Handbook of semiconductor wafer cleaning technology: science, technology, and applications
The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all...
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Park Ridge, NJ
Noyes
1993
|
| Schriftenreihe: | Materials science and process technology series
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Zusammenfassung: | The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field Its thirteen chapters were written by nineteen scientists who are recognized experts in each topic. The scope of this book is very broad, covering all aspects of wafer cleaning. Emphasis is on practical applications in the fab combined with authoritative scientific background information to provide a solid scientific basis for understanding the chemical and physical processes involved in cleaning and in the analytical methods of testing and evaluation The depth and breadth of the material should appeal to those new in the field as well as to experienced professionals. The volume is intended to serve as a handbook for practitioners and professionals in the field of semiconductor microelectronics, including fab engineers, scientists and technicians. It should also prove useful to manufacturers of processing equipment, persons concerned with contamination control and analysis, and students attending advanced or specialized technical courses |
| Beschreibung: | XX, 623 S. Ill., graph. Darst. |
| ISBN: | 0815513313 |
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| 245 | 1 | 0 | |a Handbook of semiconductor wafer cleaning technology |b science, technology, and applications |c ed. by Werner Kern |
| 264 | 1 | |a Park Ridge, NJ |b Noyes |c 1993 | |
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| 490 | 0 | |a Materials science and process technology series | |
| 520 | 3 | |a The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field | |
| 520 | |a Its thirteen chapters were written by nineteen scientists who are recognized experts in each topic. The scope of this book is very broad, covering all aspects of wafer cleaning. Emphasis is on practical applications in the fab combined with authoritative scientific background information to provide a solid scientific basis for understanding the chemical and physical processes involved in cleaning and in the analytical methods of testing and evaluation | ||
| 520 | |a The depth and breadth of the material should appeal to those new in the field as well as to experienced professionals. The volume is intended to serve as a handbook for practitioners and professionals in the field of semiconductor microelectronics, including fab engineers, scientists and technicians. It should also prove useful to manufacturers of processing equipment, persons concerned with contamination control and analysis, and students attending advanced or specialized technical courses | ||
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| 650 | 4 | |a Semiconductor wafers |x Cleaning | |
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Datensatz im Suchindex
| _version_ | 1804124219585331200 |
|---|---|
| adam_text | Contents
Part I Introduction and Overview
1 Overview and Evolution of Semiconductor
Wafer Contamination and Cleaning Technology 3
Werner Kern
1 0 INTRODUCTION 3
1 1 Importance of Clean Wafer Surfaces 3
