3 |
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | 313 S. |
| ISBN: | 0412709708 |
Staff View
MARC
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| 245 | 1 | 0 | |a Silicon sensors and circuits |b on-chip compatibility |c ed. by R. F. Wolffenbuttel |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-007278564 | ||
Record in the Search Index
| _version_ | 1804125374520492032 |
|---|---|
| adam_text | CONTENTS CONTRIBUTORS XI PREFACE XIII 1 ON-CHIP FUNCTIONAL INTEGRATION 1
1.1 INTRODUCTION 1 1.2 THE SMART SENSOR CONCEPT 4 1.3 MERITS AND
LIMITATIONS OF INTEGRATED SILICON SENSORS 6 1.4 STANDARD BIPOLAR AND
CMOS PROCESSING 13 1.4.1 BIPOLAR PROCESSING 13 1.4.2 CMOS PROCESSING 24
1.5 TRANSDUCTION EFFECTS IN SILICON FOR ON-CHIP INTEGRATED SENSORS 37 37
40 43 47 51 52 53 2 DEVELOPMENT OF COMPATIBLE MICRO MACHINING PROCESSES
IN SILICON 55 2.1 INTRODUCTION 55 2.2 COMPATIBILITY CONSIDERATIONS 58
1.5.1 THERMAL SENSORS 1.5.2 MAGNETIC SENSORS 1.5.3 RADIANT SENSORS 1.5.4
MECHANICAL SENSORS 1.5.5 CHEMICAL SENSORS .6 CONCLUSIONS .7 REFERENCES
2.3 BULK MICROMACHINING * BACK-SIDE 60 2.4 BULK MICROMACHINING *
FRONT-SIDE 68 2.5 SURFACE MICROMACHINING 72 2.5.1 THE SACRIFICIAL LAYER
73 2.5.2 THE MICROMECHANICAL LAYERS I * POLYSILICON 75 2.5.3 THE
MICROMECHANICAL LAYERS II * NITRIDE 89 2.5.4 PLANARIZATION/STEP COVERAGE
93 2.5.5 CONTACT HOLES 95 2.5.6 ALUMINUM INTERCONNECT 96 2.5.7
SACRIFICIAL ETCHING 97 2.5.8 COMPATIBLE SURFACE MICROMACHINING PROCESS
98 2.6 LIGA PROCESS 101 2.7 WAFER-TO-WAFER BONDING 101 2.8 CONCLUSIONS
105 2.9 REFERENCES 105 COMPATIBILITY OF PIEZOELECTRIC ZINC OXIDE WITH
SILICON IC PROCESSING 115 3.1 INTRODUCTION: PIEZOELECTRICITY AND SILICON
115 3.2 THIN FILM PIEZOELECTRIC MATERIALS ON SILICON 116 3.3
IC-COMPATIBLE ZNO FABRICATION 117 3.3.1 LOW-FREQUENCY APPLICATIONS 118
3.3.2 DEVICE FABRICATION SEQUENCE 119 3.3.3 ZINC OXIDE PROCESSING 119
(A) DEPOSITION OF ZNO 121 (B) FILM CHARACTERIZATION 123 (C) PROCESS
STEPS 127 (D) ASPECTS OF MECHANICAL PRESTRESS IN ZINC OXIDE 130 3.4
EXAMPLES OF ZINC-OXIDE-ON-SILICON DEVICES 134 135 136 137 139 139 142
143 3.4.1 THIN-FILM RESONATOR 3.4.2 FORCE SENSOR 3.4.3 TACTILE-SENSOR
ARRAY 3.4.4 DEFLECTOR IN OPTICAL WAVEGUIDES 3.4.5 LAMB-WAVE SENSOR
SYSTEMS 3.5 DISCUSSION AND CONCLUSIONS 3.6 REFERENCES ECONOMICS OF
ON-CHIP FUNCTIONAL INTEGRATION 149 4.1 INTRODUCTION 149 4.2 THE
ECONOMIES OF SCALE AND THE WAFER YIELD 151 4.3 THE SENSOR MARKET 154 4.4
WAFER YIELD ECONOMICS IN ON-CHIP INTEGRATED SENSORS 155 4.5 THE ADDED
VALUE CONCEPT 159 4.6 THE ECONOMICS OF SPECIAL COMPATIBLE
POST-PROCESSING 160 4.7 THE SENSOR INDUSTRY 165 4.9 REFERENCES 169
ON-CHIP FUNCTIONAL INTEGRATION IN MICROMECHANICAL SENSORS 171 5.1
INTRODUCTION 171 5.2 WHY SILICON FOR MICROMECHANICS? 172 5.2.1
MECHANICAL PERFORMANCE OF SILICON 173 (A) MECHANICAL STRENGTH 174 (B)
LACK OF MECHANICAL AND THERMAL HYSTERESIS, AND LONG-TERM DRIFT 174 (C)
HIGH SENSITIVITY TO STRESS 175 (D) BATCH MANUFACTUREABILITY 175 5.2.2 IC
INDUSTRY INFRASTRUCTURE 175 5.2.3 LACK OF SUPPORT FROM THE IC INDUSTRY
176 5.3 INTEGRATED SENSOR MARKET OVERVIEW 176 5.3.1 PASSIVE TEMPERATURE
COMPENSATION AND CALIBRATION 177 5.3.2 AMPLIFICATION AND ANALOG
CALIBRATION AND COMPENSATION 178 5.3.3 ANALOG ELECTRONICS WITH DIGITAL
TRIMMING 180 5.3.4 DIGITAL ELECTRONICS WITH DIGITAL TRIMMING 182 5.3.5
MORE ADVANCED ELECTRONICS 182 5.4 INTEGRATED CIRCUIT MARKET ANALOGY 183
5.5 MONOLITHIC OR HYBRID 187 5.6 INTEGRATE OR NOT TO INTEGRATE CIRCUITS
WITH MICROMECHANICAL SENSORS? 189 5.6.1 PRO-INTEGRATION ARGUMENTS 191
(A) SIZE AND WEIGHT 191 (B) RELIABILITY 191 (C) COST IN VOLUME 191 (D)
TEMPERATURE VARIATION 192 (E) FEASIBILITY OF ARRAYS 192 (F) REDUCED
PARASITICS 193 (G) INCREASED RFI IMMUNITY 193 5.6.2 COUNTER INTEGRATION
