Hybrid microelectronics handbook:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
McGraw-Hill
1995
|
| Ausgabe: | 2. ed. |
| Schriftenreihe: | Electronic packaging and interconnection series
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | 1. Aufl. u.d.T.: Handbook of thick film hybrid microelectronics |
| Beschreibung: | Getr. Zählung Ill., graph. Darst. |
| ISBN: | 0070266913 |
Internformat
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Datensatz im Suchindex
| _version_ | 1804124878242054144 |
|---|---|
| adam_text | IMAGE 1
HYBRID
MICROELECTRONICS HANDBOOK
JERRY E. SERGENT CHARLES A. HARPER
SECOND EDITION
MCGRAW-HILL, INC.
NEW YORK SAN FRANCISCO WASHINGTON, D.C. AUCKLAND BOGOTA CARACAS LISBON
LONDON MADRID MEXICO CITY MILAN MONTREAL NEW DELHI SAN JUAN SINGAPORE
SYDNEY TOKYO TORONTO
IMAGE 2
CONTENTS
LIST OF CONTRIBUTORS XI PREFACE XIII CHAPTER 1. INTRODUCTION TO HYBRID
MICROELECTRONICS 1-1
1.1 INTERCONNECTION SUBSTRATES 1-2
1.2 THICK FILM TECHNOLOGY 1-2
1.3 THIN FILM TECHNOLOGY 1-7
1.4 COFIRED CERAMIC AND GLASS-GERAMIC TECHNOLOGY 1-11
1.5 PRINTED WIRING BOARD TECHNOLOGY 1-12
1.6 LASER TRIMMING 1-15
1.7 ASSEMBLY 1-16
1.8 PACKAGING 1-20
1.9 ADVANTAGES OF HYBRID MICROELECTRONICS 1-20
1.10 APPLICATIONS AND EXAMPLES 1-20
1.11 SUMMARY 1-28
CHAPTER 2. CERAMIC SUBSTRATES FOR HYBRID APPLICATIONS 2-1
2.1 INTRODUCTION 2-1
2.2 BASIC PROPERTIES OF HYBRID SUBSTRATE MATERIALS 2-2
2.3 CERAMIC COMPOSITIONS FOR THICK FILM CIRCUITS 2-17
2.4 CERAMIC SUBSTRATE MANUFACTURING METHODS 2-20
2.5 SUBSTRATE CLEANING 2-25
2.6 POSTFIRE PROCESSING 2-26
2.7 SUBSTRATE SOURCES AND COSTS 2-33
REFERENCES 2-34
CHAPTER 3. THICK FILM MATERIALS AND PROCESSES 3-1
3.1 INTRODUCTION 3-1
3.2 THICK FILM CONDUCTORS 3-1
3.3 THICK FILM DIELECTRICS 3-38
3.4 RESISTOR MATERIALS AND PROCESSING 3-69
3.5 RHEOLOGY AND THE SCREEN PRINTING PROCESS 3-103
3.6 QUALITY CONTROL AND MANUFACTURING PROCESSES 3-137
IMAGE 3
VIII CONTENTS
3.7 NONHYBRID APPLICATIONS 3-141
REFERENCES 3-143
CHAPTER 4. THIN FILM MATERIALS AND PROCESSING 4-1
4.1 INTRODUCTION 4-1
4.2 THIN FILM DEPOSITION TECHNIQUES 4-1
4.3 SUBSTRATE MATERIALS 4-8
4.4 CONDUCTOR MATERIALS 4-10
4.5 RESISTOR MATERIALS 4-11
4.6 CAPACITOR MATERIALS 4-15
4.7 INDUCTOR MATERIALS 4-18
4.8 EMERGING THIN FILM MATERIALS 4-18
4.9 THIN FILM DESIGN GUIDELINES 4-23
4.10 FABRICATION SEQUENCE FOR THIN FILM RESISTOR-CONDUCTOR CIRCUITS 4-31
4.11 CHARACTERIZATION OF THIN FILMS 4-34
4.12 EMERGING TECHNOLOGY: MULTICHIP MODULE DEPOSITED (MCM-D) 4-37
4.13 CONCLUSION 4-41
APPENDIX A DEPOSITION TECHNIQUES 4-42