1 2 Wafer Cleaning Technology 4
1 3 Scope and Organization of this Chapter 4
2 0 OVERVIEW OF WAFER CONTAMINATION ASPECTS 5
2 1 Types and Origins of Contaminants 5
2 2 Types of Semiconductor Wafers 7
2 3 Effects of Contaminants on Semiconductor Devices 8
2 4 Prevention of Contamination from Equipment
and Processing 10
2 5 Purity of Chemicals 11
2 6 Analytical Methods 14
3 0 OVERVIEW OF WAFER CLEANING TECHNOLOGY 15
3 1 Approaches for Attaining Clean Semiconductor
Wafers 15
3 2 Liquid Cleaning Methods 15
3 3 Wet-Chemical Cleaning Processes 17
3 4 Implementation of Wet-Chemical Cleaning
Processes 22
XI
xii Contents
3 5 Wafer Rinsing, Drying, and Storing 24
3 6 Vapor-Phase Cleaning Methods 25
4 0 EVOLUTION OF WAFER CLEANING SCIENCE AND
TECHNOLOGY 28
4 1 Period from 1950 to 1960 28
4 2 Period from 1961 to 1971 29
4 3 Period from 1972 to 1989 44
4 4 Period of October 1989 to Mid-1992 48
5 0 SUMMARY AND CONCLUSIONS 55
REFERENCES 57
2 Trace Chemical Contamination on
Silicon Surfaces 68
Don Tolliver
1 0 INTRODUCTION 68
1 1 Horizontal and Vertical Dimensions 71
12A Manufacturing Issue, Not a Device Design
Specification 72
1 3 Cleaning Technology in the United States 72
1 4 Visibility of the Problem 73
1 5 Management of Surface Contamination in
Manufacturing 74
1 6 Gallium Arsenide and other lll-V Compound
Semiconductors 74
2 0 SOURCES OF CHEMICAL CONTAMINATION 75
2 1 Cleanroom Air 76
2 2 Cleanroom Personnel 76
2 3 Liquid Sources and Photolithographic Resists 76
2 4 Materials, Components, and Systems for
Process Liquids 83
2 5 Storage and Transport of Liquids and Chemicals 84
2 6 High-Purity Process Gases in the Semiconductor
Fab as a Source of Surface Contamination 85
2 7 Chemical Contamination from Thermal Process
Tools and Systems 91
2 8 Plasma Etch, Strip, and RIE Processing Tools 91
2 9 Wet Etching, Wet Cleaning, and Drying Equipment 94
2 10 Vacuum Processing Equipment 99
2 11 Wafer Handling and Storage Systems 100
3 0 KILLER CONTAMINANTS 101
3 1 Particle Concentrations -jq-j
3 2 Trace Metal Concentrations 103
Contents xiii
3 3 Killers Other than Particles and Metallics 103
4 0 FUTURE DIRECTIONS AND NEEDS 103
4 1 Equipment Design 103
4 2 Material Specifications 104
4 3 Fabrication and Installation 104
4 4 Characterization and Evaluation 104
4 5 Safety and Environmental Requirements 104
4 6 Directions in Research and Development 105
REFERENCES 106
Part II Wet-Chemical Processes
3 Aqueous Cleaning Processes Ill
Don C Burkman, Donald Deal,
Donald C Grant, and Charlie A Peterson
1 0 INTRODUCTION TO AQUEOUS CLEANING 111
1 1 Advantages of Aqueous Cleaning: 112
1 2 Disadvantages of Aqueous Cleaning: 112
2 0 CONSIDERATIONS OF CONTAMINANTS AND
SUBSTRATES 113
2 1 Surface Effects-Forces Holding the Contaminants 114
2 2 Chemical Adsorption 115
2 3 Physical Adsorption 115
3 0 FACTORS AFFECTING AQUEOUS CLEANING 118
3 1 Predicting and Enhancing Contaminant Solubility 118
3 2 Etching as a Means of Contaminant Removal 119
4 0 CLEANING CHEMISTRIES 120
5 0 AN EXAMPLE OF AN AQUEOUS CHEMICAL
CLEANING PROCESS 122
5 1 Organic Removal 122
5 2 Native Oxide Removal 122
5 3 Particle Removal With Simultaneous Oxide
Regrowth 123
5 4 Metal Removal 123
6 0 EFFECTS OF PROCESS VARIABLES ON AQUEOUS
CHEMICAL CLEANING 124
6 1 The Effect of Changing the Sequence of the
Chemical Cleaning Steps 124
6 2 The Effect of Concentration 127