ARGUMENTS 193 (A) NON-RECURRING ENGINEERING (NRE) COSTS 193 (B)
MANUFACTURING VOLUME 194 (C) MEDIA PROTECTION 194 (D) COMBINED YIELD 194
5.7 MECHANICAL ON-SENSOR-CHIP INTEGRATION 195 5.7.1 ACCELERATION SENSORS
195 5.7.2 PRESSURE SENSORS 196 5.7.3 FLOW CONTROLLERS 196 5.7.4
MICROACTUATORS 196 5.8 CASE STUDY: HYBRID AGAINST MONOLITHIC 197 5.8.1
ON-SENSOR-CHIP PASSIVE ELECTRONICS INTEGRATION 197 5.8.2 ON-SENSOR-CHIP
ACTIVE ELECTRONICS INTEGRATION 202 5.8.3 SUMMARY 207 5.9 CONCLUSIONS 207
5.10 REFERENCES 208 6 SENSOR AND CIRCUIT INTEGRATION IN BIOMEDICAL
APPLICATIONS 211 6.1 INTRODUCTION 211 6.2 APPLICATIONS 213 6.3
CHALLENGES AND REQUIREMENTS 215 6.3.1 SIZE REDUCTION 216 6.3.2
MULTIPLEXING FOR LEAD REDUCTION 217 6.3.3 AMPLIFICATION AND BUFFERING
219 6.3.4 OTHER FUNCTIONS 220 6.4 TECHNOLOGY NEEDS 221 222 222 223 224
225 6.5 APPROACHES 225 6.4.1 BIOCOMPATIBILITY 6.4.2 PACKAGING 6.4.3
ELECTRICAL ISOLATION 6.4.4 THERMAL ISOLATION 6.4.5 LOW COST AND
SIMPLICITY APPROACHES 6.5.1 SYSTEM PARTITIONING OF SENSOR/CIRCUIT
PROCESSES 226 6.5.2 CIRCUIT IMPLEMENTATION 227 6.5.3 PACKAGING
TECHNOLOGIES 233 6.6 EXAMPLES 238 6.6.1 RECORDING MICROPROBES 240 6.6.2
STIMULATING MICROPROBES 248 6.7 CONCLUSIONS 252 6.8 REFERENCES 253 7
SMART SENSORS IN AUTOMOBILES 259 7.1 INTRODUCTION 259 7.2 DEVELOPMENT OF
AUTOMOTIVE ELECTRONICS 264 7.3 CONSIDERATIONS WHEN APPLYING SMART
SENSORS 267 7.4 APPLYING SENSORS IN AUTOMOBILES 268 7.5 EXAMPLES OF
SILICON SENSORS 275 7.6 SMART SENSOR POSSIBILITIES FOR THE FUTURE 286
7.7 CONCLUSIONS 290 7.8 REFERENCES 290 8 CONCLUSIONS 293 8.1 THE MARKET
294 8.2 THE DEVICE 295 8.3 THE INDUSTRY 298 8.4 THE CHALLENGE 299
GLOSSARY 301 INDEX 307
|
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| indexdate | 2024-07-09T18:00:33Z |
| institution | BVB |
| isbn | 0412709708 |
| language | English |
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| physical | 313 S. |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | Chapman and Hall |
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| series | Sensor physics and technology series |
| series2 | Sensor physics and technology series |
| spelling | Silicon sensors and circuits on-chip compatibility ed. by R. F. Wolffenbuttel London Chapman and Hall 1996 313 S. txt rdacontent n rdamedia nc rdacarrier Sensor physics and technology series 3 Siliciumsensor (DE-588)4193160-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Siliciumsensor (DE-588)4193160-9 s Integrierte Schaltung (DE-588)4027242-4 s DE-604 Wolfenbuttel, Reinoud Felix Sonstige oth Sensor physics and technology series 3 (DE-604)BV009912621 3 OEBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=007278564&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Silicon sensors and circuits on-chip compatibility Sensor physics and technology series Siliciumsensor (DE-588)4193160-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4193160-9 (DE-588)4027242-4 |
| title | Silicon sensors and circuits on-chip compatibility |
| title_auth | Silicon sensors and circuits on-chip compatibility |
| title_exact_search | Silicon sensors and circuits on-chip compatibility |
| title_full | Silicon sensors and circuits on-chip compatibility ed. by R. F. Wolffenbuttel |
| title_fullStr | Silicon sensors and circuits on-chip compatibility ed. by R. F. Wolffenbuttel |
| title_full_unstemmed | Silicon sensors and circuits on-chip compatibility ed. by R. F. Wolffenbuttel |
| title_short | Silicon sensors and circuits |
| title_sort | silicon sensors and circuits on chip compatibility |
| title_sub | on-chip compatibility |
| topic | Siliciumsensor (DE-588)4193160-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Siliciumsensor Integrierte Schaltung |
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