APPENDIX B METAL ETCHANTS FOR THIN FILM 4-53
REFERENCES 4-53
CHAPTER 5. PURE COPPER METALLIZATION TECHNOLOGIES 5-1
5.1 INTRODUCTION 5-1
5.2 SUBSTRATES 5-4
5.3 DIRECT BOND COPPER TECHNOLOGY 5-7
5.4 PLATED-COPPER TECHNOLOGY 5-17
5.5 ACTIVE METAL BRAZING COPPER TECHNOLOGY 5-21
5.6 COMPARISONS 5-27
5.7 ASSEMBLY 5-30
5.8 THERMAL PERFORMANCE 5-36
5.9 ELECTRICAL PERFORMANCE 5-39
5.10 RELIABILITY 5-41
5.11 APPLICATIONS 5-48
REFERENCES 5-52
CHAPTER 6. ASSEMBLY OF HYBRID MICROCIRCUITS 6-1
6.1 INTRODUCTION 6-1
6.2 THE DECISION SUPPORT SYSTEM 6-5
6.3 THE SOLDER JOINT 6-10
6.4 HYBRID ASSEMBLY USING THE SURFACE MOUNT TECHNOLOGY 6-17
6.5 CLEANING 6-29
6.6 REPAIR AND REWORK 6-41
6.7 COMPONENT ATTACHMENT 6-46
6.8 INTERMETALLIC FORMATION 6-52
6.9 WIRE BONDING 6-62
6.10 TAB AND FLIP-CHIP BONDING 6-73
6.11 STATISTICAL PROCESS CONTROL 6-80
6.12 FACTORY AUTOMATION 6-90
BIBLIOGRAPHY 6-99
IMAGE 4
CONTENTS IX
CHAPTER 7. ELECTRONIC PACKAGING OF HYBRID CIRCUITS 7-1
7.1 INTRODUCTION 7-1
7.2 REQUIREMENTS OF ELECTRONIC PACKAGING 7-2
7.3 TYPES OF ELECTRONIC PACKAGES 7-7
7.4 MATERIAL CONSIDERATIONS FOR ELECTRONIC PACKAGING 7-15
7.5 ELECTRONIC PACKAGE FABRICATION 7-19
7.6 PACKAGE SEALING 7-23
7.7 EVALUATION OF ELECTRONIC PACKAGES 7-26
7.8 APPLICATIONS 7-42
7.9 CONCLUSION 7-43
REFERENCES 7-44
CHAPTER 8. DISCRETE PASSIVE COMPONENTS FOR HYBRID CIRCUITS 8-1
8.1 INTRODUCTION 8-1
8.2 CAPACITORS 8-1
8.3 INDUCTORS AND TRANSFORMERS 8-25
8.4 RESISTORS 8-32
CHAPTER 9. CLEANROOMS FOR HYBRID MANUFACTURING 9-1
9.1 INTRODUCTION 9-1
9.2 CLEANROOM DESIGN 9-4
9.3 LAYOUT CONSIDERATIONS 9-27
9.4 CLEANROOM MANAGEMENT 9-44
REFERENCES 9-60
CHAPTER 10. FAILURE ANALYSIS OF HYBRID MICROELECTRONICS 10-1
10.1 INTRODUCTION 10-1
10.2 WHO SHOULD PERFORM A FAILURE ANALYSIS? 10-3
10.3 WHAT YOU SHOULD EXPECT TO GET OUT OF A FAILURE ANALYSIS 10-5
10.4 WHY HYBRID CIRCUIT FAILURE ANALYSIS IS DIFFERENT FROM OTHER
MICROELECTRONIC FAILURE ANALYSIS 10-5
10.5 ANALYTICAL APPROACH TO FAILURE ANALYSIS 10-10
10.6 FAILURE ANALYSIS DOCUMENTATION AND REPORTS 10-17
10.7 FAILURE ANALYSIS TOOLS 10-18
10.8 TYPICAL HYBRID FAILURE MODES 10-35
10.9 TYPICAL FAILURE ANALYSIS EXAMPLES 10-36
10.10 FAILURE ANALYSIS IN THE FUTURE 10-43
10.11 SUMMARY 10-45
APPENDIX 10.1 SAMPLE: BASIC FAILURE ANALYSIS REPORT 10-46
APPENDIX 10.2 SOURCES OF ADDITIONAL READING ON FAILURE ANALYSIS 10-53
CHAPTER 11. DESIGN METHODS FOR HYBRID CIRCUITS 11-1
11.1 INTRODUCTION 11-1
11.2 THE DESIGN PROCESS 11-2
11.3 THE DESIGN SEQUENCE 11-3
11.4 DESIGN OF THICK FILM RESISTORS 11-11
11.5 DESIGN OF THIN FILM RESISTORS 11-20