6 3 The Effect of Temperature 127
6 4 Wetting 128
xiv Contents
6 5 The Effect of Solution Degradation 130
6 6 Carrier Effects 131
7 0 SEMICONDUCTOR WAFER DRYING 131
7 1 Centrifugal Drying 131
7 2 Vapor Drying 133
7 3 Hot Water Drying Techniques 134
8 0 EQUIPMENT USED FOR AQUEOUS CLEANING 134
8 1 General Design Considerations 134
8 2 Immersion Processors 136
8 3 Spray Processors 137
8 4 Ultrasonics and Megasonics 141
8 5 Liquid Displacement Processors 142
8 6 Point of Use Chemicals 143
8 7 Single-Wafer Cleaners 143
8 8 Alternative Cleaning Techniques 144
8 9 Combined Wet/Dry Systems 144
8 10 Rinsing and Drying 145
9 0 CONCLUSION 146
REFERENCES 147
4 Particle Deposition and Adhesion 152
Robert P Donovan and Venu B Menon
1 0 INTRODUCTION 152
2 0 AEROSOL PARTICLE DEPOSITION 153
2 1 Thermal Effects 164
3 0 PARTICLE DEPOSITION FROM A LIQUID BATH 167
3 1 Comparison of Hydrosol and Aerosol Particle
Deposition Mechanisms 168
3 2 Concepts of Colloid Chemistry 170
3 3 Zeta Potential and Particle Deposition 175
3 4 Effect of Ionic Strength on Electric Double Layer
Repulsion 180
3 5 Van der Waals Attraction 181
4 0 DLVO THEORY 182
4 1 The Effect of Solution pH on Colloid Deposition 184
4 2 Hydrophobic Surfaces 187
4 3 EDR Effects in the Filtration of Colloids 188
5 0 PARTICLE ADHESION 190
5 1 Other Adhesive Forces 194
6 0 SUMMARY 195
REFERENCES^ 196
Contents xv
Part III Dry Cleaning Processes
5 Overview of Dry Wafer Cleaning
Processes 201
Jerzy Ruzyllo
1 0 INTRODUCTION 201
2 0 LIMITATIONS OF WET WAFER CLEANING
PROCESSES 202
3 0 ANTICIPATED ROLE OF DRY WAFER CLEANING
IN 1C FABRICATION 203
4 0 REQUIREMENTS OF DRY WAFER CLEANING
TECHNOLOGY 205
5 0 MECHANISMS OF DRY WAFER CLEANING 206
6 0 GENERAL OUTLINE OF DRY WAFER CLEANING
METHODS 210
7 0 REVIEW OF EXPERIMENTAL RESULTS 213
7 1 Cleaning Through Physical Interactions 213
7 2 Thermally Enhanced Cleaning 214
7 3 Vapor Phase Cleaning 216
7 4 Photochemically-Enhanced Cleaning 219
7 5 Plasma-Enhanced Cleaning 224
8 0 SUMMARY 227
REFERENCES 228
6 Ultraviolet-Ozone Cleaning Of
Semiconductor Surfaces 233
John R Vig
1 0 INTRODUCTION 233
2 0 HISTORY OF UV/OZONE CLEANING 233
3 0 VARIABLES OF UV/OZONE CLEANING 237
3 1 Wavelengths Emitted by the UV Sources 237
3 2 Distance Between the Sample and UV Source 240
3 3 Contaminants 241
3 4 Precleaning 242
3 5 Substrate 243
3 6 Rate Enhancement Techniques 244
4 0 MECHANISM OF UV/OZONE CLEANING 246
5 0 UV/OZONE CLEANING IN VACUUM SYSTEMS 248
6 0 SAFETY CONSIDERATIONS 249
7 0 CONSTRUCTION OF A UV/OZONE CLEANING
FACILITY 251
xvi Contents
8 0 APPLICATIONS 253
8 1 Cleaning of Silicon Surfaces 253
8 2 Cleaning of Other Semiconductor Surfaces 256
8 3 Other Applications 257
9 0 EFFECTS OTHER THAN CLEANING 260
9 1 Oxidation 260
9 2 UV-Enhanced Outgassing 261
9 3 Other Surface/Interface Effects 261
9 4 Etching 262
10 0 SUMMARY AND CONCLUSIONS 262
REFERENCES 263
7 Vapor Phase Wafer Cleaning Technology 274
Bruce E Deal and C Robert Helms
1 0 INTRODUCTION AND BACKGROUND 274
1 1 General 274
1 2 Aqueous Cleaning Processes 276
1 3 “Dry Cleaning Processes 276
1 4 Other Types of Cleaning Processes 277
2 0 VAPOR CLEANING 277
2 1 Historical 277
2 2 Advantages of Vapor Cleaning 280
2 3 Current Vapor Cleaning Systems 282
3 0 OXIDE ETCHING 288
3 1 Thermal Oxides 288
3 2 Native/Chemical Oxides 293
3 3 Deposited Oxides 296
4 0 MECHANISM OF OXIDE ETCHING 296
4 1 Background 296
4 2 Important Aqueous Chemistry 298
4 3 Vapor Phase Mechanisms 303
4 4 Summary 309
5 0 IMPURITY REMOVAL 310
5 1 Types of Contamination 310
5 2 Evaluation Techniques 310
5 3 Particles and Residues 311
5 4 Organic Contaminants 313
5 5 Metallic Contaminants 314
5 6 Mechanisms of Metal Impurity Removal 316
6 0 DEVICE APPLICATIONS 318
6 1 General Effects of Impurities on Device Properties 318
6 2 Junction Characteristics 318
Contents xvii
6 3 Contact/Interface Properties 318
6 4 Gate Oxide Properties 321
7 0 INTEGRATED PROCESSING 324
7 1 Concept 324
7 2 Advantages and Disadvantages of Integrated
Processing 325
7 3 Requirements/Considerations of Integrated
Processing 326
7 4 Applications Involving Vapor Cleaning 327
8 0 CONCLUSIONS AND SUMMARY 329
REFERENCES 330
8 Remote Plasma Processing for Silicon
Wafer Cleaning 340
Ronald A Rudder, Raymond E Thomas,
and Robert J Nemanich
1 0 INTRODUCTION 340
2 0 PLASMA CLEANING CRITERIA 343
2 1 Cleaning for Low-Temperature Epitaxial Growth 344
2 2 Cleaning for Interface Formation with
Deposited-Si02 on Silicon 345
3 0 MECHANISMS 346
4 0 PROCESSING EQUIPMENT 351
5 0 WAFER PROCESSING 356
5 1 Ex Situ Processing 356
5 2 In Situ Processing: Remote RF Sources 358
5 3 In Situ Processing: ECR Sources 366
5 4 In Situ Processing: Remote Microwave Sources 369
6 0 CONCLUSIONS 371
REFERENCES 372
Part IV Analytical and Control Aspects
9 Measurement and Control of Particulate
Contaminants 379
Venu B Menon and Robert P Donovan
1 0 INTRODUCTION 379
1 1 Scope 380
1 2 Chapter Organization 380
2 0 PARTICLE MEASUREMENT IN LIQUIDS 380
xviii Contents
2 1 Optical Light Scattering 381
2 2 Nonvolatile Residue Monitor 383
2 3 Microscopy 384
2 4 Particles on Wafers 385
3 0 PARTICLE CONTROL IN CHEMICALS 386
3 1 Incoming Chemical Quality 387
3 2 Dl Water Quality 390
3 3 Chemical Distribution System 394
3 4 Point Of Use Filtration 397
3 5 Chemical Reprocessing 399
4 0 PARTICLE CONTROL DURING PROCESSING 400
4 1 Effect of Process Chemistry 400
4 2 Process System Configuration 405
4 3 Rinsing and Drying 410
4 4 Gas/Vapor Phase Cleaning 414
5 0 POST-PROCESSING PARTICLE REMOVAL
TECHNOLOGIES 415
5 1 Brush Scrubbing 418
5 2 Hydrodynamic Cleaning 418
5 3 Ultrasonic Cleaning 420
5 4 Megasonic Cleaning 421
5 5 Other Techniques 424
6 0 PARTICLE MONITORING PRACTICES 425
7 0 CONCLUSIONS 427
REFERENCES 428
10 Silicon Surface Chemical Composition
and Morphology 433
Gregg S Higashi and Yves J Chabal
1 0 INTRODUCTION 433
2 0 OXIDE-TERMINATED SURFACES 435
2 1 Introduction 435
2 2 Chemical Composition 436
2 3 Structure and Morphology 441
2 4 Contamination Issues 445
3 0 HYDROGEN-TERMINATED SURFACES 446
3 1 Chemical Composition of HF Treated
Surfaces (Wet) 446
3 2 Structure and Morphology 458
3 3 Contamination Issues 484
4 0 SUMMARY AND FUTURE DIRECTIONS ZZZZZZZ 487
REFERENCES 490
Contents xix
11 Analysis and Control of Electrically Active
Contaminants by Surface Charge Analysis 497
Emil Kamieniecki and G (John) Foggiato
1 0 INTRODUCTION TO SURFACE CHARGE ANALYSIS
TECHNIQUE 497
2 0 PRINCIPLES OF OPERATION 498
2 1 Basic Relationships 500
2 2 Overview of Measured Parameters 510
3 0 SURFACE CHARGE CHARACTERIZATION OF
CLEANING PROCESSES 516
3 1 HF Etch 519
3 2 RCA Standard Clean 1 (SC-1) 522
3 3 RCA Standard Clean 2 (SC-2) 525
3 4 Effects of Metallic Contaminants 527