11.6 ELECTRICAL CONSIDERATIONS IN HYBRID DESIGN 11-25
IMAGE 5
X CONTENTS
11.7 THEMAL CONSIDERATIONS 11-32
11.8 DETERMINATION OF CONDUCTOR WIDTH 11 -59
11.9 DETERMINATION OF WIREBOND SIZE 11 -63
11.10 SELECTION OF SUBSTRATE TECHNOLOGY 11 -64
11.11 DESIGN GUIDELINES 11-67
11.12 ASSEMBLY MATERIALS AND PROCESS SELECTION 11-72
11.13 RELIABILITY CONSIDERATIONS 11-74
11.14 SUMMARY 11-103
REFERENCES 11-103
INDEX 1
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| spelling | Hybrid microelectronics handbook Jerry E. Sergent ... 2. ed. New York [u.a.] McGraw-Hill 1995 Getr. Zählung Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging and interconnection series 1. Aufl. u.d.T.: Handbook of thick film hybrid microelectronics Circuitos integrados larpcal Circuits intégrés hybrides ram Engenharia eletrica e eletronica larpcal Microélectronique ram Hybrid integrated circuits Design and construction Handbooks, manuals, etc Microelectronics Handbooks, manuals, etc Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Hybridschaltung (DE-588)4026281-9 gnd rswk-swf Hybridschaltung (DE-588)4026281-9 s DE-604 Integrierte Schaltung (DE-588)4027242-4 s Sergent, Jerry E. Sonstige oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006960721&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Hybrid microelectronics handbook Circuitos integrados larpcal Circuits intégrés hybrides ram Engenharia eletrica e eletronica larpcal Microélectronique ram Hybrid integrated circuits Design and construction Handbooks, manuals, etc Microelectronics Handbooks, manuals, etc Integrierte Schaltung (DE-588)4027242-4 gnd Hybridschaltung (DE-588)4026281-9 gnd |
| subject_GND | (DE-588)4027242-4 (DE-588)4026281-9 |
| title | Hybrid microelectronics handbook |
| title_auth | Hybrid microelectronics handbook |
| title_exact_search | Hybrid microelectronics handbook |
| title_full | Hybrid microelectronics handbook Jerry E. Sergent ... |
| title_fullStr | Hybrid microelectronics handbook Jerry E. Sergent ... |
| title_full_unstemmed | Hybrid microelectronics handbook Jerry E. Sergent ... |
| title_short | Hybrid microelectronics handbook |
| title_sort | hybrid microelectronics handbook |
| topic | Circuitos integrados larpcal Circuits intégrés hybrides ram Engenharia eletrica e eletronica larpcal Microélectronique ram Hybrid integrated circuits Design and construction Handbooks, manuals, etc Microelectronics Handbooks, manuals, etc Integrierte Schaltung (DE-588)4027242-4 gnd Hybridschaltung (DE-588)4026281-9 gnd |
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