3 5 Rinsing and Drying 529
4 0 INCOMING WAFER SURFACE QUALITY
MONITORING 531
5 0 SUMMARY 533
REFERENCES 534
12 Ultratrace Impurity Analysis of Silicon Surfaces
by SIMS and TXRF Methods 537
Richard S Hockett
1 0 INTRODUCTION 537
2 0 ANALYTICAL PROBLEM 537
2 1 Relevant Contamination Levels 537
2 2 Analysis Depth and Number of Atoms 540
2 3 Quantification 540
2 4 Composition of Clean Native Oxide 540
3 0 AVAILABLE ANALYTICAL TECHNIQUES 540
3 1 Electron Spectroscopy for Chemical Analysis 541
3 2 Auger Electron Spectroscopy 543
3 3 Rutherford Backscattering Spectrometry 545
3 4 Laser Ionization Mass Spectrometry 546
3 5 X-Ray Fluorescence Spectroscopy 547
3 6 High-Resolution Electron Energy Loss
Spectroscopy 547
3 7 Infrared Spectroscopy 547
3 8 VPD/AAS 548
3 9 Secondary Ion Mass Spectrometry 551
3 10 Total Reflection X-Ray Fluorescence Spectroscopy 551
xx Contents
4 0 PRINCIPLES AND METHODOLOGY OF
SIMS ANALYSIS 552
4 1 Principles of SIMS 552
4 2 Static SIMS 553
4 3 Dynamic SIMS 558
4 4 Polyencapsulation/SIMS 560
5 0 TXRF ANALYSIS 564
5 1 Principles of TXRF 564
5 2 Quantification 569
5 3 Quantitative Comparisons 572
5 4 Angle Properties 572
5 5 Monochromatic TXRF 575
5 6 Characterization of Cleaning Processes by TXRF 577
6 0 FUTURE ANALYTICAL TECHNOLOGY 583
6 1 VPD Chemistries 584
6 2 VPD ICP/MS 585
6 3 VPD/TXRF 585
6 4 VPD/SIMS 586
6 5 TOF-SIMS 587
7 0 CONCLUSIONS 588
REFERENCES 588
Part V Conclusions and Future Directions
13 Future Directions 595
Werner Kern
1 0 INTRODUCTION 595
2 0 PURITY REQUIREMENTS FOR ULTRACLEAN
SILICON WAFERS 596
3 0 FUTURE OF LIQUID-PHASE WAFER CLEANING
PROCESSES 597
4 0 FUTURE OF GAS-PHASE WAFER CLEANING
PROCESSES 598
5 0 FUTURE NEEDS OF PROCESSING CHEMICALS 599
6 0 WAFER CLEANING EQUIPMENT 602
7 0 CONTROL OF MICROCONTAMINATION 603
8 0 SUMMARY AND CONCLUSIONS 606
REFERENCES (July through December 1992) 607
Index 611
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Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials science and process technology series</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. 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| genre | (DE-588)4143413-4 Aufsatzsammlung gnd-content |
| genre_facet | Aufsatzsammlung |
| id | DE-604.BV009862837 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T17:42:11Z |
| institution | BVB |
| isbn | 0815513313 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-006530435 |
| oclc_num | 27976222 |
| open_access_boolean | |
| owner | DE-384 DE-29T DE-91G DE-BY-TUM DE-898 DE-BY-UBR DE-703 DE-706 |
| owner_facet | DE-384 DE-29T DE-91G DE-BY-TUM DE-898 DE-BY-UBR DE-703 DE-706 |
| physical | XX, 623 S. Ill., graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Noyes |
| record_format | marc |
| series2 | Materials science and process technology series |
| spelling | Handbook of semiconductor wafer cleaning technology science, technology, and applications ed. by Werner Kern Park Ridge, NJ Noyes 1993 XX, 623 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Materials science and process technology series The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field Its thirteen chapters were written by nineteen scientists who are recognized experts in each topic. The scope of this book is very broad, covering all aspects of wafer cleaning. Emphasis is on practical applications in the fab combined with authoritative scientific background information to provide a solid scientific basis for understanding the chemical and physical processes involved in cleaning and in the analytical methods of testing and evaluation The depth and breadth of the material should appeal to those new in the field as well as to experienced professionals. The volume is intended to serve as a handbook for practitioners and professionals in the field of semiconductor microelectronics, including fab engineers, scientists and technicians. It should also prove useful to manufacturers of processing equipment, persons concerned with contamination control and analysis, and students attending advanced or specialized technical courses Semicondutores larpcal Semiconductor wafers Cleaning Wafer (DE-588)4294605-0 gnd rswk-swf Oberflächenreinigung (DE-588)4204243-4 gnd rswk-swf Halbleiter (DE-588)4022993-2 gnd rswk-swf Scheibe (DE-588)4052190-4 gnd rswk-swf Reinigung (DE-588)4049250-3 gnd rswk-swf (DE-588)4143413-4 Aufsatzsammlung gnd-content Wafer (DE-588)4294605-0 s Reinigung (DE-588)4049250-3 s DE-604 Oberflächenreinigung (DE-588)4204243-4 s Halbleiter (DE-588)4022993-2 s 1\p DE-604 Scheibe (DE-588)4052190-4 s 2\p DE-604 Kern, Werner Sonstige oth HEBIS Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006530435&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Handbook of semiconductor wafer cleaning technology science, technology, and applications Semicondutores larpcal Semiconductor wafers Cleaning Wafer (DE-588)4294605-0 gnd Oberflächenreinigung (DE-588)4204243-4 gnd Halbleiter (DE-588)4022993-2 gnd Scheibe (DE-588)4052190-4 gnd Reinigung (DE-588)4049250-3 gnd |
| subject_GND | (DE-588)4294605-0 (DE-588)4204243-4 (DE-588)4022993-2 (DE-588)4052190-4 (DE-588)4049250-3 (DE-588)4143413-4 |
| title | Handbook of semiconductor wafer cleaning technology science, technology, and applications |
| title_auth | Handbook of semiconductor wafer cleaning technology science, technology, and applications |
| title_exact_search | Handbook of semiconductor wafer cleaning technology science, technology, and applications |
| title_full | Handbook of semiconductor wafer cleaning technology science, technology, and applications ed. by Werner Kern |
| title_fullStr | Handbook of semiconductor wafer cleaning technology science, technology, and applications ed. by Werner Kern |
| title_full_unstemmed | Handbook of semiconductor wafer cleaning technology science, technology, and applications ed. by Werner Kern |
| title_short | Handbook of semiconductor wafer cleaning technology |
| title_sort | handbook of semiconductor wafer cleaning technology science technology and applications |
| title_sub | science, technology, and applications |
| topic | Semicondutores larpcal Semiconductor wafers Cleaning Wafer (DE-588)4294605-0 gnd Oberflächenreinigung (DE-588)4204243-4 gnd Halbleiter (DE-588)4022993-2 gnd Scheibe (DE-588)4052190-4 gnd Reinigung (DE-588)4049250-3 gnd |
| topic_facet | Semicondutores Semiconductor wafers Cleaning Wafer Oberflächenreinigung Halbleiter Scheibe Reinigung Aufsatzsammlung |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006530435&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT kernwerner handbookofsemiconductorwafercleaningtechnologysciencetechnologyandapplications |